JPWO2023106384A1 - - Google Patents
Info
- Publication number
- JPWO2023106384A1 JPWO2023106384A1 JP2023533400A JP2023533400A JPWO2023106384A1 JP WO2023106384 A1 JPWO2023106384 A1 JP WO2023106384A1 JP 2023533400 A JP2023533400 A JP 2023533400A JP 2023533400 A JP2023533400 A JP 2023533400A JP WO2023106384 A1 JPWO2023106384 A1 JP WO2023106384A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Vapour Deposition (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023193284A JP2024020374A (ja) | 2021-12-10 | 2023-11-13 | ベーパーチャンバ用金属板、ベーパーチャンバ用金属条、ベーパーチャンバおよび電子機器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021201118 | 2021-12-10 | ||
PCT/JP2022/045376 WO2023106384A1 (ja) | 2021-12-10 | 2022-12-08 | ベーパーチャンバ用金属板、ベーパーチャンバ用金属条、ベーパーチャンバおよび電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023193284A Division JP2024020374A (ja) | 2021-12-10 | 2023-11-13 | ベーパーチャンバ用金属板、ベーパーチャンバ用金属条、ベーパーチャンバおよび電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023106384A1 true JPWO2023106384A1 (ko) | 2023-06-15 |
JPWO2023106384A5 JPWO2023106384A5 (ko) | 2023-11-10 |
Family
ID=86730534
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023533400A Pending JPWO2023106384A1 (ko) | 2021-12-10 | 2022-12-08 | |
JP2023193284A Pending JP2024020374A (ja) | 2021-12-10 | 2023-11-13 | ベーパーチャンバ用金属板、ベーパーチャンバ用金属条、ベーパーチャンバおよび電子機器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023193284A Pending JP2024020374A (ja) | 2021-12-10 | 2023-11-13 | ベーパーチャンバ用金属板、ベーパーチャンバ用金属条、ベーパーチャンバおよび電子機器 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JPWO2023106384A1 (ko) |
TW (1) | TW202332877A (ko) |
WO (1) | WO2023106384A1 (ko) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07252631A (ja) * | 1994-03-16 | 1995-10-03 | Tadahiro Omi | 不動態膜形成用オーステナイト系ステンレス鋼および不動態膜形成方法 |
JP2001032100A (ja) * | 1999-04-06 | 2001-02-06 | Crucible Materials Corp | 不動態処理表面層を有するオーステナイト系ステンレス鋼製物品 |
KR101826341B1 (ko) * | 2017-05-29 | 2018-02-06 | 주식회사 씨지아이 | 박판형 히트파이프 제조방법 |
CN112087920A (zh) * | 2020-08-12 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | 不锈钢均热板及其制造方法 |
JP2020200952A (ja) * | 2019-06-06 | 2020-12-17 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート |
CN112760630A (zh) * | 2020-12-25 | 2021-05-07 | 瑞声科技(南京)有限公司 | 散热装置的制作方法及散热装置 |
-
2022
- 2022-12-08 WO PCT/JP2022/045376 patent/WO2023106384A1/ja active Application Filing
- 2022-12-08 JP JP2023533400A patent/JPWO2023106384A1/ja active Pending
- 2022-12-09 TW TW111147358A patent/TW202332877A/zh unknown
-
2023
- 2023-11-13 JP JP2023193284A patent/JP2024020374A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07252631A (ja) * | 1994-03-16 | 1995-10-03 | Tadahiro Omi | 不動態膜形成用オーステナイト系ステンレス鋼および不動態膜形成方法 |
JP2001032100A (ja) * | 1999-04-06 | 2001-02-06 | Crucible Materials Corp | 不動態処理表面層を有するオーステナイト系ステンレス鋼製物品 |
KR101826341B1 (ko) * | 2017-05-29 | 2018-02-06 | 주식회사 씨지아이 | 박판형 히트파이프 제조방법 |
JP2020200952A (ja) * | 2019-06-06 | 2020-12-17 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート |
CN112087920A (zh) * | 2020-08-12 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | 不锈钢均热板及其制造方法 |
CN112760630A (zh) * | 2020-12-25 | 2021-05-07 | 瑞声科技(南京)有限公司 | 散热装置的制作方法及散热装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2024020374A (ja) | 2024-02-14 |
WO2023106384A1 (ja) | 2023-06-15 |
TW202332877A (zh) | 2023-08-16 |
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