JPWO2022270504A1 - - Google Patents

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Publication number
JPWO2022270504A1
JPWO2022270504A1 JP2023520270A JP2023520270A JPWO2022270504A1 JP WO2022270504 A1 JPWO2022270504 A1 JP WO2022270504A1 JP 2023520270 A JP2023520270 A JP 2023520270A JP 2023520270 A JP2023520270 A JP 2023520270A JP WO2022270504 A1 JPWO2022270504 A1 JP WO2022270504A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023520270A
Other versions
JP7463001B2 (ja
JPWO2022270504A5 (ja
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Publication of JPWO2022270504A1 publication Critical patent/JPWO2022270504A1/ja
Publication of JPWO2022270504A5 publication Critical patent/JPWO2022270504A5/ja
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Publication of JP7463001B2 publication Critical patent/JP7463001B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2023520270A 2021-06-22 2022-06-21 被めっき基板の製造方法 Active JP7463001B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021103360 2021-06-22
JP2021103360 2021-06-22
PCT/JP2022/024721 WO2022270504A1 (ja) 2021-06-22 2022-06-21 被めっき基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022270504A1 true JPWO2022270504A1 (ja) 2022-12-29
JPWO2022270504A5 JPWO2022270504A5 (ja) 2023-06-02
JP7463001B2 JP7463001B2 (ja) 2024-04-08

Family

ID=84545772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023520270A Active JP7463001B2 (ja) 2021-06-22 2022-06-21 被めっき基板の製造方法

Country Status (4)

Country Link
JP (1) JP7463001B2 (ja)
CN (1) CN117795124A (ja)
TW (1) TW202319582A (ja)
WO (1) WO2022270504A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013463A (ja) * 2007-07-04 2009-01-22 Fujifilm Corp 金属膜形成方法、金属パターン形成方法、金属膜、金属パターン、新規共重合ポリマー、及びポリマー層形成用組成物
WO2012046651A1 (ja) * 2010-10-04 2012-04-12 株式会社いおう化学研究所 金属膜形成方法、及び金属膜を有する製品
WO2017169612A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 導電性積層体の製造方法、積層体および導電性積層体
JP2020143007A (ja) * 2019-03-05 2020-09-10 国立大学法人岩手大学 反応性付与化合物、その製造方法、それを用いた表面反応性固体、及び表面反応性固体の製造方法
JP2021055174A (ja) * 2019-09-30 2021-04-08 東洋理工株式会社 樹脂成形体の表面改質および金属皮膜形成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004152852A (ja) 2002-10-29 2004-05-27 Toray Eng Co Ltd 電子部品用回路基材の製造方法
JP4692032B2 (ja) 2005-03-16 2011-06-01 チッソ株式会社 無電解メッキ用基板、無電解メッキされたメッキ基板およびその製造方法
JP6620277B1 (ja) 2018-08-07 2019-12-18 株式会社豊光社 めっき処理されたガラス基材の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009013463A (ja) * 2007-07-04 2009-01-22 Fujifilm Corp 金属膜形成方法、金属パターン形成方法、金属膜、金属パターン、新規共重合ポリマー、及びポリマー層形成用組成物
WO2012046651A1 (ja) * 2010-10-04 2012-04-12 株式会社いおう化学研究所 金属膜形成方法、及び金属膜を有する製品
WO2017169612A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 導電性積層体の製造方法、積層体および導電性積層体
JP2020143007A (ja) * 2019-03-05 2020-09-10 国立大学法人岩手大学 反応性付与化合物、その製造方法、それを用いた表面反応性固体、及び表面反応性固体の製造方法
JP2021055174A (ja) * 2019-09-30 2021-04-08 東洋理工株式会社 樹脂成形体の表面改質および金属皮膜形成方法

Also Published As

Publication number Publication date
WO2022270504A1 (ja) 2022-12-29
CN117795124A (zh) 2024-03-29
TW202319582A (zh) 2023-05-16
JP7463001B2 (ja) 2024-04-08

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