JPWO2024029000A1 - - Google Patents
Info
- Publication number
- JPWO2024029000A1 JPWO2024029000A1 JP2023553340A JP2023553340A JPWO2024029000A1 JP WO2024029000 A1 JPWO2024029000 A1 JP WO2024029000A1 JP 2023553340 A JP2023553340 A JP 2023553340A JP 2023553340 A JP2023553340 A JP 2023553340A JP WO2024029000 A1 JPWO2024029000 A1 JP WO2024029000A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/029761 WO2024029000A1 (ja) | 2022-08-03 | 2022-08-03 | ウエハ処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029000A1 true JPWO2024029000A1 (https=) | 2024-02-08 |
| JPWO2024029000A5 JPWO2024029000A5 (https=) | 2024-07-09 |
| JP7612889B2 JP7612889B2 (ja) | 2025-01-14 |
Family
ID=89848757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023553340A Active JP7612889B2 (ja) | 2022-08-03 | 2022-08-03 | ウエハ処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250038033A1 (https=) |
| JP (1) | JP7612889B2 (https=) |
| KR (1) | KR102859137B1 (https=) |
| CN (1) | CN117836912A (https=) |
| TW (1) | TWI875108B (https=) |
| WO (1) | WO2024029000A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222799A (ja) * | 2001-01-25 | 2002-08-09 | Tokyo Electron Ltd | プラズマ処理装置およびそのクリーニング方法および静電チャックの除電方法 |
| JP2017216346A (ja) * | 2016-05-31 | 2017-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| JP2022024265A (ja) * | 2020-07-13 | 2022-02-09 | 東京エレクトロン株式会社 | 基板離脱方法及びプラズマ処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217166A (ja) | 2001-01-19 | 2002-08-02 | Toshiba Corp | ガス処理装置のクリーニング方法 |
| JP6708358B2 (ja) * | 2016-08-03 | 2020-06-10 | 株式会社日立ハイテク | プラズマ処理装置及び試料の離脱方法 |
| JP7462383B2 (ja) | 2019-04-15 | 2024-04-05 | 東京エレクトロン株式会社 | クリーニング方法及びプラズマ処理装置 |
| JP7340953B2 (ja) * | 2019-04-26 | 2023-09-08 | 東京エレクトロン株式会社 | 除電方法、基板処理方法及び基板処理装置 |
| US20250218745A1 (en) * | 2022-05-20 | 2025-07-03 | Nextin, Inc. | Static electrcity control device for semiconductor processing system |
-
2022
- 2022-08-03 KR KR1020237030055A patent/KR102859137B1/ko active Active
- 2022-08-03 US US18/280,569 patent/US20250038033A1/en active Pending
- 2022-08-03 WO PCT/JP2022/029761 patent/WO2024029000A1/ja not_active Ceased
- 2022-08-03 CN CN202280019021.0A patent/CN117836912A/zh active Pending
- 2022-08-03 JP JP2023553340A patent/JP7612889B2/ja active Active
-
2023
- 2023-08-02 TW TW112128974A patent/TWI875108B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222799A (ja) * | 2001-01-25 | 2002-08-09 | Tokyo Electron Ltd | プラズマ処理装置およびそのクリーニング方法および静電チャックの除電方法 |
| JP2017216346A (ja) * | 2016-05-31 | 2017-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| JP2022024265A (ja) * | 2020-07-13 | 2022-02-09 | 東京エレクトロン株式会社 | 基板離脱方法及びプラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202407802A (zh) | 2024-02-16 |
| WO2024029000A1 (ja) | 2024-02-08 |
| KR102859137B1 (ko) | 2025-09-12 |
| JP7612889B2 (ja) | 2025-01-14 |
| US20250038033A1 (en) | 2025-01-30 |
| CN117836912A (zh) | 2024-04-05 |
| KR20240019752A (ko) | 2024-02-14 |
| TWI875108B (zh) | 2025-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CL2025003898A1 (es) | Estación de conformado de productos huecos de fibra moldeada con elemento expandible y sistema de depósito de fluido | |
| CL2025003787A1 (es) | Un aparato para operar una pistola de licor de una caldera de recuperación, una caldera de recuperación y un método de operación del aparato. | |
| BR102023014872A2 (https=) | ||
| BR102023012440A2 (https=) | ||
| BR102023010976A2 (https=) | ||
| BR202022009269U2 (https=) | ||
| BR202022005961U2 (https=) | ||
| BR202022001779U2 (https=) | ||
| BY13175U (https=) | ||
| BY13168U (https=) | ||
| CN307048292S (https=) | ||
| CN307047576S (https=) | ||
| CN307047439S (https=) | ||
| CN307047206S (https=) | ||
| CN307047010S (https=) | ||
| CN307046438S (https=) | ||
| CN307046311S (https=) | ||
| CN307045823S (https=) | ||
| CN307045572S (https=) | ||
| CN307045363S (https=) | ||
| CN307045252S (https=) | ||
| CN307044234S (https=) | ||
| BY23963C1 (https=) | ||
| BY13176U (https=) | ||
| CN307048381S (https=) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230901 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230901 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240827 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241023 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20241210 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20241225 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7612889 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |