JPWO2023228964A5 - - Google Patents

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Publication number
JPWO2023228964A5
JPWO2023228964A5 JP2024523317A JP2024523317A JPWO2023228964A5 JP WO2023228964 A5 JPWO2023228964 A5 JP WO2023228964A5 JP 2024523317 A JP2024523317 A JP 2024523317A JP 2024523317 A JP2024523317 A JP 2024523317A JP WO2023228964 A5 JPWO2023228964 A5 JP WO2023228964A5
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JP
Japan
Prior art keywords
resin composition
hollow
mass
resin
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024523317A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023228964A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/019246 external-priority patent/WO2023228964A1/ja
Publication of JPWO2023228964A1 publication Critical patent/JPWO2023228964A1/ja
Publication of JPWO2023228964A5 publication Critical patent/JPWO2023228964A5/ja
Pending legal-status Critical Current

Links

JP2024523317A 2022-05-26 2023-05-24 Pending JPWO2023228964A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022086111 2022-05-26
PCT/JP2023/019246 WO2023228964A1 (ja) 2022-05-26 2023-05-24 中空粒子、樹脂組成物、樹脂成形体、封止用樹脂組成物、硬化物、及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023228964A1 JPWO2023228964A1 (https=) 2023-11-30
JPWO2023228964A5 true JPWO2023228964A5 (https=) 2026-04-03

Family

ID=88919342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523317A Pending JPWO2023228964A1 (https=) 2022-05-26 2023-05-24

Country Status (7)

Country Link
US (1) US20250296066A1 (https=)
EP (1) EP4535416A4 (https=)
JP (1) JPWO2023228964A1 (https=)
KR (1) KR20250018484A (https=)
CN (1) CN119156702A (https=)
TW (1) TW202402839A (https=)
WO (1) WO2023228964A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240402557A1 (en) * 2023-06-02 2024-12-05 The Regents Of The University Of Colorado, A Body Corporate Low-voltage haze tuning assembly and method
WO2025115688A1 (ja) * 2023-11-30 2025-06-05 日本ゼオン株式会社 中空粒子

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) * 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP6151983B2 (ja) 2013-06-19 2017-06-21 松本油脂製薬株式会社 熱膨張性微小球、その製造方法および用途
US12139594B2 (en) * 2018-09-28 2024-11-12 Zeon Corporation Resin composition and molded product thereof
KR102787214B1 (ko) * 2018-09-28 2025-03-25 니폰 제온 가부시키가이샤 수지 조성물 및 그 성형체
US11707722B2 (en) * 2018-09-28 2023-07-25 Zeon Corporation Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
EP3922650A4 (en) * 2019-02-06 2022-10-26 Zeon Corporation PROCESS FOR MANUFACTURING HOLLOW RESIN PARTICLES
CN113993918B (zh) * 2019-06-27 2024-01-16 日本瑞翁株式会社 中空树脂颗粒的制造方法
CN114630847B (zh) 2019-10-29 2024-02-06 积水化成品工业株式会社 中空树脂颗粒及其制造方法
WO2021112110A1 (ja) * 2019-12-06 2021-06-10 日本ゼオン株式会社 中空粒子、樹脂組成物及び成形体
WO2021112117A1 (ja) * 2019-12-06 2021-06-10 日本ゼオン株式会社 中空粒子の製造方法
JP7468120B2 (ja) * 2020-04-28 2024-04-16 日本ゼオン株式会社 中空粒子の製造方法
WO2022071276A1 (ja) * 2020-09-30 2022-04-07 日本ゼオン株式会社 中空粒子の製造方法
CN116323696B (zh) * 2020-10-30 2024-09-03 日本瑞翁株式会社 中空颗粒的制造方法及中空颗粒
US20230383021A1 (en) * 2020-10-30 2023-11-30 Zeon Corporation Method for producing hollow particles and hollow particles

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