JPWO2022230899A5 - - Google Patents
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- Publication number
- JPWO2022230899A5 JPWO2022230899A5 JP2023517573A JP2023517573A JPWO2022230899A5 JP WO2022230899 A5 JPWO2022230899 A5 JP WO2022230899A5 JP 2023517573 A JP2023517573 A JP 2023517573A JP 2023517573 A JP2023517573 A JP 2023517573A JP WO2022230899 A5 JPWO2022230899 A5 JP WO2022230899A5
- Authority
- JP
- Japan
- Prior art keywords
- filler
- manufacturing
- body according
- containing layer
- bonded body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 19
- 239000000945 filler Substances 0.000 claims 18
- 238000000034 method Methods 0.000 claims 16
- 239000011230 binding agent Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 239000011342 resin composition Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 125000005395 methacrylic acid group Chemical group 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021076040 | 2021-04-28 | ||
| PCT/JP2022/018934 WO2022230899A1 (ja) | 2021-04-28 | 2022-04-26 | 接合体の製造方法、半導体デバイスの製造方法、及び、樹脂組成物。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230899A1 JPWO2022230899A1 (https=) | 2022-11-03 |
| JPWO2022230899A5 true JPWO2022230899A5 (https=) | 2024-02-07 |
Family
ID=83848490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517573A Pending JPWO2022230899A1 (https=) | 2021-04-28 | 2022-04-26 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022230899A1 (https=) |
| KR (1) | KR102906195B1 (https=) |
| CN (1) | CN117203746A (https=) |
| TW (1) | TW202311406A (https=) |
| WO (1) | WO2022230899A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024219502A1 (https=) * | 2023-04-19 | 2024-10-24 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4337358B2 (ja) * | 2003-02-17 | 2009-09-30 | 日立化成工業株式会社 | 積層用中間配線部材、配線板及びそれらの製造方法 |
| JP4353845B2 (ja) * | 2004-03-31 | 2009-10-28 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4983181B2 (ja) * | 2006-09-26 | 2012-07-25 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4846633B2 (ja) * | 2007-03-20 | 2011-12-28 | 富士通株式会社 | 部品内蔵基板の製造方法 |
| JP5604937B2 (ja) * | 2010-03-31 | 2014-10-15 | 富士通株式会社 | 電子部品、電子機器及びそれらの製造方法 |
| KR102625368B1 (ko) * | 2016-04-05 | 2024-01-15 | 린텍 가부시키가이샤 | 삼차원 집적 적층 회로 제조용 시트 및 삼차원 집적 적층 회로의 제조 방법 |
| JP6796788B2 (ja) * | 2016-05-18 | 2020-12-09 | パナソニックＩｐマネジメント株式会社 | 封止用アクリル樹脂組成物、半導体装置及び半導体装置の製造方法 |
-
2022
- 2022-04-26 CN CN202280031212.9A patent/CN117203746A/zh active Pending
- 2022-04-26 JP JP2023517573A patent/JPWO2022230899A1/ja active Pending
- 2022-04-26 KR KR1020237036904A patent/KR102906195B1/ko active Active
- 2022-04-26 WO PCT/JP2022/018934 patent/WO2022230899A1/ja not_active Ceased
- 2022-04-27 TW TW111115992A patent/TW202311406A/zh unknown
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