JPWO2023058385A5 - - Google Patents

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Publication number
JPWO2023058385A5
JPWO2023058385A5 JP2023552757A JP2023552757A JPWO2023058385A5 JP WO2023058385 A5 JPWO2023058385 A5 JP WO2023058385A5 JP 2023552757 A JP2023552757 A JP 2023552757A JP 2023552757 A JP2023552757 A JP 2023552757A JP WO2023058385 A5 JPWO2023058385 A5 JP WO2023058385A5
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JP
Japan
Prior art keywords
macromonomer
group
diamine compound
carbon atoms
block copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023552757A
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English (en)
Japanese (ja)
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JPWO2023058385A1 (https=
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Application filed filed Critical
Priority claimed from PCT/JP2022/033381 external-priority patent/WO2023058385A1/ja
Publication of JPWO2023058385A1 publication Critical patent/JPWO2023058385A1/ja
Publication of JPWO2023058385A5 publication Critical patent/JPWO2023058385A5/ja
Pending legal-status Critical Current

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JP2023552757A 2021-10-05 2022-09-06 Pending JPWO2023058385A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021164194 2021-10-05
PCT/JP2022/033381 WO2023058385A1 (ja) 2021-10-05 2022-09-06 ブロック共重合体

Publications (2)

Publication Number Publication Date
JPWO2023058385A1 JPWO2023058385A1 (https=) 2023-04-13
JPWO2023058385A5 true JPWO2023058385A5 (https=) 2024-06-25

Family

ID=85804144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552757A Pending JPWO2023058385A1 (https=) 2021-10-05 2022-09-06

Country Status (5)

Country Link
US (1) US20250004372A1 (https=)
JP (1) JPWO2023058385A1 (https=)
KR (1) KR20240072266A (https=)
TW (1) TW202323376A (https=)
WO (1) WO2023058385A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202540211A (zh) * 2024-02-22 2025-10-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件、以及聚醯胺酸酯之製造方法
CN118373992A (zh) * 2024-05-21 2024-07-23 宝珠特种材料科技(江苏)有限公司 一种交联聚酰亚胺薄膜及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040658A (ja) * 2000-07-27 2002-02-06 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、これを用いた半導体装置及び電子部品
DE60322663D1 (de) * 2002-01-15 2008-09-18 Pi R & D Co Ltd Lösungsmittellösliche block-copolyimidzusammensetzung und herstellungsverfahren dafür
JP2005266757A (ja) * 2004-02-20 2005-09-29 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物
CN1282687C (zh) * 2004-04-02 2006-11-01 吉林大学 含苯侧基的高溶解性高韧性聚酰亚胺预聚物及制备技术
WO2019044874A1 (ja) 2017-09-01 2019-03-07 日産化学株式会社 感光性樹脂組成物
JP7431241B2 (ja) 2019-07-29 2024-02-14 旭化成株式会社 ネガ型感光性樹脂組成物、ポリイミドの製造方法、硬化レリーフパターンの製造方法、及び半導体装置

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