JPWO2023008538A1 - - Google Patents

Info

Publication number
JPWO2023008538A1
JPWO2023008538A1 JP2023538628A JP2023538628A JPWO2023008538A1 JP WO2023008538 A1 JPWO2023008538 A1 JP WO2023008538A1 JP 2023538628 A JP2023538628 A JP 2023538628A JP 2023538628 A JP2023538628 A JP 2023538628A JP WO2023008538 A1 JPWO2023008538 A1 JP WO2023008538A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023538628A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023008538A1 publication Critical patent/JPWO2023008538A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023538628A 2021-07-29 2022-07-28 Pending JPWO2023008538A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021124791 2021-07-29
PCT/JP2022/029201 WO2023008538A1 (ja) 2021-07-29 2022-07-28 熱伝導性組成物及び硬化物

Publications (1)

Publication Number Publication Date
JPWO2023008538A1 true JPWO2023008538A1 (ja) 2023-02-02

Family

ID=85086862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538628A Pending JPWO2023008538A1 (ja) 2021-07-29 2022-07-28

Country Status (5)

Country Link
JP (1) JPWO2023008538A1 (ja)
KR (1) KR20240037182A (ja)
CN (1) CN117355569A (ja)
TW (1) TW202313852A (ja)
WO (1) WO2023008538A1 (ja)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002092693A1 (fr) 2001-05-14 2002-11-21 Dow Corning Toray Silicone Co., Ltd. Composition de silicone thermoconductrice
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4901327B2 (ja) * 2005-07-25 2012-03-21 信越化学工業株式会社 放熱部材
JP5507059B2 (ja) 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP4993135B2 (ja) * 2008-07-08 2012-08-08 信越化学工業株式会社 熱伝導性シリコーン組成物
JP5463116B2 (ja) * 2009-10-14 2014-04-09 電気化学工業株式会社 熱伝導性材料
JP6185719B2 (ja) * 2010-03-31 2017-08-23 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
CN102372925B (zh) * 2010-08-05 2013-07-31 天津莱尔德电子材料有限公司 一种导热绝缘材料、导热绝缘片及其制备方法
JP5834519B2 (ja) * 2011-06-15 2015-12-24 三菱化学株式会社 半導体発光装置用の樹脂成形体用材料およびその成形体
JP5699901B2 (ja) 2011-10-24 2015-04-15 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013221082A (ja) * 2012-04-17 2013-10-28 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン樹脂組成物、並びに該組成物からなるシート、シート状硬化物、及びダイアタッチ材
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP6050207B2 (ja) * 2013-09-25 2016-12-21 信越化学工業株式会社 放熱シート、高放熱性シート状硬化物、及び放熱シートの使用方法
JP6194861B2 (ja) * 2014-07-28 2017-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6972028B2 (ja) * 2017-01-13 2021-11-24 デンカ株式会社 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法
CN110291848B (zh) * 2017-03-22 2022-09-02 电化株式会社 电路基板用树脂组合物及使用其的金属基底电路基板
US11072706B2 (en) * 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
JP7120783B2 (ja) * 2018-03-27 2022-08-17 積水化学工業株式会社 熱伝導性熱膨張性部材
WO2019230607A1 (ja) * 2018-05-29 2019-12-05 デンカ株式会社 電子機器及び電磁波シールド性放熱シート
JP7013353B2 (ja) * 2018-10-09 2022-01-31 信越化学工業株式会社 ガラス繊維含有波長変換シリコーンシート及びそれを用いた光半導体装置
JPWO2020203305A1 (ja) * 2019-03-29 2020-10-08

Also Published As

Publication number Publication date
CN117355569A (zh) 2024-01-05
TW202313852A (zh) 2023-04-01
KR20240037182A (ko) 2024-03-21
WO2023008538A1 (ja) 2023-02-02

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