JPWO2022209971A5 - - Google Patents

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Publication number
JPWO2022209971A5
JPWO2022209971A5 JP2022550831A JP2022550831A JPWO2022209971A5 JP WO2022209971 A5 JPWO2022209971 A5 JP WO2022209971A5 JP 2022550831 A JP2022550831 A JP 2022550831A JP 2022550831 A JP2022550831 A JP 2022550831A JP WO2022209971 A5 JPWO2022209971 A5 JP WO2022209971A5
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JP
Japan
Prior art keywords
resin
filled
composite
nitride sintered
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022550831A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022209971A1 (ru
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/012366 external-priority patent/WO2022209971A1/ja
Publication of JPWO2022209971A1 publication Critical patent/JPWO2022209971A1/ja
Publication of JPWO2022209971A5 publication Critical patent/JPWO2022209971A5/ja
Pending legal-status Critical Current

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JP2022550831A 2021-03-31 2022-03-17 Pending JPWO2022209971A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021059225 2021-03-31
PCT/JP2022/012366 WO2022209971A1 (ja) 2021-03-31 2022-03-17 複合体及びその製造方法、並びに、積層体及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022209971A1 JPWO2022209971A1 (ru) 2022-10-06
JPWO2022209971A5 true JPWO2022209971A5 (ru) 2023-03-01

Family

ID=83459117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022550831A Pending JPWO2022209971A1 (ru) 2021-03-31 2022-03-17

Country Status (2)

Country Link
JP (1) JPWO2022209971A1 (ru)
WO (1) WO2022209971A1 (ru)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023162705A1 (ja) * 2022-02-28 2023-08-31 デンカ株式会社 複合シート、及び積層体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634435B2 (ja) * 1985-11-27 1994-05-02 イビデン株式会社 電子回路用多層基板
EP3035778B1 (en) * 2013-08-14 2018-10-03 Denka Company Limited Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
WO2021251020A1 (ja) * 2020-06-10 2021-12-16 東亞合成株式会社 セラミックス／樹脂複合材料、その製造方法及びその利用

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