JPWO2023068309A1 - - Google Patents

Info

Publication number
JPWO2023068309A1
JPWO2023068309A1 JP2023514848A JP2023514848A JPWO2023068309A1 JP WO2023068309 A1 JPWO2023068309 A1 JP WO2023068309A1 JP 2023514848 A JP2023514848 A JP 2023514848A JP 2023514848 A JP2023514848 A JP 2023514848A JP WO2023068309 A1 JPWO2023068309 A1 JP WO2023068309A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023514848A
Other languages
Japanese (ja)
Other versions
JP7587688B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023068309A1 publication Critical patent/JPWO2023068309A1/ja
Application granted granted Critical
Publication of JP7587688B2 publication Critical patent/JP7587688B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00Single-crystal growth directly from the solid state
    • C30B1/02Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00Production of homogeneous polycrystalline material with defined structure
    • C30B28/02Production of homogeneous polycrystalline material with defined structure directly from the solid state
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50Physical imperfections
    • H10D62/57Physical imperfections the imperfections being on the surface of the semiconductor body, e.g. the body having a roughened surface
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • G01N21/6489Photoluminescence of semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2023514848A 2021-10-22 2022-10-19 SiC基板及びSiC複合基板 Active JP7587688B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021039155 2021-10-22
JPPCT/JP2021/039155 2021-10-22
PCT/JP2022/039004 WO2023068309A1 (ja) 2021-10-22 2022-10-19 SiC基板及びSiC複合基板

Publications (2)

Publication Number Publication Date
JPWO2023068309A1 true JPWO2023068309A1 (https=) 2023-04-27
JP7587688B2 JP7587688B2 (ja) 2024-11-20

Family

ID=86058268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023514848A Active JP7587688B2 (ja) 2021-10-22 2022-10-19 SiC基板及びSiC複合基板

Country Status (5)

Country Link
US (1) US20240186380A1 (https=)
EP (1) EP4421221A4 (https=)
JP (1) JP7587688B2 (https=)
CN (1) CN117529584A (https=)
WO (1) WO2023068309A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023054264A1 (https=) * 2021-09-30 2023-04-06

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228295A (ja) * 1998-02-04 1999-08-24 Nippon Pillar Packing Co Ltd 単結晶SiC及びその製造方法
JP2004533720A (ja) * 2001-05-11 2004-11-04 クリー インコーポレイテッド 高い降伏電圧を有する半導体デバイスのための高抵抗率炭化珪素基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069758B2 (ja) 2012-08-26 2017-02-01 国立大学法人名古屋大学 SiC単結晶の製造方法
CN114761629B (zh) * 2020-01-24 2024-06-25 日本碍子株式会社 双轴取向SiC复合基板以及半导体器件用复合基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228295A (ja) * 1998-02-04 1999-08-24 Nippon Pillar Packing Co Ltd 単結晶SiC及びその製造方法
JP2004533720A (ja) * 2001-05-11 2004-11-04 クリー インコーポレイテッド 高い降伏電圧を有する半導体デバイスのための高抵抗率炭化珪素基板

Also Published As

Publication number Publication date
US20240186380A1 (en) 2024-06-06
EP4421221A4 (en) 2025-10-29
WO2023068309A1 (ja) 2023-04-27
CN117529584A (zh) 2024-02-06
EP4421221A1 (en) 2024-08-28
JP7587688B2 (ja) 2024-11-20

Similar Documents

Publication Publication Date Title
JPWO2021149598A1 (https=)
JPWO2023068309A1 (https=)
JPWO2023054264A1 (https=)
CN306540694S (https=)
CN306585537S (https=)
CN305537200S (https=)
CN305537015S (https=)
CN305536512S (https=)
CN305536462S (https=)
CN305536181S (https=)
CN305535074S (https=)
CN305534935S (https=)
CN306595913S (https=)
CN305534117S (https=)
CN305531134S (https=)
CN306527802S (https=)
CN305528360S (https=)
CN305527954S (https=)
CN305527081S (https=)
CN305526986S (https=)
CN306912214S (https=)
CN306584614S (https=)
CN306583922S (https=)
CN306582825S (https=)
CN306596178S (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230302

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240527

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240712

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20241030

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241108

R150 Certificate of patent or registration of utility model

Ref document number: 7587688

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150