JPWO2024111461A5 - - Google Patents
Info
- Publication number
- JPWO2024111461A5 JPWO2024111461A5 JP2024560088A JP2024560088A JPWO2024111461A5 JP WO2024111461 A5 JPWO2024111461 A5 JP WO2024111461A5 JP 2024560088 A JP2024560088 A JP 2024560088A JP 2024560088 A JP2024560088 A JP 2024560088A JP WO2024111461 A5 JPWO2024111461 A5 JP WO2024111461A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding resin
- composition according
- polymer particles
- porous polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022188706 | 2022-11-25 | ||
| PCT/JP2023/040829 WO2024111461A1 (ja) | 2022-11-25 | 2023-11-13 | 成形用樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111461A1 JPWO2024111461A1 (https=) | 2024-05-30 |
| JPWO2024111461A5 true JPWO2024111461A5 (https=) | 2025-08-01 |
Family
ID=91195615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024560088A Pending JPWO2024111461A1 (https=) | 2022-11-25 | 2023-11-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260098149A1 (https=) |
| JP (1) | JPWO2024111461A1 (https=) |
| CN (1) | CN119183467A (https=) |
| TW (1) | TW202428687A (https=) |
| WO (1) | WO2024111461A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003198248A (ja) * | 2001-12-26 | 2003-07-11 | Sharp Corp | アンテナ一体型パッケージ |
| WO2013129250A1 (ja) * | 2012-02-29 | 2013-09-06 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置及び有機ｅｌ表示装置 |
| JP7388160B2 (ja) * | 2019-12-03 | 2023-11-29 | 株式会社レゾナック | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
| JP7388235B2 (ja) * | 2020-02-20 | 2023-11-29 | 味の素株式会社 | 樹脂組成物 |
| KR102818863B1 (ko) * | 2020-12-17 | 2025-06-10 | 세키스이가세이힝코교가부시키가이샤 | 반도체 봉지용 수지 조성물, 언더필, 몰드 수지, 및 반도체 패키지 |
-
2023
- 2023-11-13 JP JP2024560088A patent/JPWO2024111461A1/ja active Pending
- 2023-11-13 US US18/861,581 patent/US20260098149A1/en active Pending
- 2023-11-13 CN CN202380037616.3A patent/CN119183467A/zh active Pending
- 2023-11-13 WO PCT/JP2023/040829 patent/WO2024111461A1/ja not_active Ceased
- 2023-11-21 TW TW112144856A patent/TW202428687A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2022124396A5 (https=) | ||
| JPWO2023190419A5 (https=) | ||
| JP2009544768A5 (https=) | ||
| CN110797311B (zh) | 半导体封装件及制造该半导体封装件的方法 | |
| CN103320022B (zh) | 用于半导体芯片封装的低模量丙烯酸酯导电胶及制备方法 | |
| JP2005502191A5 (https=) | ||
| RU2015111649A (ru) | Порошковые эпоксидные композиции для покрытий, способы и изделия | |
| JP2024096265A5 (https=) | ||
| SG10201406428QA (en) | Semiconductor device | |
| JP2009513019A5 (https=) | ||
| JP2021191877A5 (https=) | ||
| CN104332457A (zh) | 高密度IO互连PoP堆叠封装结构及其制造工艺 | |
| JPWO2024111461A5 (https=) | ||
| JP2025013531A5 (https=) | ||
| JP2024144537A5 (https=) | ||
| JPWO2024100934A5 (https=) | ||
| JP2023159356A5 (https=) | ||
| CN109742034A (zh) | 一种封装结构、封装方法及在封装方法中使用的模板 | |
| JP2023067951A5 (https=) | ||
| JP2002134531A5 (ja) | 半導体素子搭載用接着フィルム | |
| JP2005306967A5 (https=) | ||
| EP1781064A4 (en) | MEMBRANE FOR A SPEAKER | |
| JPWO2023238950A5 (https=) | ||
| JP2010260924A5 (https=) | ||
| JPWO2023032971A5 (https=) |