JPWO2024053390A1 - - Google Patents
Info
- Publication number
- JPWO2024053390A1 JPWO2024053390A1 JP2024545548A JP2024545548A JPWO2024053390A1 JP WO2024053390 A1 JPWO2024053390 A1 JP WO2024053390A1 JP 2024545548 A JP2024545548 A JP 2024545548A JP 2024545548 A JP2024545548 A JP 2024545548A JP WO2024053390 A1 JPWO2024053390 A1 JP WO2024053390A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
- H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022142276 | 2022-09-07 | ||
| JP2023030924 | 2023-03-01 | ||
| PCT/JP2023/030140 WO2024053390A1 (ja) | 2022-09-07 | 2023-08-22 | 研磨剤、研磨剤用添加液および研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053390A1 true JPWO2024053390A1 (https=) | 2024-03-14 |
Family
ID=90191075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545548A Pending JPWO2024053390A1 (https=) | 2022-09-07 | 2023-08-22 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250197676A1 (https=) |
| EP (1) | EP4585665A1 (https=) |
| JP (1) | JPWO2024053390A1 (https=) |
| KR (1) | KR20250060247A (https=) |
| CN (1) | CN119768483A (https=) |
| TW (1) | TW202411371A (https=) |
| WO (1) | WO2024053390A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025254017A1 (ja) * | 2024-06-04 | 2025-12-11 | Ａｇｃ株式会社 | 研磨剤、研磨剤用添加液、研磨方法、及び、半導体部品の製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112561A (ja) | 1997-04-28 | 1999-01-19 | Seimi Chem Co Ltd | 半導体用研磨剤および半導体用研磨剤の製造方法 |
| JP2001035818A (ja) | 1999-07-16 | 2001-02-09 | Seimi Chem Co Ltd | 半導体用研磨剤 |
| FR2906800B1 (fr) | 2006-10-09 | 2008-11-28 | Rhodia Recherches & Tech | Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage |
| US9434859B2 (en) * | 2013-09-24 | 2016-09-06 | Cabot Microelectronics Corporation | Chemical-mechanical planarization of polymer films |
| JP2016154208A (ja) * | 2015-02-12 | 2016-08-25 | 旭硝子株式会社 | 研磨剤、研磨方法および半導体集積回路装置の製造方法 |
| JP6878772B2 (ja) * | 2016-04-14 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | 研磨剤、研磨剤用貯蔵液及び研磨方法 |
| JP6878783B2 (ja) | 2016-07-19 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | 研磨剤、研磨剤用貯蔵液及び研磨方法 |
| JP7057662B2 (ja) | 2017-12-26 | 2022-04-20 | ニッタ・デュポン株式会社 | 研磨組成物、及び、研磨速度を調整する方法 |
| JPWO2020262628A1 (https=) * | 2019-06-27 | 2020-12-30 | ||
| JP2022142276A (ja) | 2021-03-16 | 2022-09-30 | キオクシア株式会社 | 磁気記憶装置、及び磁気記憶装置の製造方法 |
| JP7693454B2 (ja) | 2021-08-24 | 2025-06-17 | 株式会社三共 | 遊技機 |
-
2023
- 2023-08-22 KR KR1020257010447A patent/KR20250060247A/ko active Pending
- 2023-08-22 CN CN202380060788.2A patent/CN119768483A/zh active Pending
- 2023-08-22 WO PCT/JP2023/030140 patent/WO2024053390A1/ja not_active Ceased
- 2023-08-22 JP JP2024545548A patent/JPWO2024053390A1/ja active Pending
- 2023-08-22 EP EP23862929.9A patent/EP4585665A1/en active Pending
- 2023-08-30 TW TW112132749A patent/TW202411371A/zh unknown
-
2025
- 2025-03-05 US US19/070,728 patent/US20250197676A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024053390A1 (ja) | 2024-03-14 |
| TW202411371A (zh) | 2024-03-16 |
| EP4585665A1 (en) | 2025-07-16 |
| CN119768483A (zh) | 2025-04-04 |
| US20250197676A1 (en) | 2025-06-19 |
| KR20250060247A (ko) | 2025-05-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260209 |