CN223261692U - 多层基板 - Google Patents

多层基板

Info

Publication number
CN223261692U
CN223261692U CN202390000242.3U CN202390000242U CN223261692U CN 223261692 U CN223261692 U CN 223261692U CN 202390000242 U CN202390000242 U CN 202390000242U CN 223261692 U CN223261692 U CN 223261692U
Authority
CN
China
Prior art keywords
multilayer substrate
inner layer
laminate
conductors
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202390000242.3U
Other languages
English (en)
Chinese (zh)
Inventor
桂智则
清水康辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN223261692U publication Critical patent/CN223261692U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN202390000242.3U 2022-03-17 2023-03-08 多层基板 Active CN223261692U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022042984 2022-03-17
JP2022-042984 2022-03-17
PCT/JP2023/008894 WO2023176643A1 (ja) 2022-03-17 2023-03-08 多層基板

Publications (1)

Publication Number Publication Date
CN223261692U true CN223261692U (zh) 2025-08-22

Family

ID=88023165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202390000242.3U Active CN223261692U (zh) 2022-03-17 2023-03-08 多层基板

Country Status (4)

Country Link
US (1) US20240373549A1 (https=)
JP (1) JPWO2023176643A1 (https=)
CN (1) CN223261692U (https=)
WO (1) WO2023176643A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025121093A1 (ja) * 2023-12-07 2025-06-12 日東電工株式会社 フレキシブル多層回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712607A (en) * 1996-04-12 1998-01-27 Dittmer; Timothy W. Air-dielectric stripline
JP5050797B2 (ja) * 2007-11-16 2012-10-17 日立電線株式会社 フレキシブルプリント配線板
JP2011066086A (ja) * 2009-09-15 2011-03-31 Toshiba Corp フレキシブル配線板アレイとその製造方法及びフレキシブル配線装置
JP5704144B2 (ja) * 2012-10-10 2015-04-22 株式会社村田製作所 高周波信号線路及びその製造方法
US9894750B2 (en) * 2012-12-20 2018-02-13 3M Innovative Properties Company Floating connector shield
JP6362444B2 (ja) * 2014-06-16 2018-07-25 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
CN106332434B (zh) * 2015-06-24 2019-01-04 鹏鼎控股(深圳)股份有限公司 柔性线路板及其制作方法
CN218788856U (zh) * 2020-04-24 2023-04-04 株式会社村田制作所 信号传输线路

Also Published As

Publication number Publication date
JPWO2023176643A1 (https=) 2023-09-21
WO2023176643A1 (ja) 2023-09-21
US20240373549A1 (en) 2024-11-07
WO2023176643A9 (ja) 2024-01-18

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