JPWO2022270504A1 - - Google Patents
Info
- Publication number
- JPWO2022270504A1 JPWO2022270504A1 JP2023520270A JP2023520270A JPWO2022270504A1 JP WO2022270504 A1 JPWO2022270504 A1 JP WO2022270504A1 JP 2023520270 A JP2023520270 A JP 2023520270A JP 2023520270 A JP2023520270 A JP 2023520270A JP WO2022270504 A1 JPWO2022270504 A1 JP WO2022270504A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021103360 | 2021-06-22 | ||
JP2021103360 | 2021-06-22 | ||
PCT/JP2022/024721 WO2022270504A1 (ja) | 2021-06-22 | 2022-06-21 | 被めっき基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022270504A1 true JPWO2022270504A1 (ja) | 2022-12-29 |
JPWO2022270504A5 JPWO2022270504A5 (ja) | 2023-06-02 |
JP7463001B2 JP7463001B2 (ja) | 2024-04-08 |
Family
ID=84545772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023520270A Active JP7463001B2 (ja) | 2021-06-22 | 2022-06-21 | 被めっき基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7463001B2 (ja) |
CN (1) | CN117795124A (ja) |
TW (1) | TW202319582A (ja) |
WO (1) | WO2022270504A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009013463A (ja) * | 2007-07-04 | 2009-01-22 | Fujifilm Corp | 金属膜形成方法、金属パターン形成方法、金属膜、金属パターン、新規共重合ポリマー、及びポリマー層形成用組成物 |
WO2012046651A1 (ja) * | 2010-10-04 | 2012-04-12 | 株式会社いおう化学研究所 | 金属膜形成方法、及び金属膜を有する製品 |
WO2017169612A1 (ja) * | 2016-03-31 | 2017-10-05 | 富士フイルム株式会社 | 導電性積層体の製造方法、積層体および導電性積層体 |
JP2020143007A (ja) * | 2019-03-05 | 2020-09-10 | 国立大学法人岩手大学 | 反応性付与化合物、その製造方法、それを用いた表面反応性固体、及び表面反応性固体の製造方法 |
JP2021055174A (ja) * | 2019-09-30 | 2021-04-08 | 東洋理工株式会社 | 樹脂成形体の表面改質および金属皮膜形成方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004152852A (ja) | 2002-10-29 | 2004-05-27 | Toray Eng Co Ltd | 電子部品用回路基材の製造方法 |
JP4692032B2 (ja) | 2005-03-16 | 2011-06-01 | チッソ株式会社 | 無電解メッキ用基板、無電解メッキされたメッキ基板およびその製造方法 |
JP6620277B1 (ja) | 2018-08-07 | 2019-12-18 | 株式会社豊光社 | めっき処理されたガラス基材の製造方法 |
-
2022
- 2022-06-21 WO PCT/JP2022/024721 patent/WO2022270504A1/ja active Application Filing
- 2022-06-21 JP JP2023520270A patent/JP7463001B2/ja active Active
- 2022-06-21 CN CN202280044340.7A patent/CN117795124A/zh active Pending
- 2022-06-22 TW TW111123232A patent/TW202319582A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009013463A (ja) * | 2007-07-04 | 2009-01-22 | Fujifilm Corp | 金属膜形成方法、金属パターン形成方法、金属膜、金属パターン、新規共重合ポリマー、及びポリマー層形成用組成物 |
WO2012046651A1 (ja) * | 2010-10-04 | 2012-04-12 | 株式会社いおう化学研究所 | 金属膜形成方法、及び金属膜を有する製品 |
WO2017169612A1 (ja) * | 2016-03-31 | 2017-10-05 | 富士フイルム株式会社 | 導電性積層体の製造方法、積層体および導電性積層体 |
JP2020143007A (ja) * | 2019-03-05 | 2020-09-10 | 国立大学法人岩手大学 | 反応性付与化合物、その製造方法、それを用いた表面反応性固体、及び表面反応性固体の製造方法 |
JP2021055174A (ja) * | 2019-09-30 | 2021-04-08 | 東洋理工株式会社 | 樹脂成形体の表面改質および金属皮膜形成方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2022270504A1 (ja) | 2022-12-29 |
CN117795124A (zh) | 2024-03-29 |
TW202319582A (zh) | 2023-05-16 |
JP7463001B2 (ja) | 2024-04-08 |
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