JPWO2023176643A5 - - Google Patents

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Publication number
JPWO2023176643A5
JPWO2023176643A5 JP2024507811A JP2024507811A JPWO2023176643A5 JP WO2023176643 A5 JPWO2023176643 A5 JP WO2023176643A5 JP 2024507811 A JP2024507811 A JP 2024507811A JP 2024507811 A JP2024507811 A JP 2024507811A JP WO2023176643 A5 JPWO2023176643 A5 JP WO2023176643A5
Authority
JP
Japan
Prior art keywords
inner layer
laminate
multilayer substrate
resin
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024507811A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023176643A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008894 external-priority patent/WO2023176643A1/ja
Publication of JPWO2023176643A1 publication Critical patent/JPWO2023176643A1/ja
Publication of JPWO2023176643A5 publication Critical patent/JPWO2023176643A5/ja
Pending legal-status Critical Current

Links

JP2024507811A 2022-03-17 2023-03-08 Pending JPWO2023176643A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022042984 2022-03-17
PCT/JP2023/008894 WO2023176643A1 (ja) 2022-03-17 2023-03-08 多層基板

Publications (2)

Publication Number Publication Date
JPWO2023176643A1 JPWO2023176643A1 (https=) 2023-09-21
JPWO2023176643A5 true JPWO2023176643A5 (https=) 2024-09-19

Family

ID=88023165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507811A Pending JPWO2023176643A1 (https=) 2022-03-17 2023-03-08

Country Status (4)

Country Link
US (1) US20240373549A1 (https=)
JP (1) JPWO2023176643A1 (https=)
CN (1) CN223261692U (https=)
WO (1) WO2023176643A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025121093A1 (ja) * 2023-12-07 2025-06-12 日東電工株式会社 フレキシブル多層回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712607A (en) * 1996-04-12 1998-01-27 Dittmer; Timothy W. Air-dielectric stripline
JP5050797B2 (ja) * 2007-11-16 2012-10-17 日立電線株式会社 フレキシブルプリント配線板
JP2011066086A (ja) * 2009-09-15 2011-03-31 Toshiba Corp フレキシブル配線板アレイとその製造方法及びフレキシブル配線装置
JP5704144B2 (ja) * 2012-10-10 2015-04-22 株式会社村田製作所 高周波信号線路及びその製造方法
US9894750B2 (en) * 2012-12-20 2018-02-13 3M Innovative Properties Company Floating connector shield
JP6362444B2 (ja) * 2014-06-16 2018-07-25 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
CN106332434B (zh) * 2015-06-24 2019-01-04 鹏鼎控股(深圳)股份有限公司 柔性线路板及其制作方法
CN218788856U (zh) * 2020-04-24 2023-04-04 株式会社村田制作所 信号传输线路

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