JPWO2023127317A1 - - Google Patents
Info
- Publication number
- JPWO2023127317A1 JPWO2023127317A1 JP2023570717A JP2023570717A JPWO2023127317A1 JP WO2023127317 A1 JPWO2023127317 A1 JP WO2023127317A1 JP 2023570717 A JP2023570717 A JP 2023570717A JP 2023570717 A JP2023570717 A JP 2023570717A JP WO2023127317 A1 JPWO2023127317 A1 JP WO2023127317A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
- H02M1/0051—Diode reverse recovery losses
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Dc-Dc Converters (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021212199 | 2021-12-27 | ||
| JP2021212199 | 2021-12-27 | ||
| PCT/JP2022/041620 WO2023127317A1 (ja) | 2021-12-27 | 2022-11-08 | 半導体モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023127317A1 true JPWO2023127317A1 (https=) | 2023-07-06 |
| JPWO2023127317A5 JPWO2023127317A5 (https=) | 2024-03-06 |
| JP7601262B2 JP7601262B2 (ja) | 2024-12-17 |
Family
ID=86998728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023570717A Active JP7601262B2 (ja) | 2021-12-27 | 2022-11-08 | 半導体モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240088796A1 (https=) |
| JP (1) | JP7601262B2 (https=) |
| CN (1) | CN117378047A (https=) |
| DE (1) | DE112022001872T5 (https=) |
| WO (1) | WO2023127317A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008757A (ja) * | 2011-06-23 | 2013-01-10 | Honda Motor Co Ltd | 半導体装置 |
| JP2017168582A (ja) * | 2016-03-15 | 2017-09-21 | 住友電気工業株式会社 | 半導体モジュール |
| WO2017159029A1 (ja) * | 2016-03-15 | 2017-09-21 | 住友電気工業株式会社 | 半導体モジュール |
| JP2020124030A (ja) * | 2019-01-30 | 2020-08-13 | 株式会社 日立パワーデバイス | パワー半導体モジュールおよびそれを用いた電力変換装置 |
| JP2021158232A (ja) * | 2020-03-27 | 2021-10-07 | 富士電機株式会社 | 半導体モジュール |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3454186B2 (ja) | 1999-05-14 | 2003-10-06 | 株式会社日立製作所 | 電力変換装置 |
| WO2015136603A1 (ja) | 2014-03-10 | 2015-09-17 | 株式会社日立製作所 | パワー半導体モジュール及びその製造検査方法 |
| JP7198168B2 (ja) | 2019-07-19 | 2022-12-28 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
-
2022
- 2022-11-08 DE DE112022001872.0T patent/DE112022001872T5/de active Pending
- 2022-11-08 JP JP2023570717A patent/JP7601262B2/ja active Active
- 2022-11-08 CN CN202280037808.XA patent/CN117378047A/zh active Pending
- 2022-11-08 WO PCT/JP2022/041620 patent/WO2023127317A1/ja not_active Ceased
-
2023
- 2023-11-16 US US18/511,954 patent/US20240088796A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008757A (ja) * | 2011-06-23 | 2013-01-10 | Honda Motor Co Ltd | 半導体装置 |
| JP2017168582A (ja) * | 2016-03-15 | 2017-09-21 | 住友電気工業株式会社 | 半導体モジュール |
| WO2017159029A1 (ja) * | 2016-03-15 | 2017-09-21 | 住友電気工業株式会社 | 半導体モジュール |
| JP2020124030A (ja) * | 2019-01-30 | 2020-08-13 | 株式会社 日立パワーデバイス | パワー半導体モジュールおよびそれを用いた電力変換装置 |
| JP2021158232A (ja) * | 2020-03-27 | 2021-10-07 | 富士電機株式会社 | 半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117378047A (zh) | 2024-01-09 |
| US20240088796A1 (en) | 2024-03-14 |
| WO2023127317A1 (ja) | 2023-07-06 |
| JP7601262B2 (ja) | 2024-12-17 |
| DE112022001872T5 (de) | 2024-01-18 |
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