JPWO2023008199A1 - - Google Patents
Info
- Publication number
- JPWO2023008199A1 JPWO2023008199A1 JP2023508605A JP2023508605A JPWO2023008199A1 JP WO2023008199 A1 JPWO2023008199 A1 JP WO2023008199A1 JP 2023508605 A JP2023508605 A JP 2023508605A JP 2023508605 A JP2023508605 A JP 2023508605A JP WO2023008199 A1 JPWO2023008199 A1 JP WO2023008199A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021121334 | 2021-07-26 | ||
JP2021121334 | 2021-07-26 | ||
PCT/JP2022/027589 WO2023008199A1 (ja) | 2021-07-26 | 2022-07-13 | 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2023008199A1 true JPWO2023008199A1 (ja) | 2023-02-02 |
JPWO2023008199A5 JPWO2023008199A5 (ja) | 2023-07-05 |
JP7365529B2 JP7365529B2 (ja) | 2023-10-19 |
Family
ID=85086767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023508605A Active JP7365529B2 (ja) | 2021-07-26 | 2022-07-13 | 接合基板、回路基板及びその製造方法、並びに、個片基板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP4373222A1 (ja) |
JP (1) | JP7365529B2 (ja) |
CN (1) | CN117813917A (ja) |
WO (1) | WO2023008199A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042934A (ja) * | 2005-08-04 | 2007-02-15 | Juki Corp | 多面取り基板の生産履歴管理方法及び多面取り基板 |
JP2011119660A (ja) * | 2009-10-28 | 2011-06-16 | Kyocera Corp | 多数個取り配線基板 |
JP2011165727A (ja) * | 2010-02-05 | 2011-08-25 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体 |
JP2011233648A (ja) * | 2010-04-26 | 2011-11-17 | Murata Mfg Co Ltd | マーク付き回路基板 |
JP2016018833A (ja) * | 2014-07-07 | 2016-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
WO2021054317A1 (ja) * | 2019-09-20 | 2021-03-25 | デンカ株式会社 | 複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
JP2021048165A (ja) * | 2019-09-17 | 2021-03-25 | 日立金属株式会社 | 回路基板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005210028A (ja) | 2004-01-26 | 2005-08-04 | Kyocera Corp | 多数個取り配線基板 |
US20220147723A1 (en) | 2019-03-01 | 2022-05-12 | Denka Company Limited | Ceramic green sheet, ceramic substrate, method of producing ceramic green sheet, and method of producing ceramic substrate |
JP7465879B2 (ja) | 2019-07-31 | 2024-04-11 | デンカ株式会社 | セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
-
2022
- 2022-07-13 CN CN202280051368.3A patent/CN117813917A/zh active Pending
- 2022-07-13 EP EP22849263.3A patent/EP4373222A1/en active Pending
- 2022-07-13 JP JP2023508605A patent/JP7365529B2/ja active Active
- 2022-07-13 WO PCT/JP2022/027589 patent/WO2023008199A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042934A (ja) * | 2005-08-04 | 2007-02-15 | Juki Corp | 多面取り基板の生産履歴管理方法及び多面取り基板 |
JP2011119660A (ja) * | 2009-10-28 | 2011-06-16 | Kyocera Corp | 多数個取り配線基板 |
JP2011165727A (ja) * | 2010-02-05 | 2011-08-25 | Mitsubishi Materials Corp | パワーモジュール用基板の製造方法およびパワーモジュール用基板の製造中間体 |
JP2011233648A (ja) * | 2010-04-26 | 2011-11-17 | Murata Mfg Co Ltd | マーク付き回路基板 |
JP2016018833A (ja) * | 2014-07-07 | 2016-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2021048165A (ja) * | 2019-09-17 | 2021-03-25 | 日立金属株式会社 | 回路基板の製造方法 |
WO2021054317A1 (ja) * | 2019-09-20 | 2021-03-25 | デンカ株式会社 | 複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7365529B2 (ja) | 2023-10-19 |
WO2023008199A1 (ja) | 2023-02-02 |
EP4373222A1 (en) | 2024-05-22 |
CN117813917A (zh) | 2024-04-02 |
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