JPWO2023136253A1 - - Google Patents

Info

Publication number
JPWO2023136253A1
JPWO2023136253A1 JP2023574042A JP2023574042A JPWO2023136253A1 JP WO2023136253 A1 JPWO2023136253 A1 JP WO2023136253A1 JP 2023574042 A JP2023574042 A JP 2023574042A JP 2023574042 A JP2023574042 A JP 2023574042A JP WO2023136253 A1 JPWO2023136253 A1 JP WO2023136253A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023574042A
Other languages
Japanese (ja)
Other versions
JPWO2023136253A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023136253A1 publication Critical patent/JPWO2023136253A1/ja
Publication of JPWO2023136253A5 publication Critical patent/JPWO2023136253A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP2023574042A 2022-01-13 2023-01-11 Pending JPWO2023136253A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022003660 2022-01-13
PCT/JP2023/000390 WO2023136253A1 (ja) 2022-01-13 2023-01-11 回路基板の製造方法及びそれに用いる樹脂シート

Publications (2)

Publication Number Publication Date
JPWO2023136253A1 true JPWO2023136253A1 (https=) 2023-07-20
JPWO2023136253A5 JPWO2023136253A5 (https=) 2025-05-21

Family

ID=87279096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574042A Pending JPWO2023136253A1 (https=) 2022-01-13 2023-01-11

Country Status (6)

Country Link
US (1) US20240371823A1 (https=)
JP (1) JPWO2023136253A1 (https=)
KR (1) KR20240136339A (https=)
CN (1) CN118648099A (https=)
TW (1) TW202343693A (https=)
WO (1) WO2023136253A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM632394U (zh) * 2022-06-15 2022-09-21 晶化科技股份有限公司 扇出型電子封裝結構

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221417A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2004221418A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
WO2009113216A1 (ja) * 2008-03-10 2009-09-17 古河電気工業株式会社 電子部品加工用粘着テープ
JP2013128060A (ja) * 2011-12-19 2013-06-27 Nitto Denko Corp 半導体装置の製造方法
US20150031215A1 (en) * 2013-07-29 2015-01-29 3M Innovative Properties Company Apparatus, hybrid laminated body, method and materials for temporary substrate support
JP2015065321A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
WO2016063916A1 (ja) * 2014-10-23 2016-04-28 リンテック株式会社 表面保護用シート
JP2018012748A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
WO2019026266A1 (ja) * 2017-08-04 2019-02-07 リンテック株式会社 半導体装置の製造方法
JP2019033124A (ja) * 2017-08-04 2019-02-28 リンテック株式会社 半導体装置の製造方法、及び接着積層体
WO2019073763A1 (ja) * 2017-10-10 2019-04-18 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JP2019183070A (ja) * 2018-04-16 2019-10-24 味の素株式会社 樹脂組成物
JP2020117671A (ja) * 2019-01-28 2020-08-06 株式会社ダイセル 硬化性フイルム
JP2021027279A (ja) * 2019-08-08 2021-02-22 新光電気工業株式会社 配線基板の製造方法及び積層構造
US20210233852A1 (en) * 2020-01-29 2021-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Package and Method
JP2021187923A (ja) * 2020-05-28 2021-12-13 味の素株式会社 樹脂組成物
JP2022056522A (ja) * 2020-09-30 2022-04-11 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102090449B1 (ko) 2016-03-31 2020-03-18 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법 및 반도체 장치
JP7067140B2 (ja) * 2017-03-29 2022-05-16 味の素株式会社 樹脂組成物

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221417A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2004221418A (ja) * 2003-01-16 2004-08-05 Casio Comput Co Ltd 半導体装置およびその製造方法
WO2009113216A1 (ja) * 2008-03-10 2009-09-17 古河電気工業株式会社 電子部品加工用粘着テープ
JP2013128060A (ja) * 2011-12-19 2013-06-27 Nitto Denko Corp 半導体装置の製造方法
US20150031215A1 (en) * 2013-07-29 2015-01-29 3M Innovative Properties Company Apparatus, hybrid laminated body, method and materials for temporary substrate support
JP2015065321A (ja) * 2013-09-25 2015-04-09 日東電工株式会社 半導体装置の製造方法
WO2016063916A1 (ja) * 2014-10-23 2016-04-28 リンテック株式会社 表面保護用シート
JP2018012748A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 半導体再配線層形成用樹脂フィルム、半導体再配線層形成用複合フィルム、それらを用いた半導体装置及び半導体装置の製造方法
JP2018184595A (ja) * 2017-04-24 2018-11-22 味の素株式会社 樹脂組成物
WO2019021672A1 (ja) * 2017-07-26 2019-01-31 日本電気硝子株式会社 支持ガラス基板及びこれを用いた積層基板
WO2019026266A1 (ja) * 2017-08-04 2019-02-07 リンテック株式会社 半導体装置の製造方法
JP2019033124A (ja) * 2017-08-04 2019-02-28 リンテック株式会社 半導体装置の製造方法、及び接着積層体
WO2019073763A1 (ja) * 2017-10-10 2019-04-18 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
JP2019183070A (ja) * 2018-04-16 2019-10-24 味の素株式会社 樹脂組成物
JP2020117671A (ja) * 2019-01-28 2020-08-06 株式会社ダイセル 硬化性フイルム
JP2021027279A (ja) * 2019-08-08 2021-02-22 新光電気工業株式会社 配線基板の製造方法及び積層構造
US20210233852A1 (en) * 2020-01-29 2021-07-29 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Package and Method
JP2021187923A (ja) * 2020-05-28 2021-12-13 味の素株式会社 樹脂組成物
JP2022056522A (ja) * 2020-09-30 2022-04-11 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法

Also Published As

Publication number Publication date
KR20240136339A (ko) 2024-09-13
WO2023136253A1 (ja) 2023-07-20
CN118648099A (zh) 2024-09-13
US20240371823A1 (en) 2024-11-07
TW202343693A (zh) 2023-11-01

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