JPWO2023189549A5 - - Google Patents

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Publication number
JPWO2023189549A5
JPWO2023189549A5 JP2024511726A JP2024511726A JPWO2023189549A5 JP WO2023189549 A5 JPWO2023189549 A5 JP WO2023189549A5 JP 2024511726 A JP2024511726 A JP 2024511726A JP 2024511726 A JP2024511726 A JP 2024511726A JP WO2023189549 A5 JPWO2023189549 A5 JP WO2023189549A5
Authority
JP
Japan
Prior art keywords
metal oxide
layer
semiconductor device
oxide layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511726A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189549A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/009876 external-priority patent/WO2023189549A1/ja
Publication of JPWO2023189549A1 publication Critical patent/JPWO2023189549A1/ja
Publication of JPWO2023189549A5 publication Critical patent/JPWO2023189549A5/ja
Pending legal-status Critical Current

Links

JP2024511726A 2022-03-30 2023-03-14 Pending JPWO2023189549A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022057450 2022-03-30
PCT/JP2023/009876 WO2023189549A1 (ja) 2022-03-30 2023-03-14 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023189549A1 JPWO2023189549A1 (https=) 2023-10-05
JPWO2023189549A5 true JPWO2023189549A5 (https=) 2026-03-18

Family

ID=88201565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511726A Pending JPWO2023189549A1 (https=) 2022-03-30 2023-03-14

Country Status (4)

Country Link
US (1) US20250015168A1 (https=)
JP (1) JPWO2023189549A1 (https=)
CN (1) CN118872076A (https=)
WO (1) WO2023189549A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5939812B2 (ja) * 2012-01-26 2016-06-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP7126823B2 (ja) * 2016-12-23 2022-08-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2019220530A (ja) * 2018-06-18 2019-12-26 株式会社ジャパンディスプレイ 半導体装置
US11069796B2 (en) * 2018-08-09 2021-07-20 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device

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