JPWO2023181928A5 - - Google Patents

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Publication number
JPWO2023181928A5
JPWO2023181928A5 JP2024509969A JP2024509969A JPWO2023181928A5 JP WO2023181928 A5 JPWO2023181928 A5 JP WO2023181928A5 JP 2024509969 A JP2024509969 A JP 2024509969A JP 2024509969 A JP2024509969 A JP 2024509969A JP WO2023181928 A5 JPWO2023181928 A5 JP WO2023181928A5
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JP
Japan
Prior art keywords
water
soluble polymer
content
polishing composition
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024509969A
Other languages
English (en)
Japanese (ja)
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JPWO2023181928A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008722 external-priority patent/WO2023181928A1/ja
Publication of JPWO2023181928A1 publication Critical patent/JPWO2023181928A1/ja
Publication of JPWO2023181928A5 publication Critical patent/JPWO2023181928A5/ja
Pending legal-status Critical Current

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JP2024509969A 2022-03-23 2023-03-08 Pending JPWO2023181928A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022047438 2022-03-23
PCT/JP2023/008722 WO2023181928A1 (ja) 2022-03-23 2023-03-08 研磨用組成物

Publications (2)

Publication Number Publication Date
JPWO2023181928A1 JPWO2023181928A1 (https=) 2023-09-28
JPWO2023181928A5 true JPWO2023181928A5 (https=) 2024-11-29

Family

ID=88101249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509969A Pending JPWO2023181928A1 (https=) 2022-03-23 2023-03-08

Country Status (6)

Country Link
EP (1) EP4498403A4 (https=)
JP (1) JPWO2023181928A1 (https=)
KR (1) KR20240167843A (https=)
CN (1) CN118985038A (https=)
TW (1) TW202346501A (https=)
WO (1) WO2023181928A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026070694A1 (ja) * 2024-09-26 2026-04-02 株式会社フジミインコーポレーテッド 研磨用組成物
WO2026070693A1 (ja) * 2024-09-26 2026-04-02 株式会社フジミインコーポレーテッド 研磨用組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897200U (ja) 1981-12-23 1983-07-01 東北開発株式会社 繊維板
JPS6037416U (ja) 1983-08-23 1985-03-15 富士重工業株式会社 空調ダクト構造
JPH0436264Y2 (https=) 1984-11-09 1992-08-27
JPS6232243U (https=) 1985-08-13 1987-02-26
EP2957613B1 (en) 2013-02-13 2020-11-18 Fujimi Incorporated Polishing composition, method for producing polishing composition and method for producing polished article
KR102239045B1 (ko) 2013-06-07 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 실리콘 웨이퍼 연마용 조성물
JP6232243B2 (ja) 2013-10-09 2017-11-15 東亞合成株式会社 半導体用濡れ剤及び研磨用組成物
JP6185432B2 (ja) 2014-06-24 2017-08-23 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
EP3546542A4 (en) * 2016-11-22 2020-07-22 Fujimi Incorporated POLISHING COMPOSITION
JP7166819B2 (ja) * 2018-07-13 2022-11-08 Cmcマテリアルズ株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
JP7280158B2 (ja) * 2019-03-15 2023-05-23 株式会社フジミインコーポレーテッド 表面処理組成物
JP7353051B2 (ja) * 2019-03-26 2023-09-29 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物
JP7349309B2 (ja) * 2019-09-30 2023-09-22 株式会社フジミインコーポレーテッド シリコンウェーハ用研磨用組成物
JP7477964B2 (ja) * 2019-12-13 2024-05-02 インテグリス・インコーポレーテッド 化学機械研磨組成物及びそれを用いた化学機械研磨方法
JP2022047438A (ja) 2020-09-11 2022-03-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器

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