JPWO2024070528A1 - - Google Patents
Info
- Publication number
- JPWO2024070528A1 JPWO2024070528A1 JP2024549946A JP2024549946A JPWO2024070528A1 JP WO2024070528 A1 JPWO2024070528 A1 JP WO2024070528A1 JP 2024549946 A JP2024549946 A JP 2024549946A JP 2024549946 A JP2024549946 A JP 2024549946A JP WO2024070528 A1 JPWO2024070528 A1 JP WO2024070528A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022158200 | 2022-09-30 | ||
| JP2022158200 | 2022-09-30 | ||
| PCT/JP2023/032356 WO2024070528A1 (ja) | 2022-09-30 | 2023-09-05 | 配線基板、電子装置、及び電子モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070528A1 true JPWO2024070528A1 (https=) | 2024-04-04 |
| JPWO2024070528A5 JPWO2024070528A5 (https=) | 2025-04-17 |
| JP7784565B2 JP7784565B2 (ja) | 2025-12-11 |
Family
ID=90477281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549946A Active JP7784565B2 (ja) | 2022-09-30 | 2023-09-05 | 配線基板、電子装置、及び電子モジュール |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7784565B2 (https=) |
| CN (1) | CN119948620A (https=) |
| TW (1) | TWI895797B (https=) |
| WO (1) | WO2024070528A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015122351A (ja) * | 2013-12-20 | 2015-07-02 | 京セラ株式会社 | 電子部品搭載基板および回路基板 |
| JP2018049988A (ja) * | 2016-09-23 | 2018-03-29 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
| WO2019146699A1 (ja) * | 2018-01-24 | 2019-08-01 | 京セラ株式会社 | 配線基板、電子装置及び電子モジュール |
| JP2021034612A (ja) * | 2019-08-27 | 2021-03-01 | 京セラ株式会社 | 電子部品パッケージおよび電子装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3860000B2 (ja) * | 2001-09-07 | 2006-12-20 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2023
- 2023-09-05 JP JP2024549946A patent/JP7784565B2/ja active Active
- 2023-09-05 CN CN202380069437.8A patent/CN119948620A/zh active Pending
- 2023-09-05 WO PCT/JP2023/032356 patent/WO2024070528A1/ja not_active Ceased
- 2023-09-12 TW TW112134658A patent/TWI895797B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015122351A (ja) * | 2013-12-20 | 2015-07-02 | 京セラ株式会社 | 電子部品搭載基板および回路基板 |
| JP2018049988A (ja) * | 2016-09-23 | 2018-03-29 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
| WO2019146699A1 (ja) * | 2018-01-24 | 2019-08-01 | 京セラ株式会社 | 配線基板、電子装置及び電子モジュール |
| JP2021034612A (ja) * | 2019-08-27 | 2021-03-01 | 京セラ株式会社 | 電子部品パッケージおよび電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024070528A1 (ja) | 2024-04-04 |
| CN119948620A (zh) | 2025-05-06 |
| TWI895797B (zh) | 2025-09-01 |
| JP7784565B2 (ja) | 2025-12-11 |
| TW202428079A (zh) | 2024-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
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|
| A621 | Written request for application examination |
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| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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|
| A61 | First payment of annual fees (during grant procedure) |
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| R150 | Certificate of patent or registration of utility model |
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