JPWO2023210088A1 - - Google Patents
Info
- Publication number
- JPWO2023210088A1 JPWO2023210088A1 JP2024517843A JP2024517843A JPWO2023210088A1 JP WO2023210088 A1 JPWO2023210088 A1 JP WO2023210088A1 JP 2024517843 A JP2024517843 A JP 2024517843A JP 2024517843 A JP2024517843 A JP 2024517843A JP WO2023210088 A1 JPWO2023210088 A1 JP WO2023210088A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/019169 WO2023209897A1 (ja) | 2022-04-27 | 2022-04-27 | ウエハ加工装置、半導体チップの製造方法および半導体チップ |
| PCT/JP2023/003610 WO2023210088A1 (ja) | 2022-04-27 | 2023-02-03 | ウエハ加工装置、半導体チップの製造方法および半導体チップ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023210088A1 true JPWO2023210088A1 (enrdf_load_stackoverflow) | 2023-11-02 |
Family
ID=88518316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517843A Pending JPWO2023210088A1 (enrdf_load_stackoverflow) | 2022-04-27 | 2023-02-03 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023210088A1 (enrdf_load_stackoverflow) |
| TW (1) | TW202401536A (enrdf_load_stackoverflow) |
| WO (2) | WO2023209897A1 (enrdf_load_stackoverflow) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3933507B2 (ja) * | 2002-03-25 | 2007-06-20 | 大日本スクリーン製造株式会社 | 基板搬送装置および基板処理装置 |
| JP2005109324A (ja) * | 2003-10-01 | 2005-04-21 | Tokyo Seimitsu Co Ltd | レーザーダイシング装置 |
| JP2005228771A (ja) * | 2004-02-10 | 2005-08-25 | Shinko Electric Co Ltd | 基板搬送方法、及びその装置 |
| JP2007235068A (ja) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
| JP5399690B2 (ja) * | 2008-11-28 | 2014-01-29 | アピックヤマダ株式会社 | 切断装置 |
| JP2011018731A (ja) * | 2009-07-08 | 2011-01-27 | Rayresearch Corp | ウェハ分岐搬送装置 |
| JP6703785B2 (ja) * | 2016-05-09 | 2020-06-03 | キヤノン株式会社 | 基板処理装置、および物品製造方法 |
| JP7247743B2 (ja) * | 2019-05-20 | 2023-03-29 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2022
- 2022-04-27 WO PCT/JP2022/019169 patent/WO2023209897A1/ja active Application Filing
-
2023
- 2023-02-03 WO PCT/JP2023/003610 patent/WO2023210088A1/ja active Application Filing
- 2023-02-03 JP JP2024517843A patent/JPWO2023210088A1/ja active Pending
- 2023-04-20 TW TW112114670A patent/TW202401536A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023209897A1 (ja) | 2023-11-02 |
| TW202401536A (zh) | 2024-01-01 |
| WO2023210088A1 (ja) | 2023-11-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240913 |