JPWO2023153222A1 - - Google Patents
Info
- Publication number
- JPWO2023153222A1 JPWO2023153222A1 JP2023580165A JP2023580165A JPWO2023153222A1 JP WO2023153222 A1 JPWO2023153222 A1 JP WO2023153222A1 JP 2023580165 A JP2023580165 A JP 2023580165A JP 2023580165 A JP2023580165 A JP 2023580165A JP WO2023153222 A1 JPWO2023153222 A1 JP WO2023153222A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/80—Cleaning only by supercritical fluids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022018193 | 2022-02-08 | ||
| JP2022018193 | 2022-02-08 | ||
| PCT/JP2023/002392 WO2023153222A1 (ja) | 2022-02-08 | 2023-01-26 | 基板処理装置、および基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023153222A1 true JPWO2023153222A1 (https=) | 2023-08-17 |
| JP7738685B2 JP7738685B2 (ja) | 2025-09-12 |
Family
ID=87564119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023580165A Active JP7738685B2 (ja) | 2022-02-08 | 2023-01-26 | 基板処理装置、および基板処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250140585A1 (https=) |
| JP (1) | JP7738685B2 (https=) |
| KR (1) | KR20240148851A (https=) |
| CN (1) | CN118633142A (https=) |
| TW (1) | TW202339058A (https=) |
| WO (1) | WO2023153222A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187570A (ja) * | 2010-03-05 | 2011-09-22 | Tokyo Electron Ltd | 超臨界処理装置及び超臨界処理方法 |
| WO2012165377A1 (ja) * | 2011-05-30 | 2012-12-06 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記憶媒体 |
| JP2013026348A (ja) * | 2011-07-19 | 2013-02-04 | Toshiba Corp | 半導体基板の超臨界乾燥方法及び装置 |
| US20130239996A1 (en) * | 2010-06-25 | 2013-09-19 | Anastasios J. Tousimis | Integrated processing and critical point drying systems for semiconductor and mems devices |
| US20200411344A1 (en) * | 2019-06-27 | 2020-12-31 | Semes Co., Ltd. | Apparatus for treating substrate |
| JP2021086857A (ja) * | 2019-11-25 | 2021-06-03 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2023
- 2023-01-26 CN CN202380019176.9A patent/CN118633142A/zh active Pending
- 2023-01-26 KR KR1020247028696A patent/KR20240148851A/ko active Pending
- 2023-01-26 US US18/835,377 patent/US20250140585A1/en active Pending
- 2023-01-26 WO PCT/JP2023/002392 patent/WO2023153222A1/ja not_active Ceased
- 2023-01-26 JP JP2023580165A patent/JP7738685B2/ja active Active
- 2023-01-30 TW TW112102916A patent/TW202339058A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011187570A (ja) * | 2010-03-05 | 2011-09-22 | Tokyo Electron Ltd | 超臨界処理装置及び超臨界処理方法 |
| US20130239996A1 (en) * | 2010-06-25 | 2013-09-19 | Anastasios J. Tousimis | Integrated processing and critical point drying systems for semiconductor and mems devices |
| WO2012165377A1 (ja) * | 2011-05-30 | 2012-12-06 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記憶媒体 |
| JP2013026348A (ja) * | 2011-07-19 | 2013-02-04 | Toshiba Corp | 半導体基板の超臨界乾燥方法及び装置 |
| US20200411344A1 (en) * | 2019-06-27 | 2020-12-31 | Semes Co., Ltd. | Apparatus for treating substrate |
| JP2021086857A (ja) * | 2019-11-25 | 2021-06-03 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250140585A1 (en) | 2025-05-01 |
| TW202339058A (zh) | 2023-10-01 |
| WO2023153222A1 (ja) | 2023-08-17 |
| CN118633142A (zh) | 2024-09-10 |
| KR20240148851A (ko) | 2024-10-11 |
| JP7738685B2 (ja) | 2025-09-12 |
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