JPWO2022239597A1 - - Google Patents

Info

Publication number
JPWO2022239597A1
JPWO2022239597A1 JP2023520934A JP2023520934A JPWO2022239597A1 JP WO2022239597 A1 JPWO2022239597 A1 JP WO2022239597A1 JP 2023520934 A JP2023520934 A JP 2023520934A JP 2023520934 A JP2023520934 A JP 2023520934A JP WO2022239597 A1 JPWO2022239597 A1 JP WO2022239597A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023520934A
Other languages
Japanese (ja)
Other versions
JPWO2022239597A5 (ko
JP7380951B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022239597A1 publication Critical patent/JPWO2022239597A1/ja
Publication of JPWO2022239597A5 publication Critical patent/JPWO2022239597A5/ja
Application granted granted Critical
Publication of JP7380951B2 publication Critical patent/JP7380951B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2023520934A 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂 Active JP7380951B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021082506 2021-05-14
JP2021082506 2021-05-14
PCT/JP2022/017764 WO2022239597A1 (ja) 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂

Publications (3)

Publication Number Publication Date
JPWO2022239597A1 true JPWO2022239597A1 (ko) 2022-11-17
JPWO2022239597A5 JPWO2022239597A5 (ko) 2023-06-22
JP7380951B2 JP7380951B2 (ja) 2023-11-15

Family

ID=84028213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023520934A Active JP7380951B2 (ja) 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂

Country Status (5)

Country Link
JP (1) JP7380951B2 (ko)
KR (1) KR20230156418A (ko)
CN (1) CN117321109A (ko)
TW (1) TW202244094A (ko)
WO (1) WO2022239597A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120264864A1 (en) * 2009-10-20 2012-10-18 C.N.R.S. Modified polyamide composition containing at least one phenolic compound
WO2016185865A1 (ja) * 2015-05-20 2016-11-24 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
WO2017029935A1 (ja) * 2015-08-18 2017-02-23 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
JP2018532027A (ja) * 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法
WO2020153048A1 (ja) * 2019-01-21 2020-07-30 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2231860A (en) * 1937-09-27 1941-02-11 Monsanto Chemicals Phenol-butyraldehyde-formaldehyde resins
JP2559245B2 (ja) * 1987-10-14 1996-12-04 富士写真フイルム株式会社 ハロゲン化銀写真感光材料
FR2642078B1 (fr) * 1989-01-25 1992-08-28 Ceca Sa Resines formophenoliques de type novolaque resultant de la condensation de phenols et d'aldehydes lourds. leur preparation. leur application au renforcement du caoutchouc
FR2665165B1 (fr) * 1990-07-25 1995-02-24 Ceca Sa Nouvelles resines novolaques de para-alkylphenols. leur procede de preparation.
JP3710717B2 (ja) 2001-03-06 2005-10-26 東京応化工業株式会社 厚膜用ポジ型ホトレジスト組成物、ホトレジスト膜およびこれを用いたバンプ形成方法
US7074861B2 (en) * 2003-02-18 2006-07-11 Indspec Chemical Corporation Modified resorcinol resins and applications thereof
JP2008088197A (ja) 2006-09-29 2008-04-17 Sumitomo Bakelite Co Ltd フォトレジスト用フェノール樹脂とその製造方法、及びフォトレジスト用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120264864A1 (en) * 2009-10-20 2012-10-18 C.N.R.S. Modified polyamide composition containing at least one phenolic compound
WO2016185865A1 (ja) * 2015-05-20 2016-11-24 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
WO2017029935A1 (ja) * 2015-08-18 2017-02-23 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
JP2018532027A (ja) * 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法
WO2020153048A1 (ja) * 2019-01-21 2020-07-30 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Also Published As

Publication number Publication date
WO2022239597A1 (ja) 2022-11-17
CN117321109A (zh) 2023-12-29
JP7380951B2 (ja) 2023-11-15
KR20230156418A (ko) 2023-11-14
TW202244094A (zh) 2022-11-16

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