JPWO2023276943A5 - - Google Patents

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Publication number
JPWO2023276943A5
JPWO2023276943A5 JP2023531932A JP2023531932A JPWO2023276943A5 JP WO2023276943 A5 JPWO2023276943 A5 JP WO2023276943A5 JP 2023531932 A JP2023531932 A JP 2023531932A JP 2023531932 A JP2023531932 A JP 2023531932A JP WO2023276943 A5 JPWO2023276943 A5 JP WO2023276943A5
Authority
JP
Japan
Prior art keywords
metal
semiconductor device
semiconductor element
connection member
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023531932A
Other languages
English (en)
Japanese (ja)
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JPWO2023276943A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/025550 external-priority patent/WO2023276943A1/ja
Publication of JPWO2023276943A1 publication Critical patent/JPWO2023276943A1/ja
Publication of JPWO2023276943A5 publication Critical patent/JPWO2023276943A5/ja
Pending legal-status Critical Current

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JP2023531932A 2021-06-30 2022-06-27 Pending JPWO2023276943A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021108426 2021-06-30
PCT/JP2022/025550 WO2023276943A1 (ja) 2021-06-30 2022-06-27 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023276943A1 JPWO2023276943A1 (https=) 2023-01-05
JPWO2023276943A5 true JPWO2023276943A5 (https=) 2024-04-02

Family

ID=84689903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531932A Pending JPWO2023276943A1 (https=) 2021-06-30 2022-06-27

Country Status (5)

Country Link
US (1) US20240112988A1 (https=)
JP (1) JPWO2023276943A1 (https=)
CN (1) CN117561591A (https=)
DE (1) DE112022003353T5 (https=)
WO (1) WO2023276943A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5270467B2 (ja) * 2009-06-18 2013-08-21 タツタ電線株式会社 Cuボンディングワイヤ
JP5912008B1 (ja) * 2015-06-15 2016-04-27 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6452661B2 (ja) * 2016-11-11 2019-01-16 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2021027116A (ja) 2019-08-02 2021-02-22 ローム株式会社 半導体装置

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