JPWO2023276972A1 - - Google Patents

Info

Publication number
JPWO2023276972A1
JPWO2023276972A1 JP2023531953A JP2023531953A JPWO2023276972A1 JP WO2023276972 A1 JPWO2023276972 A1 JP WO2023276972A1 JP 2023531953 A JP2023531953 A JP 2023531953A JP 2023531953 A JP2023531953 A JP 2023531953A JP WO2023276972 A1 JPWO2023276972 A1 JP WO2023276972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531953A
Other languages
Japanese (ja)
Other versions
JPWO2023276972A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023276972A1 publication Critical patent/JPWO2023276972A1/ja
Publication of JPWO2023276972A5 publication Critical patent/JPWO2023276972A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/343Gate regions of field-effect devices having PN junction gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/015Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
JP2023531953A 2021-07-01 2022-06-27 Pending JPWO2023276972A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021110131 2021-07-01
PCT/JP2022/025617 WO2023276972A1 (ja) 2021-07-01 2022-06-27 窒化物半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023276972A1 true JPWO2023276972A1 (https=) 2023-01-05
JPWO2023276972A5 JPWO2023276972A5 (https=) 2024-04-02

Family

ID=84689846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531953A Pending JPWO2023276972A1 (https=) 2021-07-01 2022-06-27

Country Status (5)

Country Link
US (1) US20240120387A1 (https=)
JP (1) JPWO2023276972A1 (https=)
CN (1) CN117546303A (https=)
DE (1) DE112022002854T5 (https=)
WO (1) WO2023276972A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240105828A1 (en) * 2022-09-26 2024-03-28 Rohm Co., Ltd. Nitride semiconductor device and method for manufacturing nitride semiconductor device
TW202508052A (zh) * 2023-01-09 2025-02-16 美商高效電源轉換公司 具有均勻電場的氮化鎵(GaN)裝置
IT202300004551A1 (it) * 2023-03-10 2024-09-10 St Microelectronics Int Nv Dispositivo hemt avente migliorate prestazioni in stato acceso e relativo processo di fabbricazione
JP7703809B2 (ja) * 2023-03-30 2025-07-07 ヌヴォトンテクノロジージャパン株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048866A (ja) * 2005-08-09 2007-02-22 Toshiba Corp 窒化物半導体素子
JP6220161B2 (ja) * 2013-06-03 2017-10-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2015195288A (ja) * 2014-03-31 2015-11-05 住友電工デバイス・イノベーション株式会社 半導体装置及び半導体装置の製造方法
JP6642883B2 (ja) * 2015-10-08 2020-02-12 ローム株式会社 窒化物半導体装置およびその製造方法
JP6767741B2 (ja) * 2015-10-08 2020-10-14 ローム株式会社 窒化物半導体装置およびその製造方法
JP6974049B2 (ja) * 2017-06-28 2021-12-01 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
WO2019098193A1 (ja) * 2017-11-20 2019-05-23 ローム株式会社 半導体装置
JP7097708B2 (ja) * 2018-01-30 2022-07-08 ローム株式会社 窒化物半導体装置
JP7137947B2 (ja) * 2018-03-22 2022-09-15 ローム株式会社 窒化物半導体装置
US11908927B2 (en) * 2019-02-28 2024-02-20 Rohm Co., Ltd. Nitride semiconductor device
KR102767849B1 (ko) * 2019-12-12 2025-02-14 삼성전자주식회사 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
US20240120387A1 (en) 2024-04-11
WO2023276972A1 (ja) 2023-01-05
CN117546303A (zh) 2024-02-09
DE112022002854T5 (de) 2024-03-14

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Legal Events

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Effective date: 20231124