JPWO2023189188A5 - - Google Patents
Info
- Publication number
- JPWO2023189188A5 JPWO2023189188A5 JP2024511551A JP2024511551A JPWO2023189188A5 JP WO2023189188 A5 JPWO2023189188 A5 JP WO2023189188A5 JP 2024511551 A JP2024511551 A JP 2024511551A JP 2024511551 A JP2024511551 A JP 2024511551A JP WO2023189188 A5 JPWO2023189188 A5 JP WO2023189188A5
- Authority
- JP
- Japan
- Prior art keywords
- solvent component
- bonding layer
- mass
- thermoplastic resin
- bonded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022061261 | 2022-03-31 | ||
| PCT/JP2023/007911 WO2023189188A1 (ja) | 2022-03-31 | 2023-03-02 | 接合体及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189188A1 JPWO2023189188A1 (cg-RX-API-DMAC7.html) | 2023-10-05 |
| JPWO2023189188A5 true JPWO2023189188A5 (cg-RX-API-DMAC7.html) | 2026-02-06 |
Family
ID=88201179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511551A Pending JPWO2023189188A1 (cg-RX-API-DMAC7.html) | 2022-03-31 | 2023-03-02 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250187304A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4501628A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023189188A1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN118434566A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023189188A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025197861A1 (ja) * | 2024-03-19 | 2025-09-25 | 日本ゼオン株式会社 | 接合体及びその製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10286911A (ja) * | 1997-04-14 | 1998-10-27 | Nippon Zeon Co Ltd | 積層体 |
| JP3882706B2 (ja) * | 2002-07-26 | 2007-02-21 | Ｊｓｒ株式会社 | 環状オレフィン系付加重合体を含むコーティング材で被覆された基材、および積層材 |
| JP4021391B2 (ja) * | 2003-09-09 | 2007-12-12 | 住友ベークライト株式会社 | マイクロチップ基板の接合方法及びマイクロチップ |
| US20090221750A1 (en) * | 2005-03-22 | 2009-09-03 | Zeon Corporation | Thermoplastic Resin, Method for Producing Same and Molding Material |
| WO2009131070A1 (ja) * | 2008-04-22 | 2009-10-29 | アルプス電気株式会社 | 接合部材及びその製造方法 |
| JP5561271B2 (ja) | 2009-03-26 | 2014-07-30 | 日本ゼオン株式会社 | 樹脂組成物、樹脂膜及び電子部品 |
| JP6123596B2 (ja) | 2013-09-11 | 2017-05-10 | 日本ゼオン株式会社 | 結晶性樹脂組成物 |
| JP6776553B2 (ja) * | 2016-03-02 | 2020-10-28 | コニカミノルタ株式会社 | 偏光板保護フィルム |
| WO2017199980A1 (ja) | 2016-05-16 | 2017-11-23 | 日本ゼオン株式会社 | 水素化重合体、成形材料および樹脂成形体 |
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2023
- 2023-03-02 CN CN202380015525.XA patent/CN118434566A/zh active Pending
- 2023-03-02 US US18/843,410 patent/US20250187304A1/en active Pending
- 2023-03-02 JP JP2024511551A patent/JPWO2023189188A1/ja active Pending
- 2023-03-02 WO PCT/JP2023/007911 patent/WO2023189188A1/ja not_active Ceased
- 2023-03-02 EP EP23779217.1A patent/EP4501628A1/en active Pending