CN119948620A - 布线基板、电子装置以及电子模块 - Google Patents

布线基板、电子装置以及电子模块 Download PDF

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Publication number
CN119948620A
CN119948620A CN202380069437.8A CN202380069437A CN119948620A CN 119948620 A CN119948620 A CN 119948620A CN 202380069437 A CN202380069437 A CN 202380069437A CN 119948620 A CN119948620 A CN 119948620A
Authority
CN
China
Prior art keywords
wiring
external electrode
view
electrode
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380069437.8A
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English (en)
Chinese (zh)
Inventor
松元佑弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN119948620A publication Critical patent/CN119948620A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN202380069437.8A 2022-09-30 2023-09-05 布线基板、电子装置以及电子模块 Pending CN119948620A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022158200 2022-09-30
JP2022-158200 2022-09-30
PCT/JP2023/032356 WO2024070528A1 (ja) 2022-09-30 2023-09-05 配線基板、電子装置、及び電子モジュール

Publications (1)

Publication Number Publication Date
CN119948620A true CN119948620A (zh) 2025-05-06

Family

ID=90477281

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380069437.8A Pending CN119948620A (zh) 2022-09-30 2023-09-05 布线基板、电子装置以及电子模块

Country Status (4)

Country Link
JP (1) JP7784565B2 (https=)
CN (1) CN119948620A (https=)
TW (1) TWI895797B (https=)
WO (1) WO2024070528A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3860000B2 (ja) * 2001-09-07 2006-12-20 Ｎｅｃエレクトロニクス株式会社 半導体装置およびその製造方法
JP2015122351A (ja) * 2013-12-20 2015-07-02 京セラ株式会社 電子部品搭載基板および回路基板
JP6780996B2 (ja) * 2016-09-23 2020-11-04 京セラ株式会社 配線基板、電子装置および電子モジュール
US11388819B2 (en) * 2018-01-24 2022-07-12 Kyocera Corporation Wiring board, electronic device, and electronic module
JP7166997B2 (ja) * 2019-08-27 2022-11-08 京セラ株式会社 電子部品パッケージおよび電子装置

Also Published As

Publication number Publication date
JPWO2024070528A1 (https=) 2024-04-04
WO2024070528A1 (ja) 2024-04-04
TWI895797B (zh) 2025-09-01
JP7784565B2 (ja) 2025-12-11
TW202428079A (zh) 2024-07-01

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