JPWO2023176643A1 - - Google Patents

Info

Publication number
JPWO2023176643A1
JPWO2023176643A1 JP2024507811A JP2024507811A JPWO2023176643A1 JP WO2023176643 A1 JPWO2023176643 A1 JP WO2023176643A1 JP 2024507811 A JP2024507811 A JP 2024507811A JP 2024507811 A JP2024507811 A JP 2024507811A JP WO2023176643 A1 JPWO2023176643 A1 JP WO2023176643A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024507811A
Other languages
Japanese (ja)
Other versions
JPWO2023176643A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023176643A1 publication Critical patent/JPWO2023176643A1/ja
Publication of JPWO2023176643A5 publication Critical patent/JPWO2023176643A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2024507811A 2022-03-17 2023-03-08 Pending JPWO2023176643A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022042984 2022-03-17
PCT/JP2023/008894 WO2023176643A1 (ja) 2022-03-17 2023-03-08 多層基板

Publications (2)

Publication Number Publication Date
JPWO2023176643A1 true JPWO2023176643A1 (https=) 2023-09-21
JPWO2023176643A5 JPWO2023176643A5 (https=) 2024-09-19

Family

ID=88023165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507811A Pending JPWO2023176643A1 (https=) 2022-03-17 2023-03-08

Country Status (4)

Country Link
US (1) US20240373549A1 (https=)
JP (1) JPWO2023176643A1 (https=)
CN (1) CN223261692U (https=)
WO (1) WO2023176643A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025121093A1 (ja) * 2023-12-07 2025-06-12 日東電工株式会社 フレキシブル多層回路基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124044A (ja) * 2007-11-16 2009-06-04 Hitachi Cable Ltd フレキシブルプリント配線板
JP2011066086A (ja) * 2009-09-15 2011-03-31 Toshiba Corp フレキシブル配線板アレイとその製造方法及びフレキシブル配線装置
JP2014078835A (ja) * 2012-10-10 2014-05-01 Murata Mfg Co Ltd 高周波信号線路及びその製造方法
JP2016509391A (ja) * 2012-12-20 2016-03-24 スリーエム イノベイティブ プロパティズ カンパニー フローティングコネクタシールド
US20160381786A1 (en) * 2015-06-24 2016-12-29 Fukui Precision Component (Shenzhen) Co., Ltd. Flexible circuit board and method for manufacturing same
WO2021215216A1 (ja) * 2020-04-24 2021-10-28 株式会社村田製作所 信号伝送線路

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712607A (en) * 1996-04-12 1998-01-27 Dittmer; Timothy W. Air-dielectric stripline
JP6362444B2 (ja) * 2014-06-16 2018-07-25 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009124044A (ja) * 2007-11-16 2009-06-04 Hitachi Cable Ltd フレキシブルプリント配線板
JP2011066086A (ja) * 2009-09-15 2011-03-31 Toshiba Corp フレキシブル配線板アレイとその製造方法及びフレキシブル配線装置
JP2014078835A (ja) * 2012-10-10 2014-05-01 Murata Mfg Co Ltd 高周波信号線路及びその製造方法
JP2016509391A (ja) * 2012-12-20 2016-03-24 スリーエム イノベイティブ プロパティズ カンパニー フローティングコネクタシールド
US20160381786A1 (en) * 2015-06-24 2016-12-29 Fukui Precision Component (Shenzhen) Co., Ltd. Flexible circuit board and method for manufacturing same
WO2021215216A1 (ja) * 2020-04-24 2021-10-28 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
CN223261692U (zh) 2025-08-22
WO2023176643A1 (ja) 2023-09-21
US20240373549A1 (en) 2024-11-07
WO2023176643A9 (ja) 2024-01-18

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