JPWO2024034482A5 - - Google Patents

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Publication number
JPWO2024034482A5
JPWO2024034482A5 JP2024540411A JP2024540411A JPWO2024034482A5 JP WO2024034482 A5 JPWO2024034482 A5 JP WO2024034482A5 JP 2024540411 A JP2024540411 A JP 2024540411A JP 2024540411 A JP2024540411 A JP 2024540411A JP WO2024034482 A5 JPWO2024034482 A5 JP WO2024034482A5
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JP
Japan
Prior art keywords
bonding
semiconductor device
area
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024540411A
Other languages
English (en)
Japanese (ja)
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JPWO2024034482A1 (cg-RX-API-DMAC7.html
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Application filed filed Critical
Priority claimed from PCT/JP2023/028203 external-priority patent/WO2024034482A1/ja
Publication of JPWO2024034482A1 publication Critical patent/JPWO2024034482A1/ja
Publication of JPWO2024034482A5 publication Critical patent/JPWO2024034482A5/ja
Pending legal-status Critical Current

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JP2024540411A 2022-08-10 2023-08-01 Pending JPWO2024034482A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022128273 2022-08-10
PCT/JP2023/028203 WO2024034482A1 (ja) 2022-08-10 2023-08-01 半導体装置、及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024034482A1 JPWO2024034482A1 (cg-RX-API-DMAC7.html) 2024-02-15
JPWO2024034482A5 true JPWO2024034482A5 (cg-RX-API-DMAC7.html) 2025-04-21

Family

ID=89851562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024540411A Pending JPWO2024034482A1 (cg-RX-API-DMAC7.html) 2022-08-10 2023-08-01

Country Status (2)

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JP (1) JPWO2024034482A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024034482A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171047A (ja) * 2009-01-20 2010-08-05 Mitsubishi Electric Corp 半導体レーザ装置
JP2011222675A (ja) * 2010-04-07 2011-11-04 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP6054351B2 (ja) * 2014-10-22 2016-12-27 株式会社フジクラ はんだ接合方法、ｌｄモジュールの製造方法、および、はんだ接合装置
JP7064324B2 (ja) * 2017-12-18 2022-05-10 スタンレー電気株式会社 半導体発光装置、および、それを用いた半導体発光装置の製造方法
JP7166818B2 (ja) * 2018-07-13 2022-11-08 スタンレー電気株式会社 光半導体素子

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