JPWO2023181928A1 - - Google Patents
Info
- Publication number
- JPWO2023181928A1 JPWO2023181928A1 JP2024509969A JP2024509969A JPWO2023181928A1 JP WO2023181928 A1 JPWO2023181928 A1 JP WO2023181928A1 JP 2024509969 A JP2024509969 A JP 2024509969A JP 2024509969 A JP2024509969 A JP 2024509969A JP WO2023181928 A1 JPWO2023181928 A1 JP WO2023181928A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
- C08L1/26—Cellulose ethers
- C08L1/28—Alkyl ethers
- C08L1/284—Alkyl ethers with hydroxylated hydrocarbon radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
- C08L29/02—Homopolymers or copolymers of unsaturated alcohols
- C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/24—Homopolymers or copolymers of amides or imides
- C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022047438 | 2022-03-23 | ||
| PCT/JP2023/008722 WO2023181928A1 (ja) | 2022-03-23 | 2023-03-08 | 研磨用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023181928A1 true JPWO2023181928A1 (https=) | 2023-09-28 |
| JPWO2023181928A5 JPWO2023181928A5 (https=) | 2024-11-29 |
Family
ID=88101249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509969A Pending JPWO2023181928A1 (https=) | 2022-03-23 | 2023-03-08 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4498403A4 (https=) |
| JP (1) | JPWO2023181928A1 (https=) |
| KR (1) | KR20240167843A (https=) |
| CN (1) | CN118985038A (https=) |
| TW (1) | TW202346501A (https=) |
| WO (1) | WO2023181928A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026070694A1 (ja) * | 2024-09-26 | 2026-04-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2026070693A1 (ja) * | 2024-09-26 | 2026-04-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897200U (ja) | 1981-12-23 | 1983-07-01 | 東北開発株式会社 | 繊維板 |
| JPS6037416U (ja) | 1983-08-23 | 1985-03-15 | 富士重工業株式会社 | 空調ダクト構造 |
| JPH0436264Y2 (https=) | 1984-11-09 | 1992-08-27 | ||
| JPS6232243U (https=) | 1985-08-13 | 1987-02-26 | ||
| EP2957613B1 (en) | 2013-02-13 | 2020-11-18 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and method for producing polished article |
| KR102239045B1 (ko) | 2013-06-07 | 2021-04-12 | 가부시키가이샤 후지미인코퍼레이티드 | 실리콘 웨이퍼 연마용 조성물 |
| JP6232243B2 (ja) | 2013-10-09 | 2017-11-15 | 東亞合成株式会社 | 半導体用濡れ剤及び研磨用組成物 |
| JP6185432B2 (ja) | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| EP3546542A4 (en) * | 2016-11-22 | 2020-07-22 | Fujimi Incorporated | POLISHING COMPOSITION |
| JP7166819B2 (ja) * | 2018-07-13 | 2022-11-08 | Ｃｍｃマテリアルズ株式会社 | 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法 |
| JP7280158B2 (ja) * | 2019-03-15 | 2023-05-23 | 株式会社フジミインコーポレーテッド | 表面処理組成物 |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7349309B2 (ja) * | 2019-09-30 | 2023-09-22 | 株式会社フジミインコーポレーテッド | シリコンウェーハ用研磨用組成物 |
| JP7477964B2 (ja) * | 2019-12-13 | 2024-05-02 | インテグリス・インコーポレーテッド | 化学機械研磨組成物及びそれを用いた化学機械研磨方法 |
| JP2022047438A (ja) | 2020-09-11 | 2022-03-24 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
-
2023
- 2023-03-08 WO PCT/JP2023/008722 patent/WO2023181928A1/ja not_active Ceased
- 2023-03-08 EP EP23774527.8A patent/EP4498403A4/en active Pending
- 2023-03-08 JP JP2024509969A patent/JPWO2023181928A1/ja active Pending
- 2023-03-08 CN CN202380028802.0A patent/CN118985038A/zh active Pending
- 2023-03-08 KR KR1020247034792A patent/KR20240167843A/ko active Pending
- 2023-03-21 TW TW112110404A patent/TW202346501A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240167843A (ko) | 2024-11-28 |
| TW202346501A (zh) | 2023-12-01 |
| EP4498403A4 (en) | 2026-03-18 |
| EP4498403A1 (en) | 2025-01-29 |
| WO2023181928A1 (ja) | 2023-09-28 |
| CN118985038A (zh) | 2024-11-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240828 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250917 |