JPWO2023089976A1 - - Google Patents
Info
- Publication number
- JPWO2023089976A1 JPWO2023089976A1 JP2023514035A JP2023514035A JPWO2023089976A1 JP WO2023089976 A1 JPWO2023089976 A1 JP WO2023089976A1 JP 2023514035 A JP2023514035 A JP 2023514035A JP 2023514035 A JP2023514035 A JP 2023514035A JP WO2023089976 A1 JPWO2023089976 A1 JP WO2023089976A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F16/14—Monomers containing only one unsaturated aliphatic radical
- C08F16/26—Monomers containing oxygen atoms in addition to the ether oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/46—Polyesters chemically modified by esterification
- C08G63/47—Polyesters chemically modified by esterification by unsaturated monocarboxylic acids or unsaturated monohydric alcohols or reactive derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/70—Post-treatment
- C08G2261/72—Derivatisation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021187746 | 2021-11-18 | ||
| JP2021187746 | 2021-11-18 | ||
| PCT/JP2022/037366 WO2023089976A1 (ja) | 2021-11-18 | 2022-10-06 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023089976A1 true JPWO2023089976A1 (https=) | 2023-05-25 |
| JPWO2023089976A5 JPWO2023089976A5 (https=) | 2023-10-24 |
| JP7392898B2 JP7392898B2 (ja) | 2023-12-06 |
Family
ID=86396725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514035A Active JP7392898B2 (ja) | 2021-11-18 | 2022-10-06 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7392898B2 (https=) |
| KR (1) | KR20240076816A (https=) |
| CN (1) | CN118103414A (https=) |
| TW (1) | TW202321317A (https=) |
| WO (1) | WO2023089976A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100304015A1 (en) * | 2009-06-01 | 2010-12-02 | Samsung Electronics Co., Ltd. | Method for manufacturing a liquid crystal display panel and liquid crystal display panel |
| JP2013525568A (ja) * | 2010-04-29 | 2013-06-20 | ダウ グローバル テクノロジーズ エルエルシー | ポリシクロペンタジエンポリフェノールのビニルベンジルエーテル |
| JP2015189925A (ja) * | 2014-03-28 | 2015-11-02 | 新日鉄住金化学株式会社 | ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物 |
| JP6962507B1 (ja) * | 2020-04-06 | 2021-11-05 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3773398D1 (de) | 1986-12-29 | 1991-10-31 | Allied Signal Inc | Thermohaertbare polymere von mit styrol endenden tetrakis-phenolen. |
| US5310779A (en) * | 1991-11-05 | 1994-05-10 | Bausch & Lomb Incorporated | UV curable crosslinking agents useful in copolymerization |
| JP3414556B2 (ja) | 1995-07-24 | 2003-06-09 | 昭和高分子株式会社 | ポリビニルベンジルエーテル化合物およびその製造方法 |
| JP3342829B2 (ja) * | 1998-02-25 | 2002-11-11 | 和歌山県 | 不飽和ポリエステル樹脂組成物及びその成形方法 |
| JP4591946B2 (ja) | 2004-04-28 | 2010-12-01 | 日本化薬株式会社 | ポリ（ビニルベンジル）エーテル化合物およびその製造方法 |
| JP5443806B2 (ja) * | 2009-03-26 | 2014-03-19 | 新日鉄住金化学株式会社 | 末端変性可溶性多官能ビニル芳香族共重合体、硬化性樹脂組成物及び硬化物 |
| US11739266B2 (en) * | 2018-12-07 | 2023-08-29 | Merck Patent Gmbh | Polymerisable compounds and the use thereof in liquid-crystal displays |
| JP7387973B2 (ja) * | 2019-03-19 | 2023-11-29 | 本州化学工業株式会社 | 末端（メタ）アクリレートポリカーボネートオリゴマー |
| JP7060181B1 (ja) * | 2020-06-03 | 2022-04-26 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
| WO2021251052A1 (ja) * | 2020-06-09 | 2021-12-16 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
| KR20230051434A (ko) * | 2020-08-19 | 2023-04-18 | 디아이씨 가부시끼가이샤 | 경화성 수지, 경화성 수지 조성물 및 경화물 |
| US20230391905A1 (en) * | 2020-12-22 | 2023-12-07 | Dic Corporation | Curable resin, curable resin composition, and cured product |
-
2022
- 2022-10-06 KR KR1020247014286A patent/KR20240076816A/ko active Pending
- 2022-10-06 WO PCT/JP2022/037366 patent/WO2023089976A1/ja not_active Ceased
- 2022-10-06 CN CN202280069855.2A patent/CN118103414A/zh active Pending
- 2022-10-06 JP JP2023514035A patent/JP7392898B2/ja active Active
- 2022-11-09 TW TW111142826A patent/TW202321317A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100304015A1 (en) * | 2009-06-01 | 2010-12-02 | Samsung Electronics Co., Ltd. | Method for manufacturing a liquid crystal display panel and liquid crystal display panel |
| JP2013525568A (ja) * | 2010-04-29 | 2013-06-20 | ダウ グローバル テクノロジーズ エルエルシー | ポリシクロペンタジエンポリフェノールのビニルベンジルエーテル |
| JP2015189925A (ja) * | 2014-03-28 | 2015-11-02 | 新日鉄住金化学株式会社 | ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物 |
| JP6962507B1 (ja) * | 2020-04-06 | 2021-11-05 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7392898B2 (ja) | 2023-12-06 |
| CN118103414A (zh) | 2024-05-28 |
| TW202321317A (zh) | 2023-06-01 |
| WO2023089976A1 (ja) | 2023-05-25 |
| KR20240076816A (ko) | 2024-05-30 |
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