JPWO2023190786A5 - - Google Patents

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Publication number
JPWO2023190786A5
JPWO2023190786A5 JP2024512744A JP2024512744A JPWO2023190786A5 JP WO2023190786 A5 JPWO2023190786 A5 JP WO2023190786A5 JP 2024512744 A JP2024512744 A JP 2024512744A JP 2024512744 A JP2024512744 A JP 2024512744A JP WO2023190786 A5 JPWO2023190786 A5 JP WO2023190786A5
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JP
Japan
Prior art keywords
flow path
structure according
metal wiring
metal
path structure
Prior art date
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Application number
JP2024512744A
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English (en)
Japanese (ja)
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JP7780003B2 (ja
JPWO2023190786A1 (https=
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Priority claimed from PCT/JP2023/013014 external-priority patent/WO2023190786A1/ja
Publication of JPWO2023190786A1 publication Critical patent/JPWO2023190786A1/ja
Publication of JPWO2023190786A5 publication Critical patent/JPWO2023190786A5/ja
Application granted granted Critical
Publication of JP7780003B2 publication Critical patent/JP7780003B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024512744A 2022-03-29 2023-03-29 流路構造体および半導体製造装置 Active JP7780003B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022054592 2022-03-29
JP2022054592 2022-03-29
PCT/JP2023/013014 WO2023190786A1 (ja) 2022-03-29 2023-03-29 流路構造体および半導体製造装置

Publications (3)

Publication Number Publication Date
JPWO2023190786A1 JPWO2023190786A1 (https=) 2023-10-05
JPWO2023190786A5 true JPWO2023190786A5 (https=) 2024-11-21
JP7780003B2 JP7780003B2 (ja) 2025-12-03

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ID=88202631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512744A Active JP7780003B2 (ja) 2022-03-29 2023-03-29 流路構造体および半導体製造装置

Country Status (4)

Country Link
US (1) US20250201600A1 (https=)
JP (1) JP7780003B2 (https=)
KR (1) KR20240152374A (https=)
WO (1) WO2023190786A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4260404B2 (ja) * 2001-02-09 2009-04-30 東京エレクトロン株式会社 成膜装置
TWI815813B (zh) * 2017-08-04 2023-09-21 荷蘭商Ａｓｍ智慧財產控股公司 用於分配反應腔內氣體的噴頭總成
JP7278035B2 (ja) * 2018-06-20 2023-05-19 新光電気工業株式会社 静電チャック、基板固定装置
JP7458808B2 (ja) 2020-02-07 2024-04-01 東京エレクトロン株式会社 プロセス推定システム、プロセスデータ推定方法及びプログラム
JP2021176192A (ja) * 2020-04-22 2021-11-04 京セラ株式会社 流路構造体および半導体製造装置

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