JPWO2022259758A1 - - Google Patents
Info
- Publication number
- JPWO2022259758A1 JPWO2022259758A1 JP2023527551A JP2023527551A JPWO2022259758A1 JP WO2022259758 A1 JPWO2022259758 A1 JP WO2022259758A1 JP 2023527551 A JP2023527551 A JP 2023527551A JP 2023527551 A JP2023527551 A JP 2023527551A JP WO2022259758 A1 JPWO2022259758 A1 JP WO2022259758A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021095573 | 2021-06-08 | ||
PCT/JP2022/017563 WO2022259758A1 (ja) | 2021-06-08 | 2022-04-12 | 熱電変換材料、熱電変換材料用組成物、熱電変換素子、熱電変換モジュール、及び熱電変換材料の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022259758A1 true JPWO2022259758A1 (ja) | 2022-12-15 |
Family
ID=84425885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023527551A Pending JPWO2022259758A1 (ja) | 2021-06-08 | 2022-04-12 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240090331A1 (ja) |
JP (1) | JPWO2022259758A1 (ja) |
CN (1) | CN117413635A (ja) |
WO (1) | WO2022259758A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6225550B1 (en) * | 1999-09-09 | 2001-05-01 | Symyx Technologies, Inc. | Thermoelectric material system |
KR20030092692A (ko) * | 2002-05-30 | 2003-12-06 | 이지환 | 열전소자와 전극이 일체화된 열전재료의 제조 방법 |
WO2015126817A1 (en) * | 2014-02-18 | 2015-08-27 | University Of Houston System | THERMOELECTRIC COMPOSITIONS AND METHODS OF FABRICATING HIGH THERMOELECTRIC PERFORMANCE MgAgSb-BASED MATERIALS |
JP6127281B1 (ja) * | 2015-10-27 | 2017-05-17 | パナソニックIpマネジメント株式会社 | 熱電変換材料 |
JP2019207983A (ja) * | 2018-05-30 | 2019-12-05 | パナソニックIpマネジメント株式会社 | 熱電変換材料及びこれを用いた熱電変換素子 |
CN110998882A (zh) * | 2018-06-27 | 2020-04-10 | 松下知识产权经营株式会社 | 热电转换元件和热电转换模块 |
WO2021131408A1 (ja) * | 2019-12-25 | 2021-07-01 | パナソニックIpマネジメント株式会社 | 熱電変換素子、熱電変換モジュール、接合材、熱電変換素子を製造する方法 |
-
2022
- 2022-04-12 WO PCT/JP2022/017563 patent/WO2022259758A1/ja active Application Filing
- 2022-04-12 JP JP2023527551A patent/JPWO2022259758A1/ja active Pending
- 2022-04-12 CN CN202280038023.4A patent/CN117413635A/zh active Pending
-
2023
- 2023-11-21 US US18/515,329 patent/US20240090331A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20240090331A1 (en) | 2024-03-14 |
WO2022259758A1 (ja) | 2022-12-15 |
CN117413635A (zh) | 2024-01-16 |