JPWO2023119347A1 - - Google Patents
Info
- Publication number
- JPWO2023119347A1 JPWO2023119347A1 JP2022507852A JP2022507852A JPWO2023119347A1 JP WO2023119347 A1 JPWO2023119347 A1 JP WO2023119347A1 JP 2022507852 A JP2022507852 A JP 2022507852A JP 2022507852 A JP2022507852 A JP 2022507852A JP WO2023119347 A1 JPWO2023119347 A1 JP WO2023119347A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/046934 WO2023119347A1 (ja) | 2021-12-20 | 2021-12-20 | めっき装置のメンテナンス方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP7041795B1 JP7041795B1 (ja) | 2022-03-24 |
| JPWO2023119347A1 true JPWO2023119347A1 (ko) | 2023-06-29 |
Family
ID=81214348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507852A Active JP7041795B1 (ja) | 2021-12-20 | 2021-12-20 | めっき装置のメンテナンス方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7041795B1 (ko) |
| KR (1) | KR102549747B1 (ko) |
| CN (1) | CN115087764B (ko) |
| WO (1) | WO2023119347A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230313406A1 (en) * | 2022-04-04 | 2023-10-05 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
| US20230313405A1 (en) * | 2022-04-04 | 2023-10-05 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6821407B1 (en) | 2000-05-10 | 2004-11-23 | Novellus Systems, Inc. | Anode and anode chamber for copper electroplating |
| JP2002220698A (ja) * | 2001-01-29 | 2002-08-09 | Tokyo Electron Ltd | 液処理装置 |
| JP2007291419A (ja) * | 2006-04-21 | 2007-11-08 | Nec Electronics Corp | メッキ処理装置 |
| JP2008019496A (ja) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | 電解めっき装置および電解めっき方法 |
| CN202925116U (zh) * | 2012-09-27 | 2013-05-08 | 兰州交通大学 | 一种用于金属氯化物精炼的膜电积槽 |
| US20150068911A1 (en) * | 2013-09-12 | 2015-03-12 | Kabushiki Kaisha Toshiba | Copper plating apparatus, copper plating method and method for manufacturing semiconductor device |
| JP6485029B2 (ja) * | 2014-12-18 | 2019-03-20 | 三菱マテリアル株式会社 | 電解めっき方法及び電解めっき装置 |
| US10760178B2 (en) * | 2018-07-12 | 2020-09-01 | Lam Research Corporation | Method and apparatus for synchronized pressure regulation of separated anode chamber |
-
2021
- 2021-12-20 CN CN202180011192.4A patent/CN115087764B/zh active Active
- 2021-12-20 WO PCT/JP2021/046934 patent/WO2023119347A1/ja active Application Filing
- 2021-12-20 KR KR1020227025386A patent/KR102549747B1/ko active IP Right Grant
- 2021-12-20 JP JP2022507852A patent/JP7041795B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102549747B1 (ko) | 2023-07-03 |
| CN115087764B (zh) | 2023-02-28 |
| WO2023119347A1 (ja) | 2023-06-29 |
| CN115087764A (zh) | 2022-09-20 |
| JP7041795B1 (ja) | 2022-03-24 |
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