JPWO2024116861A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024116861A5 JPWO2024116861A5 JP2024526893A JP2024526893A JPWO2024116861A5 JP WO2024116861 A5 JPWO2024116861 A5 JP WO2024116861A5 JP 2024526893 A JP2024526893 A JP 2024526893A JP 2024526893 A JP2024526893 A JP 2024526893A JP WO2024116861 A5 JPWO2024116861 A5 JP WO2024116861A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- curable resin
- composition according
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 125000006353 oxyethylene group Chemical group 0.000 claims 1
- -1 polysiloxane Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000007870 radical polymerization initiator Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 125000005504 styryl group Chemical group 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022190124 | 2022-11-29 | ||
| JP2022190124 | 2022-11-29 | ||
| JP2023140958 | 2023-08-31 | ||
| JP2023140958 | 2023-08-31 | ||
| PCT/JP2023/041194 WO2024116861A1 (ja) | 2022-11-29 | 2023-11-16 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024116861A1 JPWO2024116861A1 (https=) | 2024-06-06 |
| JPWO2024116861A5 true JPWO2024116861A5 (https=) | 2024-10-30 |
| JP7632753B2 JP7632753B2 (ja) | 2025-02-19 |
Family
ID=91323554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024526893A Active JP7632753B2 (ja) | 2022-11-29 | 2023-11-16 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20260085145A1 (https=) |
| EP (1) | EP4628517A1 (https=) |
| JP (1) | JP7632753B2 (https=) |
| KR (1) | KR20250113392A (https=) |
| CN (1) | CN120225581A (https=) |
| TW (1) | TW202436411A (https=) |
| WO (1) | WO2024116861A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6461081A (en) | 1987-09-01 | 1989-03-08 | Japan Res Dev Corp | Distributed-feedback type semiconductor laser and manufacture thereof |
| JP2851019B2 (ja) | 1990-09-28 | 1999-01-27 | 日本電信電話株式会社 | 全フッ素化ポリイミド，全フッ素化ポリアミド酸およびそれらの製造方法 |
| JP3879109B2 (ja) | 1997-08-27 | 2007-02-07 | 日立化成工業株式会社 | 光学接着剤及びこれを用いた光学部品 |
| DE19932629A1 (de) | 1999-07-13 | 2001-01-18 | Fraunhofer Ges Forschung | Organisch modifizierte, lagerstabile, UV-härtbare, NIR-durchlässige und in Schichtdicken von 1 bis 150 mum fotostrukturierbare Kieselsäurepolykondensate, deren Herstellung und deren Verwendung |
| JP5710356B2 (ja) * | 2011-04-18 | 2015-04-30 | 日本化薬株式会社 | 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物 |
| JP5980626B2 (ja) * | 2011-08-31 | 2016-08-31 | 三洋化成工業株式会社 | 活性エネルギー線硬化性樹脂組成物 |
| JP6135918B2 (ja) * | 2013-04-19 | 2017-05-31 | Dic株式会社 | 活性エネルギー線硬化性組成物及びそれを使用したインクジェット記録用インク組成物 |
| JP6619993B2 (ja) * | 2014-11-17 | 2019-12-11 | 三洋化成工業株式会社 | 活性エネルギー線硬化性組成物およびその硬化物 |
| WO2017038040A1 (ja) | 2015-09-01 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | 光導波路用組成物、光導波路用ドライフィルム、及び光導波路 |
| JP6919308B2 (ja) * | 2017-04-26 | 2021-08-18 | Dic株式会社 | （メタ）アクリロイル基含有樹脂及び積層フィルム |
| CN115210853B (zh) * | 2020-02-27 | 2025-06-03 | Dic株式会社 | 层间绝缘膜制造用涂布组合物、层间绝缘膜、及半导体元件、以及层间绝缘膜的制造方法 |
| EP4488304A1 (en) * | 2022-03-28 | 2025-01-08 | Mitsui Chemicals, Inc. | Photosetting composition, three-dimensionally shaped article, mold, method for manufacturing cured product, and method for manufacturing plate denture |
-
2023
- 2023-11-13 TW TW112143724A patent/TW202436411A/zh unknown
- 2023-11-16 US US19/110,323 patent/US20260085145A1/en active Pending
- 2023-11-16 CN CN202380079242.1A patent/CN120225581A/zh active Pending
- 2023-11-16 WO PCT/JP2023/041194 patent/WO2024116861A1/ja not_active Ceased
- 2023-11-16 KR KR1020257012161A patent/KR20250113392A/ko active Pending
- 2023-11-16 EP EP23897512.2A patent/EP4628517A1/en active Pending
- 2023-11-16 JP JP2024526893A patent/JP7632753B2/ja active Active