JP7380951B2 - フェノール性水酸基含有樹脂 - Google Patents

フェノール性水酸基含有樹脂 Download PDF

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Publication number
JP7380951B2
JP7380951B2 JP2023520934A JP2023520934A JP7380951B2 JP 7380951 B2 JP7380951 B2 JP 7380951B2 JP 2023520934 A JP2023520934 A JP 2023520934A JP 2023520934 A JP2023520934 A JP 2023520934A JP 7380951 B2 JP7380951 B2 JP 7380951B2
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Japan
Prior art keywords
group
phenolic hydroxyl
hydroxyl group
resin
containing resin
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JP2023520934A
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Japanese (ja)
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JPWO2022239597A1 (ko
JPWO2022239597A5 (ko
Inventor
裕仁 長田
知之 今田
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DIC Corp
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DIC Corp
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Publication of JPWO2022239597A5 publication Critical patent/JPWO2022239597A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023520934A 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂 Active JP7380951B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021082506 2021-05-14
JP2021082506 2021-05-14
PCT/JP2022/017764 WO2022239597A1 (ja) 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂

Publications (3)

Publication Number Publication Date
JPWO2022239597A1 JPWO2022239597A1 (ko) 2022-11-17
JPWO2022239597A5 JPWO2022239597A5 (ko) 2023-06-22
JP7380951B2 true JP7380951B2 (ja) 2023-11-15

Family

ID=84028213

Family Applications (1)

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JP2023520934A Active JP7380951B2 (ja) 2021-05-14 2022-04-14 フェノール性水酸基含有樹脂

Country Status (5)

Country Link
JP (1) JP7380951B2 (ko)
KR (1) KR20230156418A (ko)
CN (1) CN117321109A (ko)
TW (1) TW202244094A (ko)
WO (1) WO2022239597A1 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120264864A1 (en) 2009-10-20 2012-10-18 C.N.R.S. Modified polyamide composition containing at least one phenolic compound
WO2016185865A1 (ja) 2015-05-20 2016-11-24 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
WO2017029935A1 (ja) 2015-08-18 2017-02-23 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
JP2018532027A (ja) 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法
WO2020153048A1 (ja) 2019-01-21 2020-07-30 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2231860A (en) * 1937-09-27 1941-02-11 Monsanto Chemicals Phenol-butyraldehyde-formaldehyde resins
JP2559245B2 (ja) * 1987-10-14 1996-12-04 富士写真フイルム株式会社 ハロゲン化銀写真感光材料
FR2642078B1 (fr) * 1989-01-25 1992-08-28 Ceca Sa Resines formophenoliques de type novolaque resultant de la condensation de phenols et d'aldehydes lourds. leur preparation. leur application au renforcement du caoutchouc
FR2665165B1 (fr) * 1990-07-25 1995-02-24 Ceca Sa Nouvelles resines novolaques de para-alkylphenols. leur procede de preparation.
JP3710717B2 (ja) 2001-03-06 2005-10-26 東京応化工業株式会社 厚膜用ポジ型ホトレジスト組成物、ホトレジスト膜およびこれを用いたバンプ形成方法
US7074861B2 (en) * 2003-02-18 2006-07-11 Indspec Chemical Corporation Modified resorcinol resins and applications thereof
JP2008088197A (ja) 2006-09-29 2008-04-17 Sumitomo Bakelite Co Ltd フォトレジスト用フェノール樹脂とその製造方法、及びフォトレジスト用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120264864A1 (en) 2009-10-20 2012-10-18 C.N.R.S. Modified polyamide composition containing at least one phenolic compound
WO2016185865A1 (ja) 2015-05-20 2016-11-24 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
WO2017029935A1 (ja) 2015-08-18 2017-02-23 Dic株式会社 ノボラック型フェノール性水酸基含有樹脂及びレジスト膜
JP2018532027A (ja) 2015-10-29 2018-11-01 ヘキシオン・インコーポレイテッド 新規なアルキルフェノール樹脂及びこの調製方法
WO2020153048A1 (ja) 2019-01-21 2020-07-30 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Also Published As

Publication number Publication date
JPWO2022239597A1 (ko) 2022-11-17
WO2022239597A1 (ja) 2022-11-17
KR20230156418A (ko) 2023-11-14
TW202244094A (zh) 2022-11-16
CN117321109A (zh) 2023-12-29

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