JPWO2024038577A1 - - Google Patents

Info

Publication number
JPWO2024038577A1
JPWO2024038577A1 JP2024541371A JP2024541371A JPWO2024038577A1 JP WO2024038577 A1 JPWO2024038577 A1 JP WO2024038577A1 JP 2024541371 A JP2024541371 A JP 2024541371A JP 2024541371 A JP2024541371 A JP 2024541371A JP WO2024038577 A1 JPWO2024038577 A1 JP WO2024038577A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024541371A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024038577A1 publication Critical patent/JPWO2024038577A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2024541371A 2022-08-19 2022-08-19 Pending JPWO2024038577A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/031333 WO2024038577A1 (ja) 2022-08-19 2022-08-19 整流器

Publications (1)

Publication Number Publication Date
JPWO2024038577A1 true JPWO2024038577A1 (https=) 2024-02-22

Family

ID=89941728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541371A Pending JPWO2024038577A1 (https=) 2022-08-19 2022-08-19

Country Status (2)

Country Link
JP (1) JPWO2024038577A1 (https=)
WO (1) WO2024038577A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025234045A1 (ja) * 2024-05-09 2025-11-13 Ntt株式会社 信号復調器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04208072A (ja) * 1990-11-30 1992-07-29 Omron Corp 全波整流回路の半導体構造
JP2005175224A (ja) * 2003-12-11 2005-06-30 Nippon Telegr & Teleph Corp <Ntt> 電界型単電子箱多値メモリ回路およびその制御方法
JP2008113547A (ja) * 2006-10-06 2008-05-15 Semiconductor Energy Lab Co Ltd 整流回路、該整流回路を用いた半導体装置及びその駆動方法
JP2008161044A (ja) * 2006-11-29 2008-07-10 Semiconductor Energy Lab Co Ltd 整流回路、電源回路及び半導体装置
JP2009212499A (ja) * 2008-02-07 2009-09-17 Semiconductor Energy Lab Co Ltd 半導体装置
JP2012042216A (ja) * 2010-08-12 2012-03-01 Nippon Telegr & Teleph Corp <Ntt> センサ
JP2013005308A (ja) * 2011-06-20 2013-01-07 Seiko Epson Corp 混合器、送信機及び通信システム
WO2016158862A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 整流素子、その製造方法および無線通信装置
JP2017005040A (ja) * 2015-06-08 2017-01-05 日本電信電話株式会社 半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04208072A (ja) * 1990-11-30 1992-07-29 Omron Corp 全波整流回路の半導体構造
JP2005175224A (ja) * 2003-12-11 2005-06-30 Nippon Telegr & Teleph Corp <Ntt> 電界型単電子箱多値メモリ回路およびその制御方法
JP2008113547A (ja) * 2006-10-06 2008-05-15 Semiconductor Energy Lab Co Ltd 整流回路、該整流回路を用いた半導体装置及びその駆動方法
JP2008161044A (ja) * 2006-11-29 2008-07-10 Semiconductor Energy Lab Co Ltd 整流回路、電源回路及び半導体装置
JP2009212499A (ja) * 2008-02-07 2009-09-17 Semiconductor Energy Lab Co Ltd 半導体装置
JP2012042216A (ja) * 2010-08-12 2012-03-01 Nippon Telegr & Teleph Corp <Ntt> センサ
JP2013005308A (ja) * 2011-06-20 2013-01-07 Seiko Epson Corp 混合器、送信機及び通信システム
WO2016158862A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 整流素子、その製造方法および無線通信装置
JP2017005040A (ja) * 2015-06-08 2017-01-05 日本電信電話株式会社 半導体装置

Also Published As

Publication number Publication date
WO2024038577A1 (ja) 2024-02-22

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