JP7784565B2 - 配線基板、電子装置、及び電子モジュール - Google Patents

配線基板、電子装置、及び電子モジュール

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Publication number
JP7784565B2
JP7784565B2 JP2024549946A JP2024549946A JP7784565B2 JP 7784565 B2 JP7784565 B2 JP 7784565B2 JP 2024549946 A JP2024549946 A JP 2024549946A JP 2024549946 A JP2024549946 A JP 2024549946A JP 7784565 B2 JP7784565 B2 JP 7784565B2
Authority
JP
Japan
Prior art keywords
external electrode
electrode
wiring
connection electrode
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024549946A
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English (en)
Japanese (ja)
Other versions
JPWO2024070528A1 (https=
JPWO2024070528A5 (https=
Inventor
佑弥 松元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2024070528A1 publication Critical patent/JPWO2024070528A1/ja
Publication of JPWO2024070528A5 publication Critical patent/JPWO2024070528A5/ja
Application granted granted Critical
Publication of JP7784565B2 publication Critical patent/JP7784565B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2024549946A 2022-09-30 2023-09-05 配線基板、電子装置、及び電子モジュール Active JP7784565B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022158200 2022-09-30
JP2022158200 2022-09-30
PCT/JP2023/032356 WO2024070528A1 (ja) 2022-09-30 2023-09-05 配線基板、電子装置、及び電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024070528A1 JPWO2024070528A1 (https=) 2024-04-04
JPWO2024070528A5 JPWO2024070528A5 (https=) 2025-04-17
JP7784565B2 true JP7784565B2 (ja) 2025-12-11

Family

ID=90477281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549946A Active JP7784565B2 (ja) 2022-09-30 2023-09-05 配線基板、電子装置、及び電子モジュール

Country Status (4)

Country Link
JP (1) JP7784565B2 (https=)
CN (1) CN119948620A (https=)
TW (1) TWI895797B (https=)
WO (1) WO2024070528A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122351A (ja) 2013-12-20 2015-07-02 京セラ株式会社 電子部品搭載基板および回路基板
JP2018049988A (ja) 2016-09-23 2018-03-29 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2019146699A1 (ja) 2018-01-24 2019-08-01 京セラ株式会社 配線基板、電子装置及び電子モジュール
JP2021034612A (ja) 2019-08-27 2021-03-01 京セラ株式会社 電子部品パッケージおよび電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3860000B2 (ja) * 2001-09-07 2006-12-20 Ｎｅｃエレクトロニクス株式会社 半導体装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122351A (ja) 2013-12-20 2015-07-02 京セラ株式会社 電子部品搭載基板および回路基板
JP2018049988A (ja) 2016-09-23 2018-03-29 京セラ株式会社 配線基板、電子装置および電子モジュール
WO2019146699A1 (ja) 2018-01-24 2019-08-01 京セラ株式会社 配線基板、電子装置及び電子モジュール
JP2021034612A (ja) 2019-08-27 2021-03-01 京セラ株式会社 電子部品パッケージおよび電子装置

Also Published As

Publication number Publication date
JPWO2024070528A1 (https=) 2024-04-04
WO2024070528A1 (ja) 2024-04-04
CN119948620A (zh) 2025-05-06
TWI895797B (zh) 2025-09-01
TW202428079A (zh) 2024-07-01

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