JPWO2023085350A1 - - Google Patents

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Publication number
JPWO2023085350A1
JPWO2023085350A1 JP2023559887A JP2023559887A JPWO2023085350A1 JP WO2023085350 A1 JPWO2023085350 A1 JP WO2023085350A1 JP 2023559887 A JP2023559887 A JP 2023559887A JP 2023559887 A JP2023559887 A JP 2023559887A JP WO2023085350 A1 JPWO2023085350 A1 JP WO2023085350A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023559887A
Other languages
Japanese (ja)
Other versions
JPWO2023085350A5 (https=
JP7601253B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2023085350A1 publication Critical patent/JPWO2023085350A1/ja
Publication of JPWO2023085350A5 publication Critical patent/JPWO2023085350A5/ja
Application granted granted Critical
Publication of JP7601253B2 publication Critical patent/JP7601253B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023559887A 2021-11-15 2022-11-10 熱拡散デバイス Active JP7601253B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021185679 2021-11-15
JP2021185679 2021-11-15
PCT/JP2022/041867 WO2023085350A1 (ja) 2021-11-15 2022-11-10 熱拡散デバイス

Publications (3)

Publication Number Publication Date
JPWO2023085350A1 true JPWO2023085350A1 (https=) 2023-05-19
JPWO2023085350A5 JPWO2023085350A5 (https=) 2024-05-24
JP7601253B2 JP7601253B2 (ja) 2024-12-17

Family

ID=86335818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559887A Active JP7601253B2 (ja) 2021-11-15 2022-11-10 熱拡散デバイス

Country Status (4)

Country Link
US (1) US20240276677A1 (https=)
JP (1) JP7601253B2 (https=)
CN (1) CN222733421U (https=)
WO (1) WO2023085350A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) * 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
JPH1038484A (ja) * 1995-12-21 1998-02-13 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
US20030159806A1 (en) * 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
US20050098303A1 (en) * 2002-08-28 2005-05-12 Lindemuth James E. Vapor chamber with sintered grooved wick
JP2018204841A (ja) * 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4382892B2 (ja) * 1998-08-28 2009-12-16 古河電気工業株式会社 扁平ヒートパイプとその製造方法
JP4278739B2 (ja) * 1998-08-28 2009-06-17 古河電気工業株式会社 扁平ヒートパイプとその製造方法
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
JP6564879B2 (ja) * 2015-12-18 2019-08-21 株式会社フジクラ ベーパーチャンバー
WO2018198372A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03247994A (ja) * 1990-02-26 1991-11-06 Mitsubishi Heavy Ind Ltd ヒートパイプ機能を有するサンドイッチパネル
JPH1038484A (ja) * 1995-12-21 1998-02-13 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
US20030159806A1 (en) * 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
US20050098303A1 (en) * 2002-08-28 2005-05-12 Lindemuth James E. Vapor chamber with sintered grooved wick
JP2018204841A (ja) * 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ

Also Published As

Publication number Publication date
US20240276677A1 (en) 2024-08-15
CN222733421U (zh) 2025-04-08
WO2023085350A1 (ja) 2023-05-19
JP7601253B2 (ja) 2024-12-17

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