JPWO2022255174A1 - - Google Patents
Info
- Publication number
- JPWO2022255174A1 JPWO2022255174A1 JP2023525747A JP2023525747A JPWO2022255174A1 JP WO2022255174 A1 JPWO2022255174 A1 JP WO2022255174A1 JP 2023525747 A JP2023525747 A JP 2023525747A JP 2023525747 A JP2023525747 A JP 2023525747A JP WO2022255174 A1 JPWO2022255174 A1 JP WO2022255174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021090916 | 2021-05-31 | ||
PCT/JP2022/021319 WO2022255174A1 (ja) | 2021-05-31 | 2022-05-25 | ポリアミド酸組成物、ポリイミド、その積層体、フレキシブルデバイス、および積層体の製造方法。 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022255174A1 true JPWO2022255174A1 (zh) | 2022-12-08 |
Family
ID=84323305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023525747A Pending JPWO2022255174A1 (zh) | 2021-05-31 | 2022-05-25 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022255174A1 (zh) |
KR (1) | KR20240015656A (zh) |
CN (1) | CN117425701A (zh) |
TW (1) | TW202311366A (zh) |
WO (1) | WO2022255174A1 (zh) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11148008A (ja) * | 1997-09-11 | 1999-06-02 | Hitachi Chem Co Ltd | ポリイミド前駆体樹脂組成物及び半導体装置 |
JP5408473B2 (ja) * | 2008-08-29 | 2014-02-05 | Dic株式会社 | 熱硬化性ポリイミド樹脂組成物 |
JP5903789B2 (ja) | 2010-07-22 | 2016-04-13 | 宇部興産株式会社 | 共重合ポリイミド前駆体及び共重合ポリイミド |
JP5814749B2 (ja) * | 2011-11-10 | 2015-11-17 | 日東電工株式会社 | ポリイミド前駆体組成物およびそれを用いた配線回路基板 |
JP6016561B2 (ja) | 2012-09-28 | 2016-10-26 | 旭化成株式会社 | ポリイミド前駆体及びそれを含有する樹脂組成物、ポリイミドフィルム及びその製造方法、並びに、積層体及びその製造方法 |
JP6325791B2 (ja) * | 2013-10-04 | 2018-05-16 | 旭化成株式会社 | 樹脂組成物、積層体、プリント配線板、及びその製造方法 |
JP6584815B2 (ja) * | 2015-04-17 | 2019-10-02 | 旭化成株式会社 | 感光性樹脂組成物、感光性フィルム積層体、フレキシブルプリント配線板及びその製造方法 |
JP6086139B2 (ja) | 2015-10-05 | 2017-03-01 | 宇部興産株式会社 | ポリイミド前駆体及びポリイミド |
JP7036012B2 (ja) * | 2016-07-21 | 2022-03-15 | 三菱瓦斯化学株式会社 | ポリイミド樹脂フィルム及びポリイミド樹脂フィルムの製造方法 |
JP2018044180A (ja) * | 2017-12-26 | 2018-03-22 | Jxtgエネルギー株式会社 | ポリイミド樹脂組成物及びポリイミドワニス |
KR102429867B1 (ko) * | 2018-02-21 | 2022-08-05 | 에네오스 가부시키가이샤 | 폴리이미드 전구체 수지 조성물 |
WO2020262295A1 (ja) * | 2019-06-24 | 2020-12-30 | 株式会社カネカ | 透明ポリイミドフィルムおよびその製造方法 |
CN115989265A (zh) * | 2020-08-26 | 2023-04-18 | 株式会社钟化 | 聚酰胺酸组合物、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法和电子器件 |
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2022
- 2022-05-25 CN CN202280038706.XA patent/CN117425701A/zh active Pending
- 2022-05-25 WO PCT/JP2022/021319 patent/WO2022255174A1/ja active Application Filing
- 2022-05-25 KR KR1020237042922A patent/KR20240015656A/ko unknown
- 2022-05-25 JP JP2023525747A patent/JPWO2022255174A1/ja active Pending
- 2022-05-27 TW TW111119903A patent/TW202311366A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202311366A (zh) | 2023-03-16 |
CN117425701A (zh) | 2024-01-19 |
KR20240015656A (ko) | 2024-02-05 |
WO2022255174A1 (ja) | 2022-12-08 |