CN222733421U - 热扩散器件和电子设备 - Google Patents

热扩散器件和电子设备 Download PDF

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Publication number
CN222733421U
CN222733421U CN202290000736.7U CN202290000736U CN222733421U CN 222733421 U CN222733421 U CN 222733421U CN 202290000736 U CN202290000736 U CN 202290000736U CN 222733421 U CN222733421 U CN 222733421U
Authority
CN
China
Prior art keywords
core
wall surface
diffusion device
heat
heat diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202290000736.7U
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English (en)
Chinese (zh)
Inventor
沼本龙宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN222733421U publication Critical patent/CN222733421U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202290000736.7U 2021-11-15 2022-11-10 热扩散器件和电子设备 Active CN222733421U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-185679 2021-11-15
JP2021185679 2021-11-15
PCT/JP2022/041867 WO2023085350A1 (ja) 2021-11-15 2022-11-10 熱拡散デバイス

Publications (1)

Publication Number Publication Date
CN222733421U true CN222733421U (zh) 2025-04-08

Family

ID=86335818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202290000736.7U Active CN222733421U (zh) 2021-11-15 2022-11-10 热扩散器件和电子设备

Country Status (4)

Country Link
US (1) US20240276677A1 (https=)
JP (1) JP7601253B2 (https=)
CN (1) CN222733421U (https=)
WO (1) WO2023085350A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) * 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
JP4382892B2 (ja) * 1998-08-28 2009-12-16 古河電気工業株式会社 扁平ヒートパイプとその製造方法
JP4278739B2 (ja) * 1998-08-28 2009-06-17 古河電気工業株式会社 扁平ヒートパイプとその製造方法
US20030159806A1 (en) 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
US6880626B2 (en) 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
JP6564879B2 (ja) * 2015-12-18 2019-08-21 株式会社フジクラ ベーパーチャンバー
WO2018198372A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
JP6462771B2 (ja) * 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ

Also Published As

Publication number Publication date
US20240276677A1 (en) 2024-08-15
JPWO2023085350A1 (https=) 2023-05-19
WO2023085350A1 (ja) 2023-05-19
JP7601253B2 (ja) 2024-12-17

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