JPWO2023031987A1 - - Google Patents

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Publication number
JPWO2023031987A1
JPWO2023031987A1 JP2023544796A JP2023544796A JPWO2023031987A1 JP WO2023031987 A1 JPWO2023031987 A1 JP WO2023031987A1 JP 2023544796 A JP2023544796 A JP 2023544796A JP 2023544796 A JP2023544796 A JP 2023544796A JP WO2023031987 A1 JPWO2023031987 A1 JP WO2023031987A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023544796A
Other languages
Japanese (ja)
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JPWO2023031987A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023031987A1 publication Critical patent/JPWO2023031987A1/ja
Publication of JPWO2023031987A5 publication Critical patent/JPWO2023031987A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023544796A 2021-08-30 2021-08-30 Pending JPWO2023031987A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/031678 WO2023031987A1 (ja) 2021-08-30 2021-08-30 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023031987A1 true JPWO2023031987A1 (https=) 2023-03-09
JPWO2023031987A5 JPWO2023031987A5 (https=) 2024-05-22

Family

ID=85412272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023544796A Pending JPWO2023031987A1 (https=) 2021-08-30 2021-08-30

Country Status (6)

Country Link
US (1) US20240393686A1 (https=)
JP (1) JPWO2023031987A1 (https=)
KR (2) KR102892139B1 (https=)
CN (1) CN117882007A (https=)
TW (1) TWI909077B (https=)
WO (1) WO2023031987A1 (https=)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323089A (ja) * 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
WO2007119699A1 (ja) * 2006-04-18 2007-10-25 Hitachi Chemical Company, Ltd. 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2008112146A (ja) * 2006-10-04 2008-05-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2012149264A (ja) * 2012-03-08 2012-08-09 Hitachi Chemical Co Ltd 感光性樹脂組成物からなる接着剤及びこれを用いた中空パッケージ構造
WO2012117915A1 (ja) * 2011-03-03 2012-09-07 株式会社カネカ 新規な絶縁膜及び絶縁膜付きプリント配線板
WO2018139407A1 (ja) * 2017-01-24 2018-08-02 日立化成株式会社 半導体装置の製造方法、モールドアンダーフィル用感光性樹脂組成物及び半導体装置
JP2019066791A (ja) * 2017-10-05 2019-04-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント及びプリント配線板
JP2019066792A (ja) * 2017-10-05 2019-04-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント及びプリント配線板とその製造方法
JP2019066510A (ja) * 2017-09-28 2019-04-25 日立化成株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、層間絶縁膜の形成方法、プリント配線板の製造方法及びプリント配線板
JP2019066511A (ja) * 2017-09-28 2019-04-25 日立化成株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、層間絶縁膜の形成方法、プリント配線板の製造方法及びプリント配線板
JP2020095111A (ja) * 2018-12-11 2020-06-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた半導体用配線層及び半導体基板
WO2021029021A1 (ja) * 2019-08-14 2021-02-18 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2021028699A (ja) * 2019-08-09 2021-02-25 味の素株式会社 感光性樹脂組成物、感光性樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP2021032916A (ja) * 2019-08-14 2021-03-01 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2021076743A (ja) * 2019-11-11 2021-05-20 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、半導体装置及びレジストパターンの形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法
JP7018168B2 (ja) 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323089A (ja) * 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
WO2007119699A1 (ja) * 2006-04-18 2007-10-25 Hitachi Chemical Company, Ltd. 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2008112146A (ja) * 2006-10-04 2008-05-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
WO2012117915A1 (ja) * 2011-03-03 2012-09-07 株式会社カネカ 新規な絶縁膜及び絶縁膜付きプリント配線板
JP2012149264A (ja) * 2012-03-08 2012-08-09 Hitachi Chemical Co Ltd 感光性樹脂組成物からなる接着剤及びこれを用いた中空パッケージ構造
WO2018139407A1 (ja) * 2017-01-24 2018-08-02 日立化成株式会社 半導体装置の製造方法、モールドアンダーフィル用感光性樹脂組成物及び半導体装置
JP2019066511A (ja) * 2017-09-28 2019-04-25 日立化成株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、層間絶縁膜の形成方法、プリント配線板の製造方法及びプリント配線板
JP2019066510A (ja) * 2017-09-28 2019-04-25 日立化成株式会社 感光性樹脂組成物、並びに、これを用いた感光性エレメント、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、層間絶縁膜の形成方法、プリント配線板の製造方法及びプリント配線板
JP2019066792A (ja) * 2017-10-05 2019-04-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント及びプリント配線板とその製造方法
JP2019066791A (ja) * 2017-10-05 2019-04-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント及びプリント配線板
JP2020095111A (ja) * 2018-12-11 2020-06-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた半導体用配線層及び半導体基板
JP2021028699A (ja) * 2019-08-09 2021-02-25 味の素株式会社 感光性樹脂組成物、感光性樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
WO2021029021A1 (ja) * 2019-08-14 2021-02-18 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2021032916A (ja) * 2019-08-14 2021-03-01 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2021076743A (ja) * 2019-11-11 2021-05-20 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、半導体装置及びレジストパターンの形成方法

Also Published As

Publication number Publication date
KR102892139B1 (ko) 2025-11-28
CN117882007A (zh) 2024-04-12
KR20240036650A (ko) 2024-03-20
TW202309106A (zh) 2023-03-01
WO2023031987A1 (ja) 2023-03-09
KR20250172721A (ko) 2025-12-09
US20240393686A1 (en) 2024-11-28
TWI909077B (zh) 2025-12-21

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