JPWO2023085350A5 - - Google Patents

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Publication number
JPWO2023085350A5
JPWO2023085350A5 JP2023559887A JP2023559887A JPWO2023085350A5 JP WO2023085350 A5 JPWO2023085350 A5 JP WO2023085350A5 JP 2023559887 A JP2023559887 A JP 2023559887A JP 2023559887 A JP2023559887 A JP 2023559887A JP WO2023085350 A5 JPWO2023085350 A5 JP WO2023085350A5
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JP
Japan
Prior art keywords
wick
wall surface
housing
heat spreading
spreading device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023559887A
Other languages
English (en)
Japanese (ja)
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JPWO2023085350A1 (https=
JP7601253B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/041867 external-priority patent/WO2023085350A1/ja
Publication of JPWO2023085350A1 publication Critical patent/JPWO2023085350A1/ja
Publication of JPWO2023085350A5 publication Critical patent/JPWO2023085350A5/ja
Application granted granted Critical
Publication of JP7601253B2 publication Critical patent/JP7601253B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023559887A 2021-11-15 2022-11-10 熱拡散デバイス Active JP7601253B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021185679 2021-11-15
JP2021185679 2021-11-15
PCT/JP2022/041867 WO2023085350A1 (ja) 2021-11-15 2022-11-10 熱拡散デバイス

Publications (3)

Publication Number Publication Date
JPWO2023085350A1 JPWO2023085350A1 (https=) 2023-05-19
JPWO2023085350A5 true JPWO2023085350A5 (https=) 2024-05-24
JP7601253B2 JP7601253B2 (ja) 2024-12-17

Family

ID=86335818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559887A Active JP7601253B2 (ja) 2021-11-15 2022-11-10 熱拡散デバイス

Country Status (4)

Country Link
US (1) US20240276677A1 (https=)
JP (1) JP7601253B2 (https=)
CN (1) CN222733421U (https=)
WO (1) WO2023085350A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) * 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
JP4382892B2 (ja) * 1998-08-28 2009-12-16 古河電気工業株式会社 扁平ヒートパイプとその製造方法
JP4278739B2 (ja) * 1998-08-28 2009-06-17 古河電気工業株式会社 扁平ヒートパイプとその製造方法
US20030159806A1 (en) 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
US6880626B2 (en) 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
JP6564879B2 (ja) * 2015-12-18 2019-08-21 株式会社フジクラ ベーパーチャンバー
WO2018198372A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
JP6462771B2 (ja) * 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ

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