JPWO2023068094A1 - - Google Patents

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Publication number
JPWO2023068094A1
JPWO2023068094A1 JP2023554515A JP2023554515A JPWO2023068094A1 JP WO2023068094 A1 JPWO2023068094 A1 JP WO2023068094A1 JP 2023554515 A JP2023554515 A JP 2023554515A JP 2023554515 A JP2023554515 A JP 2023554515A JP WO2023068094 A1 JPWO2023068094 A1 JP WO2023068094A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023554515A
Other languages
Japanese (ja)
Other versions
JPWO2023068094A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023068094A1 publication Critical patent/JPWO2023068094A1/ja
Publication of JPWO2023068094A5 publication Critical patent/JPWO2023068094A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023554515A 2021-10-19 2022-10-11 Pending JPWO2023068094A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021170586 2021-10-19
PCT/JP2022/037785 WO2023068094A1 (ja) 2021-10-19 2022-10-11 室温硬化性オルガノポリシロキサン組成物、接着剤、シール剤及びコーティング剤

Publications (2)

Publication Number Publication Date
JPWO2023068094A1 true JPWO2023068094A1 (https=) 2023-04-27
JPWO2023068094A5 JPWO2023068094A5 (https=) 2024-07-12

Family

ID=86058216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023554515A Pending JPWO2023068094A1 (https=) 2021-10-19 2022-10-11

Country Status (6)

Country Link
US (1) US20240409775A1 (https=)
EP (1) EP4421128A4 (https=)
JP (1) JPWO2023068094A1 (https=)
KR (1) KR20240089740A (https=)
CN (1) CN118119670A (https=)
WO (1) WO2023068094A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023234084A1 (ja) * 2022-05-30 2023-12-07 信越化学工業株式会社 二成分型室温硬化性オルガノポリシロキサン組成物及び該組成物を含有する各種物品
WO2026007108A1 (en) * 2024-07-05 2026-01-08 Henkel Ag & Co. Kgaa One-part (1k) ms/epoxy hybrid curable composition, preparation method and use of the same

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03210366A (ja) * 1990-01-12 1991-09-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JPH0841345A (ja) * 1994-08-03 1996-02-13 Toshiba Silicone Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2003012927A (ja) * 2001-06-28 2003-01-15 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2004043778A (ja) * 2002-05-22 2004-02-12 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
WO2015162962A1 (ja) * 2014-04-25 2015-10-29 信越化学工業株式会社 新規ビス（アルコキシシリル－ビニレン）基含有ケイ素化合物及びその製造方法
WO2015194340A1 (ja) * 2014-06-16 2015-12-23 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及び該室温硬化性オルガノポリシロキサン組成物の硬化物である成形物
JP2017057433A (ja) * 2015-09-14 2017-03-23 信越化学工業株式会社 金属基材の硫化防止方法、硫化防止性評価方法、及び実装回路基板
JP2019019241A (ja) * 2017-07-19 2019-02-07 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物、およびこれを含有するシール剤、コーティング剤、接着剤、成形物
WO2019077942A1 (ja) * 2017-10-17 2019-04-25 信越化学工業株式会社 室温硬化性組成物、シーリング材及び物品
WO2019116892A1 (ja) * 2017-12-15 2019-06-20 信越化学工業株式会社 室温湿気硬化型シリコーンゲル組成物及びその硬化物並びに物品
WO2022009759A1 (ja) * 2020-07-07 2022-01-13 信越化学工業株式会社 二成分型室温速硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び物品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543119A (en) 1978-09-20 1980-03-26 Sws Silicones Corp Titanium ester contained vulcanizable organopolysiloxane composition and its manufacture
JPH0197390U (https=) 1987-09-11 1989-06-28
JPH0739547B2 (ja) 1992-01-10 1995-05-01 東レ・ダウコーニング・シリコーン株式会社 室温硬化性オルガノポリシロキサン組成物
JP2998505B2 (ja) 1993-07-29 2000-01-11 富士写真光機株式会社 ラジアル超音波走査装置
JPH07331076A (ja) 1994-06-03 1995-12-19 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP3927643B2 (ja) 1997-04-01 2007-06-13 日本たばこ産業株式会社 分岐αデキストリンに親油性香料を包接指せた加香剤を用いた喫煙物品
JP5543119B2 (ja) 2009-03-12 2014-07-09 株式会社Ｕａｃｊ 高耐熱性アルミニウム合金ブレージングシートの製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03210366A (ja) * 1990-01-12 1991-09-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JPH0841345A (ja) * 1994-08-03 1996-02-13 Toshiba Silicone Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2003012927A (ja) * 2001-06-28 2003-01-15 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2004043778A (ja) * 2002-05-22 2004-02-12 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
WO2015162962A1 (ja) * 2014-04-25 2015-10-29 信越化学工業株式会社 新規ビス（アルコキシシリル－ビニレン）基含有ケイ素化合物及びその製造方法
WO2015194340A1 (ja) * 2014-06-16 2015-12-23 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及び該室温硬化性オルガノポリシロキサン組成物の硬化物である成形物
JP2017057433A (ja) * 2015-09-14 2017-03-23 信越化学工業株式会社 金属基材の硫化防止方法、硫化防止性評価方法、及び実装回路基板
JP2019019241A (ja) * 2017-07-19 2019-02-07 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物、およびこれを含有するシール剤、コーティング剤、接着剤、成形物
WO2019077942A1 (ja) * 2017-10-17 2019-04-25 信越化学工業株式会社 室温硬化性組成物、シーリング材及び物品
WO2019116892A1 (ja) * 2017-12-15 2019-06-20 信越化学工業株式会社 室温湿気硬化型シリコーンゲル組成物及びその硬化物並びに物品
WO2022009759A1 (ja) * 2020-07-07 2022-01-13 信越化学工業株式会社 二成分型室温速硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び物品

Also Published As

Publication number Publication date
EP4421128A1 (en) 2024-08-28
CN118119670A (zh) 2024-05-31
EP4421128A4 (en) 2025-10-29
KR20240089740A (ko) 2024-06-20
WO2023068094A1 (ja) 2023-04-27
US20240409775A1 (en) 2024-12-12

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