JPWO2024116851A5 - - Google Patents

Info

Publication number
JPWO2024116851A5
JPWO2024116851A5 JP2024561345A JP2024561345A JPWO2024116851A5 JP WO2024116851 A5 JPWO2024116851 A5 JP WO2024116851A5 JP 2024561345 A JP2024561345 A JP 2024561345A JP 2024561345 A JP2024561345 A JP 2024561345A JP WO2024116851 A5 JPWO2024116851 A5 JP WO2024116851A5
Authority
JP
Japan
Prior art keywords
thickness direction
semiconductor device
heat dissipation
substrate
dissipation member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024561345A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024116851A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/041077 external-priority patent/WO2024116851A1/ja
Publication of JPWO2024116851A1 publication Critical patent/JPWO2024116851A1/ja
Publication of JPWO2024116851A5 publication Critical patent/JPWO2024116851A5/ja
Pending legal-status Critical Current

Links

JP2024561345A 2022-11-28 2023-11-15 Pending JPWO2024116851A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022188959 2022-11-28
PCT/JP2023/041077 WO2024116851A1 (ja) 2022-11-28 2023-11-15 半導体装置および電力変換ユニット

Publications (2)

Publication Number Publication Date
JPWO2024116851A1 JPWO2024116851A1 (https=) 2024-06-06
JPWO2024116851A5 true JPWO2024116851A5 (https=) 2025-08-06

Family

ID=91323652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024561345A Pending JPWO2024116851A1 (https=) 2022-11-28 2023-11-15

Country Status (3)

Country Link
US (1) US20250285932A1 (https=)
JP (1) JPWO2024116851A1 (https=)
WO (1) WO2024116851A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042534A1 (ja) * 2024-08-20 2026-02-26 ローム株式会社 半導体モジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4211499B2 (ja) * 2003-06-06 2009-01-21 日本軽金属株式会社 金属部材接合方法
WO2011061779A1 (ja) * 2009-11-17 2011-05-26 三菱電機株式会社 放熱機器及び放熱機器の製造方法
WO2013114647A1 (ja) * 2012-01-31 2013-08-08 三菱電機株式会社 半導体装置とその製造方法
US9892992B2 (en) * 2013-09-27 2018-02-13 Mitsubishi Electric Corporation Swaged heat sink and heat sink integrated power module
US11152280B2 (en) * 2016-11-24 2021-10-19 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
JP7555261B2 (ja) * 2020-12-22 2024-09-24 日立Astemo株式会社 電気回路体および電力変換装置

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