JPWO2023248458A5 - - Google Patents

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Publication number
JPWO2023248458A5
JPWO2023248458A5 JP2024528235A JP2024528235A JPWO2023248458A5 JP WO2023248458 A5 JPWO2023248458 A5 JP WO2023248458A5 JP 2024528235 A JP2024528235 A JP 2024528235A JP 2024528235 A JP2024528235 A JP 2024528235A JP WO2023248458 A5 JPWO2023248458 A5 JP WO2023248458A5
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Japan
Prior art keywords
structure layer
molding
thickness
height information
unit
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JP2024528235A
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English (en)
Japanese (ja)
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JPWO2023248458A1 (https=
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Priority claimed from PCT/JP2022/025269 external-priority patent/WO2023248458A1/ja
Publication of JPWO2023248458A1 publication Critical patent/JPWO2023248458A1/ja
Publication of JPWO2023248458A5 publication Critical patent/JPWO2023248458A5/ja
Pending legal-status Critical Current

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JP2024528235A 2022-06-24 2022-06-24 Pending JPWO2023248458A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/025269 WO2023248458A1 (ja) 2022-06-24 2022-06-24 造形方法及び造形装置

Publications (2)

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JPWO2023248458A1 JPWO2023248458A1 (https=) 2023-12-28
JPWO2023248458A5 true JPWO2023248458A5 (https=) 2025-03-26

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ID=89379334

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JP2024528235A Pending JPWO2023248458A1 (https=) 2022-06-24 2022-06-24

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JP (1) JPWO2023248458A1 (https=)
WO (1) WO2023248458A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541417B2 (ja) * 2015-05-12 2019-07-10 キヤノン株式会社 画像処理装置、画像形成装置、画像処理方法及びプログラム
JP6862107B2 (ja) * 2015-08-06 2021-04-21 キヤノン株式会社 画像処理装置、画像処理方法、およびプログラム
JP7146576B2 (ja) * 2018-10-29 2022-10-04 芝浦機械株式会社 積層造形装置、積層造形方法、及びプログラム
CN116113512A (zh) * 2020-07-22 2023-05-12 株式会社 尼康 加工系统
JP3231517U (ja) * 2021-01-28 2021-04-08 株式会社ニコン 加工システム

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