JPWO2024111058A1 - - Google Patents
Info
- Publication number
- JPWO2024111058A1 JPWO2024111058A1 JP2024559772A JP2024559772A JPWO2024111058A1 JP WO2024111058 A1 JPWO2024111058 A1 JP WO2024111058A1 JP 2024559772 A JP2024559772 A JP 2024559772A JP 2024559772 A JP2024559772 A JP 2024559772A JP WO2024111058 A1 JPWO2024111058 A1 JP WO2024111058A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/043190 WO2024111058A1 (ja) | 2022-11-22 | 2022-11-22 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111058A1 true JPWO2024111058A1 (https=) | 2024-05-30 |
| JPWO2024111058A5 JPWO2024111058A5 (https=) | 2025-02-17 |
Family
ID=91195888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024559772A Pending JPWO2024111058A1 (https=) | 2022-11-22 | 2022-11-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250372496A1 (https=) |
| JP (1) | JPWO2024111058A1 (https=) |
| CN (1) | CN120202541A (https=) |
| DE (1) | DE112022008031T5 (https=) |
| WO (1) | WO2024111058A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245171A (ja) * | 2005-03-02 | 2006-09-14 | Toshiba Corp | 電子部品モジュール |
| JP2007088030A (ja) * | 2005-09-20 | 2007-04-05 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2009105267A (ja) * | 2007-10-24 | 2009-05-14 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
| JP2013197560A (ja) * | 2012-03-23 | 2013-09-30 | Hitachi Ltd | パワー半導体モジュール |
| JP2018190930A (ja) * | 2017-05-11 | 2018-11-29 | 三菱電機株式会社 | パワー半導体モジュール及びその製造方法並びに電力変換装置 |
-
2022
- 2022-11-22 WO PCT/JP2022/043190 patent/WO2024111058A1/ja not_active Ceased
- 2022-11-22 CN CN202280101756.8A patent/CN120202541A/zh active Pending
- 2022-11-22 JP JP2024559772A patent/JPWO2024111058A1/ja active Pending
- 2022-11-22 US US18/873,591 patent/US20250372496A1/en active Pending
- 2022-11-22 DE DE112022008031.0T patent/DE112022008031T5/de active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245171A (ja) * | 2005-03-02 | 2006-09-14 | Toshiba Corp | 電子部品モジュール |
| JP2007088030A (ja) * | 2005-09-20 | 2007-04-05 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2009105267A (ja) * | 2007-10-24 | 2009-05-14 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
| JP2013197560A (ja) * | 2012-03-23 | 2013-09-30 | Hitachi Ltd | パワー半導体モジュール |
| JP2018190930A (ja) * | 2017-05-11 | 2018-11-29 | 三菱電機株式会社 | パワー半導体モジュール及びその製造方法並びに電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120202541A (zh) | 2025-06-24 |
| US20250372496A1 (en) | 2025-12-04 |
| WO2024111058A1 (ja) | 2024-05-30 |
| DE112022008031T5 (de) | 2025-11-06 |
Similar Documents
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