WO2023248458A1 - 造形方法及び造形装置 - Google Patents

造形方法及び造形装置 Download PDF

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Publication number
WO2023248458A1
WO2023248458A1 PCT/JP2022/025269 JP2022025269W WO2023248458A1 WO 2023248458 A1 WO2023248458 A1 WO 2023248458A1 JP 2022025269 W JP2022025269 W JP 2022025269W WO 2023248458 A1 WO2023248458 A1 WO 2023248458A1
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Prior art keywords
modeling
structural layer
thickness
distribution
height information
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PCT/JP2022/025269
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English (en)
French (fr)
Japanese (ja)
Inventor
祐一 柴崎
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Nikon Corp
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Nikon Corp
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Priority to PCT/JP2022/025269 priority Critical patent/WO2023248458A1/ja
Priority to JP2024528235A priority patent/JPWO2023248458A1/ja
Publication of WO2023248458A1 publication Critical patent/WO2023248458A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding

Definitions

  • the present invention relates to a molding method and a molding apparatus for forming a molded object using, for example, an additive manufacturing (AM) method.
  • AM additive manufacturing
  • a modeling apparatus that forms a modeled object by stacking a plurality of structural layers (modeling layers) by repeating resolidification (see Patent Document 1). In such a modeling apparatus, it is required to improve the surface precision of the surface of the modeled object.
  • a modeling method in which a structure is formed by stacking a plurality of structural layers, and the thickness of the modeling material is determined according to the height information of the surface of the first structural layer.
  • a modeling method is provided that controls the thickness distribution of a modeling material of a second structural layer that is formed in an overlapping manner.
  • the first method includes controlling the thickness distribution of a building material of a second structural layer formed overlying the first structural layer by using a different first method and a second method in combination;
  • the second method includes changing the relative positional relationship between the material supply unit that supplies the modeling material and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material.
  • a modeling method is provided.
  • a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam.
  • a material supply section that supplies the modeling material, a moving section that relatively moves the light beam and the modeling material, a first thickness control section that controls the thickness of the modeling material, and the first thickness control section.
  • a second thickness control section that controls the thickness of the modeling material at a spatial frequency higher than a compatible spatial frequency; and first and second thickness control sections thereof according to height information of the surface of the first structural layer.
  • a modeling apparatus is provided, which includes a modeling control unit that uses the modeling controller in combination with the modeling controller to control the thickness distribution of the modeling material of a second structural layer formed overlying the first structural layer.
  • a modeling apparatus that forms a structure by stacking a plurality of structural layers, including an irradiation section that irradiates a light beam onto a modeling surface, and an area that is irradiated with the light beam.
  • a material supply section that supplies a modeling material, and first and second thickness control sections whose corresponding spatial frequency components differ from each other according to the height information of the surface of the first structure layer are used together to create the first structure.
  • a modeling control section that controls the thickness distribution of the modeling material of the second structural layer formed in layers, and the first thickness control section controls the relative thickness distribution between the material supply section and the modeling surface.
  • a shaping device is provided, in which the second thickness control section is a change section that changes the positional relationship, and the second thickness control section is an intensity control section that controls the intensity of the light beam.
  • FIG. 1 is a cross-sectional view showing the modeling apparatus of the first embodiment.
  • (A) is a plan view showing an example of the arrangement of a plurality of light projectors
  • (B) and (C) are views showing an example of the relationship between the height of the modeling surface and the interval between two projected patterns.
  • (A) is a diagram showing when the distance between the material nozzle and the modeling surface is at the center of the variable range
  • (B) and (C) are diagrams showing when the distance is the longest and shortest in the variable range, respectively.
  • (A), (B), (C), and (D) are diagrams showing a process in which a convex pattern is formed on a workpiece by irradiating the modeling material with processing light and cooling it.
  • (A) is a cross-sectional view showing a state in which a pattern of the first structural layer is formed and the height distribution of the pattern after the formation is measured;
  • (B) is a view showing an example of a spatial frequency component with a low error distribution;
  • (C) is a diagram showing an example of a high spatial frequency component, and
  • (D) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed and the height distribution of the pattern after the formation is measured.
  • (A), (B), and (C) are cross-sectional views showing the process of forming a line pattern as a three-dimensional structure.
  • (A), (B), and (C) are cross-sectional views each showing a process of modeling a three-dimensional structure.
  • (A) is a flowchart showing an example of the modeling method
  • (B) is a flowchart showing the operation of a modified example.
  • (A) is a cross-sectional view showing a state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer in a modified example
  • (B) is a cross-sectional view showing the state in which the pattern of the second structural layer is formed while measuring the height distribution of the surface of the first structural layer.
  • (C) is a diagram showing an example of a high spatial frequency component.
  • (A) is a diagram showing the case where the inclination angle of the material nozzle is at the center of the variable range
  • (B) and (C) are diagrams showing the case where the inclination angle is at the maximum and minimum of the variable range, respectively.
  • (A) is a cross-sectional view showing a state in which the height distribution of the surface of the pattern of the second structural layer is measured while measuring the height distribution of the surface of the first structural layer in the second embodiment;
  • (B) 3 is a diagram showing an example of a low spatial frequency component of an error distribution,
  • (C) is a diagram showing an example of a high spatial frequency component, and
  • (D) is a diagram showing an example of an error distribution when feedback control is also used.
  • a three-dimensional model is modeled (manufactured) using an additive manufacturing (AM) method in which materials such as metal or synthetic resin are sequentially added like a 3D printer.
  • AM additive manufacturing
  • the additive manufacturing method will also be referred to as the AM method.
  • a laser metal deposition (LMD) method (hereinafter referred to as "LMD"), which uses light such as a laser beam as an energy beam, is used as an AM method in a directed energy deposition method (DED method).
  • DED method directed energy deposition method
  • LMD methods can also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser powder deposition, laser additive manufacturing, or laser rapid forming. .
  • FIG. 1 shows a modeling device 4 consisting of a 3D printer using the LMD method.
  • the positional relationships of various components constituting the modeling device 4 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X, Y, and Z axes.
  • the plane formed by the X-axis and the Y-axis is parallel to the horizontal plane, and the Z-axis is perpendicular to the horizontal plane.
  • the direction parallel to the Z axis (Z direction) is parallel to the vertical direction
  • the -Z direction is the vertical direction.
  • the modeling device 4 places a three-dimensional structure ST (see FIG. 7(C)) (in any three-dimensional direction It is possible to form objects with size.
  • the modeling device 4 can form the three-dimensional structure ST on the stage 28.
  • the modeling device 4 can add a new structure onto the existing structure to form the three-dimensional structure ST.
  • the modeling device 4 may form a three-dimensional structure ST that is integrated with an existing structure.
  • the modeling device 4 may form a three-dimensional structure ST that is separable from an existing structure, or may form a three-dimensional structure ST so as to repair a damaged portion of an existing structure.
  • the modeling device 4 includes an irradiation optical system 30 that irradiates the workpiece W with a modeling light beam (hereinafter referred to as processing light) EL, and material nozzles 32A and 32B (material supply section) that supply the modeling material M to the workpiece W.
  • a drive system 26 that moves the printing head 24, a material supply device 12, a gas supply device 18, a recovery device 22 that recovers unsolidified modeling material, and controls the operation of the entire device.
  • a control device 20 is provided. Processing light EL generated by the light source 10 is supplied to the irradiation optical system 30 via an optical fiber 36.
  • the control device 20 controls the intensity (energy per unit time) of the processing light EL generated by the light source 10 via the light source control section 16.
  • the modeling section 14 includes a modeling head 24, a drive system 26, and a stage 28.
  • the intensity of the processing light EL emitted from the light source 10 may be controlled using a modulation device using, for example, an acousto-optic device (AOM) or the like.
  • AOM acousto-optic device
  • the material supply device 12 supplies the material nozzles 32A, 32B of the modeling head 24 with the amount of modeling material M required per unit time for the modeling unit 14 to form the three-dimensional structure ST.
  • the modeling material M is a material that can be melted by irradiation with processing light EL having a predetermined intensity or higher.
  • a modeling material M for example, at least one of a metallic material and a resinous material can be used.
  • the modeling material M other materials different from metal materials and resin materials may be used.
  • the modeling material M is a powder or granular material (powder material).
  • the modeling material M does not have to be a powder or granule, and for example, a wire-shaped modeling material or a gaseous modeling material may be used.
  • the modeling unit 14 processes the modeling material M supplied from the material supply device 12 to form a three-dimensional structure ST.
  • the modeling head 24 of the modeling section 14 includes an irradiation optical system 30 and material nozzles (supply system for supplying the modeling material M) 32A, 32B.
  • a suction port 22a connected to the collection device 22 via a flexible pipe (not shown) is supported by the modeling head 24 via a support member (not shown), for example.
  • the modeling head 24, drive system 26, and stage 28 are housed in a space 8IN within the chamber 8.
  • the irradiation optical system 30 is optically connected to the light source 10 via an optical fiber 36.
  • a light transmission member such as a light guide can be used instead of the optical fiber 36.
  • the light emitted from the light source 10 may be directly supplied to the irradiation optical system 30.
  • the light source 10 is, for example, a laser light source that emits laser light of at least one wavelength among infrared, visible, and ultraviolet wavelengths as processing light EL. However, other types of light may be used as the processing light EL.
  • a gas laser such as a CO 2 laser or an excimer laser
  • a solid laser such as a neodymium YAG (Nd:YAG) laser or a yttrium (YVO 4 ) laser
  • a semiconductor laser LD Laser Diode
  • the light source 10 may emit continuous light or pulsed light.
  • the processing light EL does not need to be a laser beam, and the light source 10 may include any light source (for example, at least one of an LED (Light Emitting Diode) or a discharge lamp).
  • the timing and intensity of light emission (energy per unit time) of the light source 10 are controlled by the light source control unit 16.
  • the irradiation optical system 30 includes a condenser lens system (not shown) that condenses the processed light EL emitted from the optical fiber 36 and converts it into a parallel beam, and a condenser lens that focuses the processed light EL on the modeling surface CS. system 30a.
  • the modeling surface CS is arranged at a focusing plane (focus position) near the rear focal plane of the condenser lens system 30a, and the optical axis AX of the condenser lens system 30a is parallel to the Z axis.
  • the irradiation optical system 30 emits the processing light EL propagated from the light source 10 via the optical fiber 36 downward (in the ⁇ Z direction) along the optical axis AX.
  • the irradiation optical system 30 irradiates the processing light EL toward the workpiece W on the stage 28.
  • the irradiation optical system 30 can irradiate the irradiation area EA set on the workpiece W with the processing light EL.
  • the state of the irradiation optical system 30 is switchable under the control of the control device 20 between a state in which the irradiation area EA is irradiated with the processing light EL and a state in which the irradiation area EA is not irradiated with the processing light EL.
  • the direction of the processing light EL emitted from the irradiation optical system 30 is not limited to directly below (-Z direction), but may be, for example, a direction inclined at a predetermined angle with respect to the Z axis.
  • the modeling head 24 also includes light projecting units 44A and 44B that are arranged to sandwich the irradiation optical system 30 in the Y direction and project two circular spot lights GLA and GLB obliquely onto the modeling surface, respectively, and Light projecting units 44C and 44D (see FIG. 2A) that are arranged to sandwich the optical system 30 in the X direction and project two circular spot lights GLC and GLD obliquely onto the modeling surface, respectively, and irradiation optics.
  • Light projecting units 44E, 44F, 44G, and 44H are arranged to sandwich the system 30 in an oblique direction and project two circular spot lights GLE, GLF, GLG, and GLH obliquely onto the modeling surface, respectively (Fig.
  • the light projecting sections 44A to 44H, the imaging device 46, and the imaging signal processing section 48 constitute a height measuring device 42 that measures the height distribution of the surface of the printing surface CS or the pattern formed.
  • an error calculation section 50 a high-pass filter section 52H, and a low-pass filter section 52L for processing the height distribution signal RS are also provided (the functions of these sections will be described later). Note that any method may be used to measure the height of the modeling surface, etc., and for example, the height may be measured using a proximity sensor, an air micrometer, or the like.
  • the material nozzles 32A and 32B connected to the material supply device 12 are arranged symmetrically and inclined so as to sandwich the irradiation optical system 30 in the Y direction.
  • the modeling head 24 is provided with drive mechanisms 34A and 34B for controlling the positions of the material nozzles 32A and 32B in the Z direction. Note that the number of material nozzles 32A, 32B may be three or more.
  • the control device 20 can control the positions of the material nozzles 32A, 32B in the Z direction (relative positions in the Z direction with respect to the modeling surface CS) by driving the drive mechanisms 34A, 34B via the nozzle control unit 60.
  • the material nozzles 32A and 32B each supply (specifically, inject, jet, or spray) the modeling material M from the supply port in an oblique direction to the modeling surface CS.
  • the material nozzles 32A, 32B are physically connected to the material supply device 12, which is a supply source of the modeling material M, via a flexible pipe 54 or the like.
  • the material nozzles 32A, 32B may force-feed the modeling material M supplied from the material supply device 12 via the pipe 54 or the like to the modeling surface CS.
  • a mixture of the modeling material M from the material supply device 12 and a transporting gas (for example, an inert gas such as nitrogen or argon) is fed under pressure to the material nozzles 32A and 32B via the pipe 54, and the material nozzle The mixture may be pumped from 32A and 32B.
  • a transporting gas for example, an inert gas such as nitrogen or argon
  • the material nozzles 32A and 32B are drawn in a tube shape in FIG. 1, the shape of the material nozzle 32 is not limited to this shape.
  • the material nozzles 32A and 32B supply the modeling material M toward the workpiece W on the stage 28.
  • the traveling direction of the modeling material M supplied from the material nozzles 32A and 32B is a direction symmetrically inclined by a predetermined angle (an acute angle as an example) with respect to the Z axis.
  • the material nozzles 32A and 32B supply the modeling material M toward the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL.
  • the material nozzles 32A, 32B and the irradiation optical system 30 are aligned.
  • a drive system 26 including, for example, a motor and an encoder for position detection moves the modeling head 24 along at least one of the X-axis, Y-axis, and Z-axis.
  • the irradiation area EA moves on the workpiece W along at least one of the X-axis and the Y-axis.
  • the drive system 26 may tilt the printing head 24 in at least one of the ⁇ x direction, the ⁇ y direction, and the ⁇ z direction, which are rotational directions around axes parallel to the X, Y, and Z axes. good.
  • the control device 20 is provided with a control section 56 that controls the operation of the drive system 26.
  • the drive system 26 may move the irradiation optical system 30 and the material nozzles 32A, 32B separately. Specifically, for example, the drive system 26 can adjust at least one of the position and direction of the emission part (tip part) of the irradiation optical system 30, the position of the supply ports of the material nozzles 32A and 32B, and the direction thereof. It may be. In this case, the irradiation area EA where the irradiation optical system 30 irradiates the processing light EL and the supply area MA where the material nozzles 32A and 32B supply the modeling material M can be controlled separately. Note that the drive system 26 may allow the modeling head 24 to rotate around an axis parallel to an axis (rotation axis) that is inclined with respect to an axis parallel to the X axis and the Y axis.
  • the stage 28 can hold and release the workpiece W via a mechanical chuck, a vacuum suction chuck, or the like.
  • the stage 28 can move and/or rotate the workpiece W relative to the modeling head 24 in directions along the X, Y, and Z axes, and in rotational directions in the ⁇ x, ⁇ y, and ⁇ z directions.
  • the control device 20 is provided with a control section 58 that controls the operation of the stage 28.
  • the irradiation optical system 30 irradiates the processing light EL, and the material nozzles 32A and 32B supply the modeling material M.
  • the modeling device 4 includes a recovery device 22 that collects the modeling material M that remains unsolidified on the stage 28 or the workpiece W (modeling layer) and the modeling material M that has been scattered or fallen around the stage 28. We are prepared.
  • the gas supply device 18 is a supply source of purge gas.
  • the purge gas includes an inert gas (nitrogen gas, helium gas, argon gas, etc.).
  • Gas supply device 18 supplies purge gas into chamber 8 via pipe 38 .
  • the internal space 8IN of the chamber 8 becomes a space filled with purge gas.
  • the gas supply device 18 may be a cylinder storing inert gas, or if the inert gas is nitrogen gas, it may be a device that separates nitrogen gas from the atmosphere. A part of the purge gas is also supplied from the gas supply device 18 to the material supply device 12 as needed.
  • the control device 20 controls the operation of the modeling device 4.
  • the control device 20 includes, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a memory, an input/output unit, etc., and a storage device (storage medium) 40.
  • three-dimensional model data of a modeling object is output from a server (not shown) to the control device 20.
  • the control device 20 slices the three-dimensional model data to create modeling data of a plurality of structural layers.
  • the modeling material M is supplied to the supply area MA on the workpiece W
  • the light EL is supplied to the irradiation area EA, which is at least partially the same as the supply area MA.
  • the structure is modeled on the workpiece W by controlling the irradiation, the movement of the modeling head 24 by the drive system 26, and/or the movement of the workpiece W by the stage 28.
  • the control device 20 functions as a device that controls the operation of the modeling device 4 by the CPU executing a computer program.
  • This computer program is a computer program for causing the control device 20 (for example, CPU) to execute operations to be performed by the modeling device 4.
  • the computer program executed by the CPU may be recorded in the storage device 40 or in a storage medium (for example, a hard disk, CD-ROM, DVD-RAM, semiconductor memory, etc.) that can be connected to the storage device 42. You can leave it there.
  • the control device 20 may download the computer program to be executed from a device external to the control device 20 via a network interface.
  • the control device 20 does not need to be installed inside the room in which the chamber 8 of the modeling device 4 is installed, and may be installed as a server or the like outside the room, for example.
  • the control device 20 controls the emission mode of the light EL by the irradiation device 10 via the light source control section 16.
  • the injection mode includes, for example, at least one of the intensity of the processing light EL and the injection timing of the processing light EL.
  • the emission mode is, for example, the emission frequency of the pulsed light, the length of the emission time of the pulsed light, and the ratio of the emission time and extinction time of the pulsed light (so-called duty ratio). It may contain at least one of the following.
  • the control device 20 controls the movement mode of the modeling head 24 by the drive system 26 via the control unit 56 and controls the movement mode of the stage 28 via the control unit 58.
  • the movement mode includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing. Furthermore, the control device 20 controls the supply mode of the modeling material M by the material nozzles 32A and 32B.
  • the supply mode includes, for example, at least one of the supply amount (particularly the supply amount per unit time), the thickness of the modeling material to be supplied, and the supply timing.
  • the irradiation optical system 30 is directed at a constant distance from the irradiation optical system 30 to the building surface CS.
  • the processing light EL is irradiated with the output of The EL moves at a constant scanning speed with respect to the modeling material M. Therefore, ideally, the surface of each structural layer after modeling should be almost completely flat.
  • the shape of the structural layer stacked below the layer concerned is not uniform, and therefore the heat capacity is also not uniform. Heat diffusion due to the supplied processing light EL is not uniform.
  • the diameter and depth of the molten pool will vary; for example, if the molten pool is large, more modeling material will be melted and a thicker layer will be added, and if the molten pool is small, less material will be added. As the layer becomes thinner, irregularities occur on the surface of the structural layer after modeling. In other words, even if modeling is performed under the above-mentioned constant conditions, the height distribution of the surface of each structural layer after modeling will have an error with respect to the target distribution.
  • such height distribution errors are corrected by controlling the thickness distribution of the modeling material M supplied to the modeling surface CS and controlling the intensity of the processing light EL as described below.
  • processing by the irradiation optical system 30 is performed from a plurality of (eight in this case) light projecting parts 44A to 44H of the height measuring device 42 arranged so as to surround the irradiation optical system 30.
  • Two spot lights GLA to GLH are diagonally projected onto areas distant from the irradiation area EA of the light EL toward the light projecting units 44A to 44H.
  • the two spot lights GLA to GLH are projected so that the interval becomes gradually narrower.
  • the position Zbf means the Z position of the focusing plane (the plane on which the processing light EL is focused the smallest) with respect to the irradiation optical system 30.
  • the interval h1 of the spot lights GLA is smaller than the interval h2
  • Z1 is, for example, the upper limit of the expected amount of variation
  • the interval h3 between the two spot lights GLA is larger than the interval h2. Therefore, if the interval between the spot lights GLA is h, the relationship with the height Z of the modeling surface CS using the coefficients a and b is, for example, as follows.
  • the coefficients a, b and the position Zbf are determined in advance, for example, by actual measurement, and the coefficients a, b and the position Zbf are stored in the imaging signal processing unit 48 in FIG. 1.
  • h a+b(Z-Zbf)...(1)
  • the imaging signal processing unit 48 processes the imaging signal of the imaging device 46 to determine the interval h between the corresponding spot lights GLA to GLH for each of the light projectors 44A to 44H, and calculates the interval h between the corresponding spot lights GLA to GLH with respect to each of the light projecting units 44A to 44H. Using the position Zbf, the height (Z position) of the portion where the spot lights GLA to GLH are projected can be calculated from equation (1).
  • the height (position Z) determined from the spot light GLA of the light projecting section 44A is This is the height of the surface of the layer after modeling
  • the height (position Z) determined from the spot light GLB of the light projecting section 44B is the height of the surface of the structural layer below the structural layer. Therefore, by determining the height from the interval between the front and rear spot lights GLA to GLH in the moving direction relative to the printing surface CS of the printing head 24, the height of the structural layer after printing and the structure below can be calculated. The height of the surface of the layer can be measured.
  • a height distribution signal RS (indicating the relationship between the relative movement direction and the height (Z position) signal) is output to the error calculation section 50.
  • the error calculation unit 50 is supplied with information on the target distribution of the surface height distribution of each structural layer from the control device 20.
  • the error calculation section 50 subtracts the signal representing the target distribution from the height distribution signal RS to obtain a signal representing the error component, and supplies the signal representing the error component to the high-pass filter section 52H and the low-pass filter section 52L.
  • the high-pass filter section 52H extracts a high spatial frequency signal HS whose spatial frequency is higher than a predetermined threshold SPF from the signal representing the error component
  • the low-pass filter section 52L extracts a high spatial frequency signal HS whose spatial frequency is lower than the threshold SPF from the signal representing the error component.
  • Extract the spatial frequency signal LS extracts the spatial frequency signal LS.
  • the high spatial frequency signal HS and the low spatial frequency signal LS are each supplied to the control device 20.
  • the spatial frequency threshold SPA is, for example, about 0.1 mm ⁇ 1 (about 10 mm in terms of wavelength).
  • the threshold value SPA is a value that changes depending on the relative speed between the printing head 24 and the workpiece W by the drive system 26 and/or the stage 28, and the threshold value SPA is, for example, about 0.05 to 0.2 mm -1 (wavelength (about 20 to 5 mm) may be sufficient.
  • the control device 20 also controls the output (intensity per unit time) of the light source 10 via the light source control unit 16 so as to correct errors in the height distribution of high spatial frequencies corresponding to the high spatial frequency signal HS. Then, the distances of the material nozzles 32A and 32B to the modeling surface CS are controlled via the nozzle control unit 60 so as to correct errors in the height distribution of low spatial frequencies corresponding to the low spatial frequency signal LS.
  • the material nozzles 32A and 32B are symmetrically inclined so that the irradiation optical system 30 is sandwiched therebetween.
  • the modeling surface CS coincides with the focal plane BF of the irradiation optical system 30 in a normal modeling operation.
  • the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below the focal plane BF (in the -Z direction). The distance ⁇ z in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
  • the amount of the modeling material 64 supplied to the modeling surface CS per unit time can be increased.
  • the thickness th can be largely controlled, and the thickness of the pattern finally formed on the modeling surface CS can also be largely controlled. Therefore, in FIG. 3A, there is a difference between the distance ⁇ z of the concentrated region 62 in the ⁇ Z direction with respect to the focusing plane BF and the thickness th of the modeling material 64 supplied per unit time to the modeling surface CS.
  • the control device 20 determines the interval ⁇ z by driving the drive mechanisms 34A and 34B, and uses this interval ⁇ z and the known coefficients c and d to calculate the amount of modeling that is supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time.
  • the thickness th of the material 64 can be determined.
  • the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the positions of the material nozzles 32A, 32B in the Z direction with the nozzle control unit 60.
  • the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled.
  • the thickness th of the modeling material 64 can be greatly changed, and the thickness of the pattern that is finally formed can also be greatly controlled.
  • the control of the positions of the material nozzles 32A and 32B is mechanical control, and the response speed is not very high, so it is not suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS. do not have. Therefore, in this embodiment, the height of the low spatial frequency component corresponding to the low spatial frequency signal LS is controlled by controlling the thickness of the modeling material by controlling the positions of the material nozzles 32A and 32B.
  • FIGS. 4(A) to 4(D) a method for controlling the thickness of the modeling material by controlling the intensity of the processing light EL will be explained with reference to FIGS. 4(A) to 4(D).
  • FIG. 4(A) when the processing light EL is irradiated onto the modeling surface CS of the workpiece W and the modeling material M is supplied to the irradiation area, as shown in FIG. 4(B), the modeling surface CS is A molten pool MP is formed. Then, as shown in FIG. 4C, a part of the material 66 of the supplied modeling material M is fused by the molten pool MP.
  • the processing light EL passes therethrough, and as a result of cooling and solidification, the portion corresponding to the material 66 becomes a convex pattern 66A, as shown in FIG. 4(D).
  • the intensity of the processing light EL emitted from the light source 10 increases under the control of the light source control unit 16 in FIG. Since the amount to be fused increases, the finally formed pattern 66B is higher than the pattern 66A. Conversely, when the intensity of the processing light EL decreases, the pattern finally formed will be lower than the pattern 66A.
  • the thickness of the pattern formed in the structural layer can be controlled. Furthermore, electrical (or optical) control of the intensity of the light source 10 by the light source control unit 16 can be performed faster than mechanical control of the positions of the material nozzles 32A, 32B. However, the amount of control of the thickness of the pattern formed in the structural layer by controlling the intensity of the light source 10 is smaller than the amount of control of the thickness of the pattern by mechanically controlling the positions of the material nozzles 32A, 32B. Therefore, controlling the intensity of the processing light EL is suitable for controlling the height of the high spatial frequency component corresponding to the high spatial frequency signal HS.
  • FIGS. 5(A) to 5(D). First, as shown in FIG. 5(A), the surface of the workpiece W is irradiated with processing light EL from the irradiation optical system 30, the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the workpiece It is assumed that the pattern of the first structural layer 68A is formed by moving the printing head 24 relative to W, for example, in the -Y direction.
  • the target shape of the surface of the first structural layer 68A is, for example, a flat target distribution 70A shown by a dotted line.
  • an image of spot light GLA is projected onto the surface of the pattern immediately after printing from the light projection unit 44A located at the rear in the scanning direction from the irradiation optical system 30 in the printing head 24.
  • An image is captured by the imaging device 46 in FIG. 1, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A immediately after modeling is measured.
  • the error signal is obtained by subtracting the signal of the target distribution in the error calculation section 50 from the distribution signal RS output from the imaging signal processing section 48 in FIG.
  • the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS with a low spatial frequency (long wavelength) as shown in FIG.
  • a high spatial frequency signal HS with a high spatial frequency (short wavelength) of 5(C) is supplied to the control device 20.
  • the high spatial frequency signal HS in FIG. 5(C) corresponds to the small wavelength and small amplitude fluctuation portions 69A and 69B of the height distribution in FIG. 5(A).
  • the material nozzles 32A and 32B are used to form the material in the irradiation area of the processing light EL.
  • the control device 20 corrects the Z positions of the material nozzles 32A and 32B via the nozzle control section 60 using a feedforward control method.
  • control device 20 controls the output (intensity) of the light source 10 via the light source control unit 16 using the feedforward control method so as to correct the error in the height distribution indicated by the high spatial frequency signal HS in FIG. 5(C). Control.
  • the low spatial frequency signal LS and the high spatial frequency signal HS are measured in advance, when modeling the second structural layer 68B, the thickness of the modeling material M at each position is measured in advance. It can be controlled using a feedforward method to cancel out the errors that occur.
  • the target shape of the surface of the second structural layer 68B is also a flat target distribution 70B shown by a dotted line, for example.
  • the unevenness of the surface 68Ba after modeling by build-up of the second structural layer 68B becomes small, and the surface accuracy (flatness) after modeling becomes small. etc.) will be improved.
  • the image of the spot light GLA projected onto the surface of the pattern immediately after printing from the light projection unit 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is also shown.
  • the first imaging device 46 takes an image and measures the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling.
  • This error in the height distribution from the target distribution 70B is corrected when forming the third structural layer (not shown) on the second structural layer 68B.
  • this control method even if printing is performed under certain conditions, the height distribution of the surface after printing of each structural layer will have an error distribution with respect to the target distribution due to the non-uniformity of thermal diffusion as described above.
  • By controlling the thickness distribution of the structural layer above it so as to cancel out the error distribution when printing the structural layer above it it is possible to target the surface accuracy of the surface of the structure after printing. It can be finished to the desired precision.
  • the modeling device 4 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed.
  • the three-dimensional model data (hereinafter also referred to as 3D data) is supplied to the control device 20 of the modeling device 4 from, for example, a server (not shown).
  • 3D data measurement data of a three-dimensional object measured by a shape measuring device etc. (not shown) provided in the modeling device 4, measurement data of a three-dimensional shape measuring device etc. provided separately from the modeling device 4. may also be used.
  • the modeling device 4 creates a plurality of partial structures (hereinafter also referred to as structural layers) SL obtained by, for example, cutting the three-dimensional structure ST into rounds along the Z direction. are formed one layer at a time.
  • structural layers hereinafter also referred to as structural layers
  • a three-dimensional structure ST which is a layered structure in which a plurality of structural layers SL are stacked, is formed.
  • a flow of operations for forming a three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.
  • the modeling device 4 sets an irradiation area EA in a desired area on the modeling surface CS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and Processing light EL is irradiated from the irradiation optical system 30.
  • the focal plane (that is, the condensing position) of the processing light EL coincides with the modeling surface CS.
  • a molten pool (that is, a pool of metal melted by the light EL) MP is formed in a desired area on the modeling surface CS by the processing light EL emitted from the irradiation optical system 30. be done. Furthermore, under the control of the control device 20, the modeling device 4 sets a supply area MA in a desired area on the modeling surface CS, and supplies the modeling material M to the supply area MA from the material nozzles 32A, 32B. Here, the supply area MA is set in the area where the molten pool MP is formed. For this reason, the modeling device 4 supplies the modeling material M from the material nozzles 32A and 32B to the molten pool MP, as shown in FIG. 6(B).
  • the modeling material M supplied to the molten pool MP is melted.
  • the modeling material M melted in the molten pool MP is cooled and solidified again (that is, solidified).
  • the solidified modeling material M (part of the object) is deposited on the object surface CS.
  • a series of modeling processes including forming a molten pool MP by irradiating the light EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and resolidifying the melted modeling material M, This process is repeated while moving the printing head 24 relatively to the printing surface CS along the XY plane. That is, when the printing head 24 moves relative to the printing surface CS, the irradiation area EA also moves relatively to the printing surface CS. Therefore, a series of modeling processes are repeated while moving the irradiation area EA along the XY plane (that is, within a two-dimensional plane) relative to the modeling surface CS.
  • the processing light EL is selectively irradiated to the irradiation area EA set in the area where the object is to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed on the object to be formed.
  • the irradiation area EA set in the area is not selectively irradiated (it can also be said that the irradiation area EA is not set in the area where it is not desired to form a modeled object).
  • the modeling device 4 moves the irradiation area EA along a predetermined movement locus on the modeling surface CS, and adjusts the pattern according to the distribution pattern of the area in which the object is to be formed (that is, the object in the structural layer SL).
  • the processing light EL is irradiated onto the modeling surface CS at the appropriate timing.
  • the molten pool MP also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA.
  • the molten pool MP is sequentially formed on the modeling surface CS in the portions irradiated with the processing light EL among the regions along the movement locus of the irradiation area EA.
  • the supply area MA also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Become.
  • a structural layer SL corresponding to an aggregate of objects made of the solidified modeling material M is formed on the modeling surface CS.
  • a structural layer SL corresponding to an aggregate of shaped objects formed on the shaped surface CS in a pattern according to the movement locus of the molten pool MP is formed.
  • the supply of the modeling material M may be stopped while irradiating the processing light EL to the irradiation area EA.
  • the modeling material M is supplied to the irradiation area EL, and the irradiation area EL is irradiated with light EL with an intensity that does not create a molten pool MP. You can.
  • the movement trajectory of the irradiation area EA on the workpiece W may be either a movement trajectory corresponding to scanning in so-called raster scanning or a movement trajectory corresponding to scanning in so-called vector scanning.
  • the irradiation area EA was moved with respect to the printing surface CS by moving the printing head 24 (that is, the light EL) with respect to the printing surface CS, but even if the printing surface CS is moved, Alternatively, both the printing head 24 (that is, the processing light EL) and the printing surface CS may be moved.
  • step 102 the control device 20 creates slice data by slicing the three-dimensional model data at a stacking pitch, and stores the slice data in the storage device 40. Note that data obtained by partially modifying this slice data according to the characteristics of the modeling device 4 may be used. Then, the control device 20 reads the modeling pattern data for the next structural layer to be modeled. In the next step 104, the control device 20 causes the light source 10 to start emitting the processing light EL via the light source control unit 16.
  • step 106 the supply of the modeling material M from the material nozzles 32A and 32B is started, and in step 108, the processing light EL (light beam) and the modeling material M are moved relative to each other by the drive system 26 and/or the stage 28. Then, modeling is done by overlaying.
  • step 110 in parallel with the operations in steps 106 and 108, the height distribution of the surface of the part (pattern) formed by this structural layer is measured using the height measuring device 42, as in FIG. 5(A). is measured.
  • step 112 it is determined whether or not the modeling of this layer has been completed. If the modeling has not been completed, the operations of steps 106 and 108 and the operation of step 110 are executed in parallel.
  • the supply of the modeling material is stopped and the light source 10 stops emitting light.
  • a first structural layer SL#1 is formed on the modeling surface CS corresponding to the surface of the workpiece W.
  • the process moves to step 114, and the error calculation unit 50 calculates an error distribution signal from the height distribution signal RS of the formed structural layer.
  • step 116 the error distribution signal is supplied to the low-pass filter section 52L and the high-pass filter section 52H, and a low spatial frequency signal LS and a high spatial frequency signal HS are extracted, respectively.
  • the extracted signals LS and HS are stored in the storage device 40.
  • the control device 20 reads the modeling pattern data for the next structural layer to be modeled. Then, as shown in FIG. 7(B), the surface of the structural layer SL#1 is set as a new modeling surface CS, and a second structural layer SL#2 is formed on this new modeling surface CS. do.
  • the control device 20 first controls the drive system 26 so that the printing head 24 moves along the Z-axis. Specifically, the control device 20 controls the drive system 26 to set the +Z The printing head 24 is moved in the direction. Thereby, the focal plane of the processing light EL coincides with the new modeling surface CS.
  • the low spatial frequency component is corrected by controlling the Z positions of the material nozzles 32A and 32B in step 120, and the output of the processing light EL emitted from the light source 10 is corrected in step 122.
  • Correction of high spatial frequency components by control and modeling by relative movement of the processing light EL and the modeling material M in step 124 are performed. Note that the operations of steps 120, 122, and 124 are performed substantially in parallel.
  • step 126 similarly to step 110, the height distribution of the surface of the portion (pattern) formed by this structural layer is measured using the height measuring device 42. be done.
  • the output (intensity per unit time) of the processing light EL is, for example, , when the thickness of the modeling material supplied to the modeling surface CS is the thickest, the output may be set such that the entire thickness of the modeling material can be melted.
  • the output of the processing light EL is set to an output that can melt the thickness of the modeling material when the thickness of the modeling material is at the median of the variable range, and the material nozzle 32A , 32B, the output of the processing light EL may be increased or decreased depending on the thickness.
  • step 124 even if the thickness of the supplied modeling material is constant, the thickness of the modeling material after modeling can be controlled within a certain range by controlling the output of the processing light EL.
  • step 128 if the modeling of this layer is not completed, the operations of steps 120 to 124 and step 126 are repeated. If the modeling of this layer is finished, the operation moves to step 130, where it is determined whether the modeling is finished. If the modeling is not completed, the operation moves to step 114, where the modeling of the next structural layer is performed while correcting the thickness distribution of the building material to correct the error in the height distribution of the previous layer. It will be done. In this way, as shown in FIG. 7(C), a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.
  • the height distribution after printing is measured when printing the previous layer, and when printing the next layer, the thickness of the printing material is controlled so as to cancel out the error distribution of the height distribution of the previous layer. Accordingly, the surface precision (flatness, etc.) of the surface of the structure after modeling can be improved.
  • the modeling method of the modeling apparatus 4 of this embodiment is a modeling method in which a structure is formed by stacking a plurality of structural layers, and the height distribution signal of the surface of the first structural layer 68A is A first method of controlling the thickness of the modeling material according to RS (height information) (a method of controlling the Z position of the material nozzles 32A, 32B), and a method of controlling the thickness of the modeling material according to the spatial frequency component corresponding to the first method.
  • the second structural layer 68B formed overlapping the first structural layer 68A is combined with the second method of controlling the thickness of the modeling material regarding high spatial frequency components (method of controlling the intensity of the processing light EL).
  • the thickness distribution of the modeling material is controlled (steps 120, 122, 124).
  • the modeling apparatus 4 of this embodiment is a modeling apparatus that forms a structure by stacking a plurality of structural layers, and includes an irradiation optical system 30 ( irradiation unit), material nozzles 32A, 32B (material supply unit) that supplies the modeling material M to the area irradiated with the processing light EL, a drive system 26 and a stage 28 that relatively move the processing light EL and the modeling material M. (moving unit), drive mechanisms 34A, 34B and a nozzle control unit 60 (hereinafter also referred to as a first thickness control unit) that control the Z positions of the material nozzles 32A, 32B in order to control the thickness of the modeling material.
  • irradiation optical system 30 irradiation unit
  • material nozzles 32A, 32B material supply unit
  • drive system 26 and a stage 28 that relatively move the processing light EL and the modeling material M.
  • a nozzle control unit 60 hereinafter also referred to as a first thickness control unit
  • a light source control section 16 (hereinafter referred to as a second thickness control section) that controls the intensity of the processing light EL in order to control the thickness of the modeling material at a spatial frequency higher than the spatial frequency that the first thickness control section can handle. ), and the first thickness control section and the second thickness control section are used in combination according to the height distribution signal RS (height information) of the surface of the first structure layer 68A.
  • the thickness of the modeling material (the build-up amount ) is controlled. Therefore, even if the height distribution on the surface of the first structural layer 68A deviates from the target distribution due to non-uniformity of thermal diffusion or the like during the modeling of the first structural layer 68A, the second structural layer 68B By controlling the thickness distribution of the modeling material during modeling, the surface accuracy (flatness, etc.) of the surface of the second structural layer 68B can be improved.
  • the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself. For example, by flattening the unevenness distribution as the thickness distribution, the surface accuracy (flatness, etc.) of the surface of the structure can be improved. Moreover, by controlling the thickness distribution of the modeling material so that it becomes a target distribution, it is possible to model the structural layer with a desired thickness distribution or a uniform thickness distribution.
  • the height measurement device 42 measures the height distribution of the surface of the pattern of the first structural layer 68A after forming, and this measurement result is used in the next step. It is used when forming the pattern of the two-structure layer 68B. For this reason, modeling can be performed more efficiently than when the height distribution of the surface of the pattern of the first structural layer 68A is separately measured.
  • a measurement process for measuring the height distribution of the surface of the first structural layer 68A may be provided between the forming process of the first structural layer 68A and the forming process of the second structural layer 68B.
  • step 126 in FIG. 8A of the above-described embodiment the height distribution of the surface of the portion where the modeling has been completed is measured during the modeling of the structural layer.
  • step 126A of FIG. 8(B) as shown in FIG. 9(A), when printing the second structural layer 68B, the irradiation optical system is An image of the spot light GLB projected onto the surface of the first structural layer 68A from the light projecting unit 44B located in front of the scanning direction from 30 is captured by the imaging device 46 of FIG. The distribution of heights may also be measured.
  • an error distribution signal of the height distribution of the surface 68Aa of the first structural layer 68A is obtained, and in the next step 116A, a low spatial frequency signal LS and a high spatial frequency signal are obtained from the error distribution signal. Extract the signal HS.
  • steps 126A, 114A, and 116A are performed on the area in front of the area where the processing light EL is irradiated and the printing material M is supplied from the printing head 24 in FIG. 9(A). It is being said.
  • the position Y2 is A low spatial frequency signal LS and a high spatial frequency signal HS are obtained up to the forward position Y1.
  • the second structural layer 68B is formed in a feedforward manner so as to cancel out the error distribution on the surface of the first structural layer 68A determined in step 116A.
  • the second structural layer 68A can be shaped while correcting the thickness of the material. That is, in this modification, it is possible to measure the height distribution of the surface of the previous layer and to control the thickness of the modeling material of the layer in almost real time using this measurement result. Therefore, there is no need to measure and store the height distribution of the surface of the previous layer in advance when modeling the previous layer.
  • the correction of the low spatial frequency components of the error distribution of the height distribution is performed by controlling the positions of the material nozzles 32A and 32B in the Z direction.
  • the error distribution may be corrected by controlling the angles of the material nozzles 32A and 32B.
  • material nozzles 32A and 32B for supplying the modeling material M are symmetrically provided in the modeling head 24 so as to sandwich the irradiation optical system 30 therebetween.
  • the material nozzles 32A, 32B are rotatably supported relative to the modeling head 24.
  • drive mechanisms 34C and 34D for rotating the material nozzles 32A and 32B with respect to the modeling head 24 are provided.
  • the configuration other than this is the same as the above embodiment.
  • the modeling surface CS matches the focal plane BF of the irradiation optical system 30 in normal modeling operations.
  • the modeling material M supplied from the material nozzles 32A, 32B is It is assumed that the angles of the material nozzles 32A and 32B are set so that they overlap in the concentrated region 62 by a predetermined amount below (-Z direction) with respect to BF.
  • the distance in the Z direction between the focused area 62 and the focal plane BF is determined from the drive amount of the drive mechanisms 34A and 34B.
  • the thickness th2 of the modeling material 64 supplied to the modeling surface CS per unit time is approximately 1/2 of the thickness th1.
  • the thickness th of the building material 64 supplied to the building surface CS per unit time can be greatly controlled. can do. Therefore, the thickness distribution of the pattern finally formed on the modeling surface CS can also be greatly controlled.
  • the distance is determined by driving the drive mechanisms 34C and 34D, and from this distance, the thickness th of the modeling material 64 supplied from the material nozzles 32A and 32B to the modeling surface CS per unit time is determined. be able to.
  • the control device 20 can control the thickness th of the modeling material 64 supplied to the modeling surface CS by controlling the rotation angles of the material nozzles 32A, 32B with the nozzle control unit 60.
  • the thickness of the pattern of the modeling material formed by irradiating the modeling material 64 with the processing light EL, melting, cooling, and solidification can also be controlled.
  • Rotation control of the material nozzles 32A, 32B is mechanical control, and although the response speed is not very high, the control range of the thickness of the modeling material is wide. Therefore, by controlling the rotation of the material nozzles 32A and 32B, it is possible to control the thickness of the modeling material with a low spatial frequency component and with a wide correction range.
  • the thickness of the modeling material M supplied to the modeling surface CS is controlled by controlling the relative positions of the material nozzles 32A, 32B and the modeling surface CS.
  • the thickness of the modeling material M may be controlled. In this way, when controlling the supply amount per unit time of the modeling material sent from the material supply device 12 to the material nozzles 32A, 32B, only one material nozzle (for example, 32A) of the material nozzles 32A, 32B is controlled. It is possible to provide the following information.
  • FIG. 11 Next, a second embodiment will be described with reference to FIG. 11. Although this embodiment also uses the modeling apparatus 4 of FIG. 1, the method of controlling the thickness distribution of the modeling material of the structural layer is different. An example of the operation when forming the first structural layer on the workpiece W and forming the second structural layer thereon in this embodiment will be described with reference to FIGS. 11(A) to 11(D).
  • the first structural layer 68A is formed on the surface of the workpiece W using the modeling apparatus 4. At this time, it is not necessarily necessary to measure the height distribution of the surface 68Aa of the first structural layer 68A.
  • the processing light EL is irradiated from the irradiation optical system 30 onto the first structural layer 68A, and the modeling material M is supplied from the material nozzles 32A and 32B to the irradiation area of the processing light EL, and the work W is modeled.
  • the head 24 is relatively moved, for example, in the ⁇ Y direction, and the pattern of the second structural layer 68B is built up and modeled.
  • the target shapes of the surfaces of the first structural layer 68A and the second structural layer 68B are, for example, flat target distributions 70A and 70B shown by dotted lines, respectively.
  • the image of the spot light GLB projected onto the surface 68Aa of the first structural layer 68A from the light projecting section 44B located in front of the irradiation optical system 30 in the scanning direction in the printing head 24 is illustrated.
  • the first imaging device 46 takes an image, and the height distribution of the surface 68Aa of the pattern of the first structural layer 68A, which is the previous layer, is measured. Then, an error signal is obtained by subtracting the signal of the target distribution from the signal RS of the height distribution in the error calculating section 50.
  • the low-pass filter section 52L and the high-pass filter section 52H produce a low spatial frequency signal LS shown in FIG. 11(B) and a high spatial frequency signal LS shown in FIG. 11(C), respectively.
  • a signal HS is supplied to the control device 20.
  • the position in the Y direction where the processing light EL is irradiated from the irradiation optical system 30 is Y4, then by capturing the image of the spot light GLB, As shown, the low spatial frequency signal LS and high spatial frequency signal HS are obtained up to position Y3 in front of position Y4. Therefore, by controlling the positions of the material nozzles 32A and 32B in the Z direction and the intensity of the processing light EL using the low spatial frequency signal LS and the high spatial frequency signal HS, the height of the surface of the first structural layer 68A can be adjusted.
  • the thickness distribution of the modeling material can be controlled substantially in real time and in a feedforward manner during the modeling of the second structural layer 68B so as to offset errors in the distribution.
  • the light projecting section 44A located behind the irradiation optical system 30 in the scanning direction in the printing head 24 is The image of the spot light GLA projected onto the surface of the pattern immediately after is captured by the imaging device 46 of FIG. 1, and the height distribution of the surface 68Ba of the pattern of the second structural layer 68B immediately after modeling is also measured.
  • the thickness distribution of the modeling material of the second structural layer 68B based on the measured value of the height distribution of the surface of the first structural layer 68A, the surface of the pattern formed so far Although 68Ba is close to the target distribution 70B, there is still a slight error.
  • the signal HB corresponding to the error has only low spatial frequency components, as shown by a curve 71A in FIG. 11(D).
  • the position of the irradiation optical system 30 is Y4
  • the signal HB is measured up to a position Y5 at the rear with respect to the scanning direction of the irradiation optical system 30. Therefore, in this embodiment, the Z positions of the material nozzles 32A and 32B are controlled by feedback control so as to cancel out the error in the height distribution corresponding to the signal HB.
  • the signal HB indicating the error of the height distribution of the surface 68Ba of the pattern formed on the second structural layer 68B with respect to the target distribution 70B becomes small as shown by the dotted curve 71B in FIG. 11(D).
  • the thickness distribution of the modeling material of the second structural layer 68B is controlled by the feedforward method so as to offset the measurement result of the error distribution of the height distribution of the surface of the first structural layer 68A.
  • the thickness distribution of the modeling material of the second structural layer 68B is adjusted in a feedback manner so as to cancel out the measurement result of the error distribution of the height distribution of the surface of the pattern formed so far in the second structural layer 68B. It's in control. Therefore, even if the error in the height distribution of the surface of the first structural layer 68A is large, the surface accuracy of the pattern of the second structural layer 68B can be formed with higher precision.
  • the error in the height distribution of the surface 68Ba of the pattern of the second structural layer 68B with respect to the target distribution 70B is calculated.
  • the low spatial frequency signal LS and the high spatial frequency signal HS may be extracted from the signal HB shown.
  • the thickness distribution includes not only the unevenness distribution on the surface but also the distribution of the thickness itself.
  • the surface of the second structural layer 68B is It is possible to print with higher precision.
  • the modeling apparatus 4 of each of the above-described embodiments uses a laser metal deposition method (LMD) of the directional energy deposition method (DED).
  • LMD laser metal deposition method
  • DED directed energy deposition method
  • the configuration of the modeling device 4 of the above-described embodiment is not limited to the above-described configuration, and any other configuration is possible.
  • the number and arrangement of the material nozzles 32A, 32B may be arbitrary, and the configuration of the height measuring device 42 and the like may also be arbitrary. Further, as the height measuring device 42, it is also possible to use a device that projects a bright and dark pattern.
  • a modeling method that includes changing the relative positional relationship between the material supply section and the modeling surface, and the second method includes controlling the intensity of the light beam irradiated to the modeling material.
  • Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, The method includes controlling the thickness of the modeling material supplied from the material supply unit to the modeling surface when the light beam and the modeling material are moved relative to each other.
  • the modeling method according to 5 wherein the first method includes controlling the distance between the material supply section and the modeling surface.
  • Supplying the building material from the material supply section includes supplying the building material in an oblique direction from a plurality of material supply sections, and the first method includes controlling the angle of the material supply section. 5.
  • Forming the second structural layer includes supplying a modeling material from a material supply unit to a region to be irradiated with a light beam, and relatively moving the light beam and the modeling material, and forming the second structural layer.
  • 9) When forming the second structural layer measuring the height information of the surface of the first structural layer in a region before applying the modeling material of the second structural layer, The modeling method according to any one (or 1). 10) From 1 to 1, including measuring height information of the surface of the first structural layer in a region after the modeling material of the first structural layer is piled up when forming the first structural layer. 8. The modeling method according to any one of item 8 (or 1).
  • any one of 1 to 8 including a step of measuring height information of the surface of the first structural layer between the step of forming the first structural layer and the step of forming the second structural layer.
  • the modeling method according to any one of 1 to 11 (or 1) including controlling the thickness of the modeling material in the area where the modeling material is applied.
  • a modeling device that forms a structure by stacking a plurality of structural layers, including an irradiation unit that irradiates a modeling surface with a light beam, and a material that supplies a modeling material to a region that is irradiated with the light beam. a supply unit, a moving unit that relatively moves the light beam and the modeling material, a first thickness control unit that controls the thickness of the modeling material, and a spatial frequency that can be handled by the first thickness control unit.
  • a second thickness control section that controls the thickness of the modeling material at a high spatial frequency, and the first and second thickness control sections are used together according to the height information of the surface of the first structural layer
  • a modeling device comprising: a modeling control section that controls the thickness distribution of a modeling material of a second structural layer formed to overlap the first structural layer.
  • a modeling device that forms a structure by stacking a plurality of structural layers, comprising: an irradiation unit that irradiates a modeling surface with a light beam; and a material that supplies a modeling material to an area irradiated with the light beam.
  • the first structural layer is formed so as to be superimposed on the first structural layer by using a supply section and first and second thickness control sections whose corresponding spatial frequency components are different from each other according to the height information of the surface of the first structural layer.
  • a modeling control section that controls the thickness distribution of the modeling material of the second structural layer, the first thickness control section changing the relative positional relationship between the material supply section and the modeling surface.
  • a modeling apparatus wherein the second thickness control section is an intensity control section that controls the intensity of the light beam.
  • a calculation unit that extracts a low frequency component and a high frequency component related to spatial frequency from the height information of the surface of the first structural layer, and the modeling control unit extracts the low frequency component and the high frequency component regarding the spatial frequency from the height information of the surface of the first structural layer
  • the first thickness control section is used to control the thickness distribution of the modeling material of the second structural layer
  • the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer
  • the second thickness control section is used to control the thickness distribution of the modeling material of the second structural layer.
  • the modeling control unit controls the first thickness control unit and the second thickness control unit in a feedforward manner using the height information of the surface of the first structural layer, and 17.
  • the modeling device according to any one of 14 to 16 (or 14), which controls the thickness distribution of the modeling material of the structural layer.
  • the material supply unit has a plurality of material supply units that supply the modeling material obliquely, and the first thickness control unit controls the angle of the plurality of material supply units,
  • the modeling device according to any one (or 14).
  • the measurement unit includes a measurement light irradiation unit that irradiates the surface of the structural layer with a plurality of measurement lights obliquely, an imaging unit that receives the measurement light reflected by the structural layer, and an imaging unit of the imaging unit. 23.
  • the modeling apparatus further comprising: an imaging signal processing unit that processes a signal to determine the height of a portion of the structural layer that is irradiated with the measurement light.
  • the measurement unit measures height information of the surface of the second structural layer in a region where the modeling material of the second structural layer is piled up, and measures the height information of the surface of the second structural layer.
  • the control unit uses the first and second thickness control units to apply the next modeling material in the second structural layer according to the height information of the surface of the second structural layer measured by the measuring unit.
  • the modeling device according to 22 or 23 (or 22), which controls the thickness of the modeling material in the region where the material is piled up. 25)
  • the modeling apparatus according to any one of 14 to 24, wherein the surface height information of the first structural layer includes an error distribution of the surface height distribution with respect to a target distribution.
  • W... Workpiece EL... Processing light, M... Modeling material, 4... Modeling device, 10... Light source, 12... Material supply device, 16... Light source control section, 18... Gas supply device, 20... Control device, 26... Drive system , 28... Stage, 30... Irradiation optical system, 32A, 32B... Material nozzle, 34A, 34B... Drive mechanism, 42... Height measurement device, 44A to 44H... Light projection unit, 46... Imaging device, 48... Imaging signal processing Section, 50... Error calculation section, 52H... High pass filter section, 52L... Low pass filter section, 60... Nozzle control section

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020069662A (ja) * 2018-10-29 2020-05-07 東芝機械株式会社 積層造形装置、積層造形方法、及びプログラム
JP3231517U (ja) * 2021-01-28 2021-04-08 株式会社ニコン 加工システム
WO2022018853A1 (ja) * 2020-07-22 2022-01-27 株式会社ニコン 加工システム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541417B2 (ja) * 2015-05-12 2019-07-10 キヤノン株式会社 画像処理装置、画像形成装置、画像処理方法及びプログラム
JP6862107B2 (ja) * 2015-08-06 2021-04-21 キヤノン株式会社 画像処理装置、画像処理方法、およびプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020069662A (ja) * 2018-10-29 2020-05-07 東芝機械株式会社 積層造形装置、積層造形方法、及びプログラム
WO2022018853A1 (ja) * 2020-07-22 2022-01-27 株式会社ニコン 加工システム
JP3231517U (ja) * 2021-01-28 2021-04-08 株式会社ニコン 加工システム

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