JPWO2023199639A5 - - Google Patents

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Publication number
JPWO2023199639A5
JPWO2023199639A5 JP2024514840A JP2024514840A JPWO2023199639A5 JP WO2023199639 A5 JPWO2023199639 A5 JP WO2023199639A5 JP 2024514840 A JP2024514840 A JP 2024514840A JP 2024514840 A JP2024514840 A JP 2024514840A JP WO2023199639 A5 JPWO2023199639 A5 JP WO2023199639A5
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JP
Japan
Prior art keywords
disposed
conductive plate
connection portion
external terminal
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024514840A
Other languages
English (en)
Japanese (ja)
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JPWO2023199639A1 (https=
JP7694817B2 (ja
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Priority claimed from PCT/JP2023/007947 external-priority patent/WO2023199639A1/ja
Publication of JPWO2023199639A1 publication Critical patent/JPWO2023199639A1/ja
Publication of JPWO2023199639A5 publication Critical patent/JPWO2023199639A5/ja
Application granted granted Critical
Publication of JP7694817B2 publication Critical patent/JP7694817B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024514840A 2022-04-13 2023-03-03 半導体装置 Active JP7694817B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022065969 2022-04-13
JP2022065969 2022-04-13
PCT/JP2023/007947 WO2023199639A1 (ja) 2022-04-13 2023-03-03 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023199639A1 JPWO2023199639A1 (https=) 2023-10-19
JPWO2023199639A5 true JPWO2023199639A5 (https=) 2024-06-25
JP7694817B2 JP7694817B2 (ja) 2025-06-18

Family

ID=88329348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514840A Active JP7694817B2 (ja) 2022-04-13 2023-03-03 半導体装置

Country Status (5)

Country Link
US (1) US20240223101A1 (https=)
JP (1) JP7694817B2 (https=)
CN (1) CN117918040A (https=)
DE (1) DE112023000179T5 (https=)
WO (1) WO2023199639A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564937B2 (ja) * 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
WO2017163612A1 (ja) 2016-03-24 2017-09-28 株式会社日立製作所 パワー半導体モジュール
US10212838B2 (en) 2017-01-13 2019-02-19 Cree Fayetteville, Inc. High power multilayer module having low inductance and fast switching for paralleling power devices
JP6912560B2 (ja) 2017-04-19 2021-08-04 三菱電機株式会社 半導体モジュールおよび電力変換装置
CN111801795B (zh) * 2018-09-14 2024-11-12 富士电机株式会社 半导体装置
JP6908012B2 (ja) * 2018-10-01 2021-07-21 株式会社デンソー 半導体モジュール
JP7428018B2 (ja) * 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール
JP7532813B2 (ja) 2020-03-06 2024-08-14 富士電機株式会社 半導体モジュール
JP7428017B2 (ja) 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール
JP7428019B2 (ja) 2020-03-06 2024-02-06 富士電機株式会社 半導体モジュール

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