JPWO2023054449A1 - - Google Patents

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Publication number
JPWO2023054449A1
JPWO2023054449A1 JP2023551586A JP2023551586A JPWO2023054449A1 JP WO2023054449 A1 JPWO2023054449 A1 JP WO2023054449A1 JP 2023551586 A JP2023551586 A JP 2023551586A JP 2023551586 A JP2023551586 A JP 2023551586A JP WO2023054449 A1 JPWO2023054449 A1 JP WO2023054449A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023551586A
Other languages
Japanese (ja)
Other versions
JPWO2023054449A5 (https=
JP7530524B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2023054449A1 publication Critical patent/JPWO2023054449A1/ja
Publication of JPWO2023054449A5 publication Critical patent/JPWO2023054449A5/ja
Application granted granted Critical
Publication of JP7530524B2 publication Critical patent/JP7530524B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2023551586A 2021-09-28 2022-09-28 シート状硬化性接着剤および光学部材 Active JP7530524B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021157535 2021-09-28
JP2021157535 2021-09-28
PCT/JP2022/036115 WO2023054449A1 (ja) 2021-09-28 2022-09-28 シート状硬化性接着剤および光学部材

Publications (3)

Publication Number Publication Date
JPWO2023054449A1 true JPWO2023054449A1 (https=) 2023-04-06
JPWO2023054449A5 JPWO2023054449A5 (https=) 2024-04-16
JP7530524B2 JP7530524B2 (ja) 2024-08-07

Family

ID=85782802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551586A Active JP7530524B2 (ja) 2021-09-28 2022-09-28 シート状硬化性接着剤および光学部材

Country Status (5)

Country Link
JP (1) JP7530524B2 (https=)
KR (1) KR20240065096A (https=)
CN (1) CN118019817A (https=)
TW (1) TW202323490A (https=)
WO (1) WO2023054449A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06166852A (ja) * 1992-10-01 1994-06-14 Nitto Denko Corp 熱硬化性接着シート
JP2004285307A (ja) * 2003-03-25 2004-10-14 Sony Chem Corp 接着剤及び電気装置の製造方法
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2017504664A (ja) * 2013-11-29 2017-02-09 エルジー・ハウシス・リミテッドＬｇ Ｈａｕｓｙｓ，Ｌｔｄ． 接着フィルム形成用組成物、光硬化前加工用粘着フィルム、接着フィルム及び電子ペーパー表示装置
JP2017179055A (ja) * 2016-03-29 2017-10-05 味の素株式会社 熱硬化性樹脂組成物
WO2019189618A1 (ja) * 2018-03-28 2019-10-03 リンテック株式会社 電子デバイス封止体、シート状接着剤、電子デバイス封止用接着フィルム、及び電子デバイス封止体の製造方法
WO2019240260A1 (ja) * 2018-06-15 2019-12-19 リンテック株式会社 封止剤組成物、封止シート及び封止体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130055541A (ko) 2011-11-18 2013-05-28 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06166852A (ja) * 1992-10-01 1994-06-14 Nitto Denko Corp 熱硬化性接着シート
JP2004285307A (ja) * 2003-03-25 2004-10-14 Sony Chem Corp 接着剤及び電気装置の製造方法
JP2017504664A (ja) * 2013-11-29 2017-02-09 エルジー・ハウシス・リミテッドＬｇ Ｈａｕｓｙｓ，Ｌｔｄ． 接着フィルム形成用組成物、光硬化前加工用粘着フィルム、接着フィルム及び電子ペーパー表示装置
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2017179055A (ja) * 2016-03-29 2017-10-05 味の素株式会社 熱硬化性樹脂組成物
WO2019189618A1 (ja) * 2018-03-28 2019-10-03 リンテック株式会社 電子デバイス封止体、シート状接着剤、電子デバイス封止用接着フィルム、及び電子デバイス封止体の製造方法
WO2019240260A1 (ja) * 2018-06-15 2019-12-19 リンテック株式会社 封止剤組成物、封止シート及び封止体

Also Published As

Publication number Publication date
WO2023054449A1 (ja) 2023-04-06
TW202323490A (zh) 2023-06-16
CN118019817A (zh) 2024-05-10
KR20240065096A (ko) 2024-05-14
JP7530524B2 (ja) 2024-08-07

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