JPWO2023243078A1 - - Google Patents

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Publication number
JPWO2023243078A1
JPWO2023243078A1 JP2022549279A JP2022549279A JPWO2023243078A1 JP WO2023243078 A1 JPWO2023243078 A1 JP WO2023243078A1 JP 2022549279 A JP2022549279 A JP 2022549279A JP 2022549279 A JP2022549279 A JP 2022549279A JP WO2023243078 A1 JPWO2023243078 A1 JP WO2023243078A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022549279A
Other languages
Japanese (ja)
Other versions
JP7142812B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7142812B1 publication Critical patent/JP7142812B1/ja
Publication of JPWO2023243078A1 publication Critical patent/JPWO2023243078A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
    • G01M3/16—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP2022549279A 2022-06-17 2022-06-17 リーク判定方法およびめっき装置 Active JP7142812B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024314 WO2023243078A1 (ja) 2022-06-17 2022-06-17 リーク判定方法およびめっき装置

Publications (2)

Publication Number Publication Date
JP7142812B1 JP7142812B1 (ja) 2022-09-27
JPWO2023243078A1 true JPWO2023243078A1 (ko) 2023-12-21

Family

ID=83436638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022549279A Active JP7142812B1 (ja) 2022-06-17 2022-06-17 リーク判定方法およびめっき装置

Country Status (5)

Country Link
US (1) US20240247396A1 (ko)
JP (1) JP7142812B1 (ko)
KR (1) KR102612855B1 (ko)
CN (1) CN116097077B (ko)
WO (1) WO2023243078A1 (ko)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6073328A (ja) * 1983-09-30 1985-04-25 Toshiba Battery Co Ltd 電池の漏液検査方法
JP3349232B2 (ja) * 1993-12-21 2002-11-20 株式会社ブリヂストン メッキ分析方法及びメッキ分析装置
CN1179209A (zh) * 1995-01-31 1998-04-15 斯托克利-范坎普有限公司 密封装置完整性的鉴定方法
JP3862522B2 (ja) * 2001-06-20 2006-12-27 大日本スクリーン製造株式会社 基板処理装置
JP4295032B2 (ja) * 2003-07-22 2009-07-15 大日本スクリーン製造株式会社 めっき装置
CN102492954A (zh) * 2011-12-12 2012-06-13 北京星和众工设备技术股份有限公司 酸洗线石墨换热器损坏监测方法
JP2015071802A (ja) * 2013-10-02 2015-04-16 株式会社荏原製作所 めっき装置および該めっき装置に使用されるクリーニング装置
JP7398292B2 (ja) * 2020-02-10 2023-12-14 株式会社荏原製作所 めっき方法
JP7455608B2 (ja) * 2020-02-25 2024-03-26 株式会社荏原製作所 洗浄方法及び洗浄装置
CN214334153U (zh) * 2020-12-17 2021-10-01 深圳市帝迈生物技术有限公司 漏液检测传感器、漏液检测装置、清洗拭子及样本分析仪
CN115461499B (zh) 2021-11-04 2023-04-18 株式会社荏原制作所 镀覆装置及基板清洗方法

Also Published As

Publication number Publication date
CN116097077B (zh) 2024-02-27
CN116097077A (zh) 2023-05-09
WO2023243078A1 (ja) 2023-12-21
US20240247396A1 (en) 2024-07-25
JP7142812B1 (ja) 2022-09-27
KR102612855B1 (ko) 2023-12-13

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